IP Library Granted Patent US 7,626,863
Granted Patent B2
US 7,626,863 · App. 11/707,343 · Granted Dec 1, 2009

Flash memory array system including a top gate memory cell

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Quick Facts
Patent No.
US 7,626,863
App. No.
11/707,343
Granted
Dec 1, 2009
Kind
B2
Abstract

A memory system includes memory cells arranged in sectors. A decoder corresponding to a sector disables memory cells having a defective top gate. The decoder may include a low voltage or high voltage latch for the disabling. A top gate handling algorithm is included. The memory system may include dynamic top gate coupling. A programming algorithm and waveforms with top gate handling is included.

Claims (39)

1. A memory system comprising:

a plurality of memory cells arranged in sectors,

wherein top gates of memory cells in a sector are configured to program the memory cells and are coupled to a first line,

wherein source lines of memory cells in the sector are coupled to a second line, and

wherein each memory cell includes:

a floating gate positioned for electrical coupling with a top gate of the top gates configured to program the memory cells,

wherein each floating gate has a tip adjacent to the top gate for erasing the floating gate through the tip to the top gate.

2. The memory system of claim 1 wherein the memory cells are multilevel memory cells.

3. The memory system of claim 2 wherein the memory cells are tip erased memory cells.

4. The memory system of claim 2 wherein the memory cells are source side injection memory cells.

5. The memory system of claim 1 wherein the memory cells are tip erased memory cells.

6. The memory system of claim 1 wherein the memory cells are source side injection memory cells.

7. The memory system of claim 6 , wherein each memory cell further comprising:

a select gate,

wherein said floating gate having the tip adjacent to said select gate for erasing said floating gate through said tip to said select gate.

8. The memory system of claim 1 , wherein each memory cell further comprising:

a select gate,

wherein said floating gate having the tip adjacent to said select gate for erasing said floating gate through said tip to said select gate.

9. The memory system of claim 1 further comprising a logic circuit configured to disable a memory cell in response to a defective top gate.

10. The memory system of claim 1 further comprising a transistor coupled to a top gate line and configured to be set in a state wherein the top gate line floats such that the top gate line voltage follows a word line voltage.

11. The memory system of claim 10 , further comprising a logic circuit configured to disable a memory cell in response to a defective top gate.

12. A memory system comprising:

a plurality of memory cells arranged in sectors,

wherein source lines of memory cells in a sector being coupled to a first line, and

top gate lines of memory cells in said sector are configured to program the memory cells and are coupled to individual lines,

wherein each memory cell includes:

a floating gate positioned for electrical coupling with a top gate of the top gates lines configured to program the memory cells,

wherein each floating gate has a tip adjacent to the top gate for erasing the floating gate through the tip to the top gate.

13. The memory system of claim 12 wherein the memory cells are multilevel memory cells.

14. The memory system of claim 12 further comprising:

a plurality of word lines coupled to at least one other individual line.

15. The memory system of claim 12 wherein the memory cells are tip erased memory cells.

16. The memory system of claim 12 wherein the memory cells are source side injection memory cells.

17. The memory system of claim 12 , wherein each memory cell further comprising:

a select gate,

wherein said floating gate having the tip adjacent to said select gate for erasing said floating gate through said tip to said select gate.

18. The memory system of claim 12 further comprising a—logic circuit that disables a memory cell in response to a defective top gate.

19. The memory system of claim 12 wherein a top gate line is floating.

20. The memory system of claim 12 further comprising a transistor coupled to a top gate line and configured to be set in a state wherein the top gate line floats such that the top gate line voltage follows a word line voltage.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2009
From: TRAN, HIEU VAN; NGUYEN, HUNG QUOC; LY, ANH; HSUEH, SHENG; NGUYEN, SANG T.; HOANG, LOC; CHOI, STEVE; VU, THUAN T.
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 023354/0927 →