IP Library Granted Patent US 7,784,693
Granted Patent B2
US 7,784,693 · App. 11/797,159 · Granted Aug 31, 2010

Assembly of SIM card and RFID antenna

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Quick Facts
Patent No.
US 7,784,693
App. No.
11/797,159
Granted
Aug 31, 2010
Kind
B2
Abstract

A subscriber identity module (SIM) card includes: a printed circuit board; a circuit provided on the printed circuit board and capable of executing SIM and RFID functions; a set of circuit contacts provided on the printed circuit board, electrically connected to the circuit via conductive paths, and conforming to a SIM specification; a set of antenna contacts provided on the printed circuit board and electrically connected to the circuit via conductive paths; and a protective plate fixed to the printed circuit board and conforming to standard dimensions of the SIM card. An assembly of the SIM card and a RFID antenna is also disclosed.

Claims (33)

1. A subscriber identity module (SIM) card comprising:

a printed circuit board, having a first surface and a second surface opposite to said first surface;

a circuit provided on said printed circuit board and capable of executing SIM and radio frequency identification (RFID) functions, said circuit provided on one of said first and second surfaces of said printed circuit board;

a set of circuit contacts provided on said printed circuit board, electrically connected to said circuit via conductive paths, and conforming to a SIM specification, said circuit contacts being provided on the other one of said first and second surfaces of said printed circuit board; and

a set of antenna contacts provided on said printed circuit board and electrically connected to said circuit via conductive paths, said antenna contacts being provided on said one of said first and second surfaces of said printed circuit board.

2. The SIM card as claimed in claim 1 , wherein said circuit is an integrated circuit that includes a subscriber identity module and a RFID module, each of said subscriber identity module and said RFID module being implemented as one of an independent chip and a function module within a chip.

3. The SIM card as claimed in claim 2 , further comprising

a capacitor connected to said antenna contacts.

4. The SIM card as claimed in claim 3 , wherein said circuit and said antenna contacts are provided on said first surface of said printed circuit board, said circuit contacts being provided on said second surface of said printed circuit board, said printed circuit board further having a plurality of contact pads provided on said first surface, each of said conductive paths connecting a respective one of said contact pads to a respective one of said circuit contacts and said antenna contacts, said subscriber identity module and said RFID module being electrically connected to corresponding ones of said contact pads.

5. The SIM card as claimed in claim 4 , further comprising a protective plate fixed to said first surface of said printed circuit board to cover said circuit while exposing said antenna contacts.

6. The SIM card as claimed in claim 5 , wherein said protective plate has dimensions conforming to standard dimensions of a SIM card.

7. The SIM card as claimed in claim 5 , wherein said protective plate has dimensions larger than those of said printed circuit board, said protective plate being configured with a protective region corresponding to said printed circuit board in dimensions and to be disposed above said printed circuit board, said protective plate being formed with a tear line surrounding said protective region.

8. The SIM card as claimed in claim 7 , wherein said protective plate includes a first plate body, a second plate body and a third plate body arranged in a stack, said tear line being formed in said first and second plate bodies to surround said protective region, said first and second plate bodies being further formed with aligned access holes for exposing said antenna contacts, said second plate body being further formed with a chip receiving space for receiving said circuit, said third plate body being formed with a board receiving hole for receiving said printed circuit board.

9. The SIM card as claimed in claim 8 , wherein said protective plate is made of a plastic material.

10. The SIM card as claimed in claim 9 , wherein the plastic material is polyethylene terephthalate.

11. The SIM card as claimed in claim 1 , comprising eight of said circuit contacts and two of said antenna contacts.

12. The SIM card as claimed in claim 11 , wherein two of said circuit contacts are adapted for electrical connection to a USB port.

13. An assembly of a subscriber identity module (SIM) card and a radio frequency identification (RFID) antenna, comprising:

a SIM card including

a printed circuit board having a first surface and a second surface opposite to said first surface,

a circuit provided on said printed circuit board and capable of executing SIM and RFID functions, said circuit being provided on one of said first and second surfaces of said printed circuit board,

a set of circuit contacts provided on said printed circuit board, electrically connected to said circuit via conductive paths, and conforming to a SIM specification, said circuit contacts being provided on the other one of said first and second surfaces of said printed circuit board, and

a set of antenna contacts provided on said printed circuit board and electrically connected to said circuit via conductive paths, said antenna contacts provided on said one of said first and second surfaces of said printed circuit board; and

a RFID antenna electrically connected to said antenna contacts on said printed circuit board.

14. The assembly as claimed in claim 13 , wherein said RFID antenna includes a flexible printed circuit board.

15. The assembly as claimed in claim 13 , further comprising solder material for fixing said RFID antenna to said antenna contacts.

16. The assembly as claimed in claim 13 , further comprising conductive paste for fixing said RFID antenna to said antenna contacts.

17. The assembly as claimed in claim 13 , wherein said circuit is an integrated circuit.

18. The assembly as claimed in claim 17 , wherein said integrated circuit includes a subscriber identity chip and a RFID chip.

19. The assembly as claimed in claim 18 , wherein said circuit and said antenna contacts are provided on said first surface of said printed circuit board, said circuit contacts being provided on said second surface of said printed circuit board, said printed circuit board further having a plurality of contact pads provided on said first surface, each of said conductive paths connecting a respective one of said contact pads to a respective one of said circuit contacts and said antenna contacts, said subscriber identity chip and said RFID chip being electrically connected to corresponding ones of said contact pads.

20. The assembly as claimed in claim 19 , further comprising a protective plate fixed to said first surface of said printed circuit board to cover said circuit while exposing said antenna contacts.

21. The assembly as claimed in claim 20 , wherein said protective plate is made of a plastic material.

22. The assembly as claimed in claim 13 , wherein said SIM card includes eight of said circuit contacts and two of said antenna contacts.

Assignments (15)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2025
From: MICROCHIP TECHNOLOGY INC.; MICROCHIP TECHNOLOGY IRELAND LIMITED; MICROSEMI CORPORATION; ATMEL CORPORATION; SILICON STORAGE TECHNOLOGY, INC.; MICROSEMI FREQUENCY AND TIME CORP.; MICROSEMI SEMICONDUCTOR ULC; MICROCHIP TECHNOLOGY GERMANY GMBH
To: CRESTONE IP MANAGEMENT, LLC
Reel/Frame 071991/0419 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →