Integrated circuit package in package system with adhesiveless package attach

1. A method for manufacturing an integrated circuit package in package system comprising:

providing a package in package lead with a package in package lead surface substantially planar;

attaching a first integrated circuit package having a first package lead and a first encapsulant having a first encapsulant surface substantially coplanar with the package in package lead surface, the first package lead protruding from the first encapsulant;

attaching a second integrated circuit near the first integrated circuit package; and

forming a package in package encapsulant over the first integrated circuit package and the second integrated circuit, a side of the package in package lead opposite the package in package lead surface exposed from the package in package encapsulant.

2. The method as claimed in claim 1 wherein attaching the first integrated circuit package includes electrically connecting the first integrated circuit package to the package in package lead.

3. The method as claimed in claim 1 wherein attaching the second integrated circuit includes attaching the second integrated circuit over the first integrated circuit package.

4. The method as claimed in claim 1 wherein attaching the second integrated circuit includes attaching the second integrated circuit adjacent the first integrated circuit package.

5. The method as claimed in claim 1 wherein attaching the second integrated circuit includes attaching a second integrated circuit package having the second integrated circuit adjacent the first integrated circuit package.

6. A method for manufacturing an integrated circuit package in package system comprising:

forming a package in package lead having a package in package lead surface substantially planar to another package in package lead;

mounting a first integrated circuit package having a first package lead and a first encapsulant having a first encapsulant surface substantially coplanar with the package in package lead surface and another package in package lead surface, the first package lead protruding from the first encapsulant;

connecting a second integrated circuit to the first integrated circuit package with a second connector; and

applying a package in package encapsulant over the first integrated circuit package and the second integrated circuit, the package in package encapsulant having a plane of a package in package mounting surface substantially coplanar with the first encapsulant surface and the package in package lead surface, and a side of the package in package lead opposite the package in package lead surface exposed from the package in package encapsulant.

7. The method as claimed in claim 6 wherein connecting the second integrated circuit includes connecting the second integrated circuit having a second integrated circuit mounting surface substantially coplanar to the package in package mounting surface.

8. The method as claimed in claim 6 wherein connecting the second integrated circuit includes connecting the second integrated circuit over a die concealer adjacent the first integrated circuit package.

9. The method as claimed in claim 6 wherein forming the package in package lead includes forming the package in package lead in a shape of a J-bend lead.

10. The method as claimed in claim 6 wherein forming the package in package lead includes forming the package in package lead in a shape of a stackable lead having a top terminal and a bottom terminal.

11. An integrated circuit package in package system comprising:

a package in package lead with a package in package lead surface substantially planar;

a first integrated circuit package having a first package lead and a first encapsulant having a first encapsulant surface substantially coplanar with the package in package lead surface, the first package lead protruding from the first encapsulant;

a second integrated circuit near the first integrated circuit package; and

a package in package encapsulant over the first integrated circuit package and the second integrated circuit, a side of the package in package lead opposite the package in package lead surface exposed from the package in package encapsulant.

12. The system as claimed in claim 11 wherein the first integrated circuit package includes the first integrated circuit package electrically connected to the package in package lead.

13. The system as claimed in claim 11 wherein the second integrated circuit includes the second integrated circuit over the first integrated circuit package.

14. The system as claimed in claim 11 wherein the second integrated circuit includes the second integrated circuit adjacent the first integrated circuit package.

15. The system as claimed in claim 11 wherein the second integrated circuit includes a second integrated circuit package having the second integrated circuit adjacent the first integrated circuit package.

16. The system as claimed in claim 11 wherein:

the package in package lead with the package in package lead surface is substantially planar to another package in package lead;

the first integrated circuit package having a first encapsulant surface substantially coplanar with the package in package lead surface and another package in package lead surface;

the second integrated circuit is connected to the first integrated circuit package with a second connector; and

the package in package encapsulant is over the first integrated circuit package and the second integrated circuit, the package in package encapsulant having a plane of a package in package mounting surface substantially coplanar with the first encapsulant surface and the package in package lead surface.

17. The system as claimed in claim 16 wherein the second integrated circuit includes the second integrated circuit having a second integrated circuit mounting surface substantially coplanar to the package in package mounting surface.

18. The system as claimed in claim 16 wherein the second integrated circuit includes the second integrated circuit over a die concealer adjacent the first integrated circuit package.

19. The system as claimed in claim 16 wherein the package in package lead is in a shape of a J-bend lead.

20. The system as claimed in claim 16 wherein the package in package lead is in a shape of a stackable lead having a top terminal and a bottom terminal.