IP Library Granted Patent US 7,813,157
Granted Patent B2
US 7,813,157 · App. 11/926,778 · Granted Oct 12, 2010

Non-linear conductor memory

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Quick Facts
Patent No.
US 7,813,157
App. No.
11/926,778
Granted
Oct 12, 2010
Kind
B2
Abstract

A high-speed, low-power memory device comprises an array of non-linear conductors wherein the storage, address decoding, and output detection are all accomplished with diodes or other non-linear conductors. In various embodiments, the row and column resistors are switchable between a high resistance when connected to a row or column that is non-selected, and a low resistance when connected to the selected row and column.

Claims (48)

1. An electronic memory device comprising:

a. information circuitry for storing and facilitating retrieval of information comprising:

i. a first plurality of generally parallel conductors,

ii. a second plurality of generally parallel conductors overlapping the first plurality of generally parallel conductors,

iii. a plurality of storage locations each disposed proximate to a point of overlap between the first and second pluralities of generally parallel conductors, and

iv. a plurality of nonlinear conductive devices each disposed at a storage location;

b. a plurality of row switches each connected to one of the first plurality of generally parallel conductors;

c. a plurality of column switches each connected to one of the second plurality of generally parallel conductors; and

d. selection circuitry for selecting one of the plurality of row switches and one of the plurality of column switches in order to read from or write to the information circuitry,

wherein the selection circuitry for selecting one of the plurality of row switches comprises circuitry, which comprises a first array of nonlinear conductive elements connected to the plurality of row switches, for increasing the impedance of the non-selected row switches relative to the impedance of the selected row switch.

2. The electronic memory device of claim 1 , wherein each nonlinear conductive element in the first array comprises a diode.

3. The electronic memory device of claim 1 , wherein the selection circuitry for selecting one of the plurality of column switches comprises circuitry for causing the impedance of the non-selected column switches to be greater than the impedance of the selected column switch.

4. The electronic memory device of claim 3 , wherein the circuitry for increasing the impedance of the non-selected column switches relative to the impedance of the selected column switch comprises a second array of nonlinear conductive elements connected to the plurality of column switches.

5. The electronic memory device of claim 4 , wherein each nonlinear conductive element in the second array comprises a diode.

6. The electronic memory device of claim 1 , wherein each of the plurality of row switches comprises an enhancement-mode transistor, an enhancement-mode NMOS transistor, a depletion-mode transistor, a PMOS transistor, or a bipolar transistor.

7. The electronic memory device of claim 6 , wherein each of the plurality of row switches consists essentially of an enhancement-mode transistor, an enhancement-mode NMOS transistor, a depletion-mode transistor, a PMOS transistor, or a bipolar transistor.

8. The electronic memory device of claim 1 , wherein each of the plurality of column switches comprises an enhancement-mode transistor, an enhancement-mode NMOS transistor, a depletion-mode transistor, a PMOS transistor, or a bipolar transistor.

9. The electronic memory device of claim 8 , wherein each of the plurality of column switches consists essentially of an enhancement-mode transistor, an enhancement-mode NMOS transistor, a depletion-mode transistor, a PMOS transistor, or a bipolar transistor.

10. The electronic memory device of claim 1 , wherein at least one of the plurality of nonlinear conductive devices is connected to the first and second pluralities of generally parallel conductors at approximately a point of overlap thereof.

11. The electronic memory device of claim 1 , wherein each of the plurality of nonlinear conductive devices comprises at least one of a diode, a fuse, an antifuse, a phase-change material, a resistance-change material, or a chalcogenide material.

12. An electronic memory device comprising:

a. information circuitry for storing and facilitating retrieval of information comprising:

i. a first plurality of generally parallel conductors,

ii. a second plurality of generally parallel conductors overlapping the first plurality of generally parallel conductors,

iii. a plurality of storage locations each disposed proximate to a point of overlap between the first and second pluralities of generally parallel conductors, and

iv. a plurality of nonlinear conductive devices each disposed at a storage location;

b. a plurality of row switches each connected to one of the first plurality of generally parallel conductors;

c. a plurality of column switches each connected to one of the second plurality of generally parallel conductors;

d. selection circuitry for selecting one of the plurality of row switches and one of the plurality of column switches in order to read from or write to the information circuitry;

e. row decoder circuitry disposed between the plurality of row switches and the first plurality of generally parallel conductors; and

f. column decoder circuitry disposed between the plurality of column switches and the second plurality of generally parallel conductors.

13. The electronic memory device of claim 12 , wherein the row decoder circuitry comprises a third array of nonlinear conductive elements.

14. The electronic memory device of claim 13 , wherein each of the third array of nonlinear conductive elements comprises a diode.

15. The electronic memory device of claim 12 , wherein the column decoder circuitry comprises a fourth array of nonlinear conductive elements.

16. The electronic memory device of claim 15 , wherein each of the fourth array of nonlinear conductive elements comprises a diode.

17. The electronic memory device of claim 1 , wherein at least one of the plurality of row switches or at least one of the plurality of column switches comprises a transistor.

18. The electronic memory device of claim 17 , wherein the transistor is selected from the group consisting of BJT, JFET, MOSFET, FET, TFT, SCR, UJT, triac, vacuum tube, gated field emitter, and MEMS switching devices.

19. A method comprising the steps of:

providing an electronic memory device comprising a grid of memory locations and selection circuitry therefor, the grid comprising a plurality of rows and row switches associated therewith, and a plurality of columns and column switches associated therewith;

applying a pre-charge voltage to the plurality of row switches and the plurality of column switches;

selecting one of the plurality of row switches by discharging the pre-charge voltage on all but the selected row switch;

selecting one of the plurality of column switches by discharging the pre-charge voltage on all but the selected column switch;

applying a row voltage to the plurality of row switches, thereby increasing a voltage on a selected row connected to the selected row switch; and

applying a column voltage to the plurality of column switches, thereby decreasing a voltage on a selected column connected to the selected column switch.

20. The method of claim 19 , wherein a nonlinear conductive device is disposed at the memory location proximate the intersection of the selected row and the selected column, and the step of applying the row voltage and column voltage changes a state of the nonlinear conductive device.

21. The method of claim 19 , wherein a nonlinear conductive device is disposed at the memory location proximate the intersection of the selected row and the selected column, and the step of applying the row voltage and column voltage outputs a state of the nonlinear conductive device.

22. The electronic memory device of claim 1 , wherein the plurality of storage locations is disposed in a first layer and each of the pluralities of row and column switches are disposed in a layer different from the first layer.

23. The electronic memory device of claim 1 , wherein the plurality of row switches, the plurality of column switches, and the plurality of storage locations are disposed in a three-dimensional configuration.

Assignments (20)
SECURITY AGREEMENT (SUPPLEMENTAL) Recorded Nov 14, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 069411/0208 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2024
From: SANDISK TECHNOLOGIES, INC.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 069168/0273 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
RELEASE OF SECURITY INTEREST AT REEL 039389 FRAME 0684 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0535 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2018
From: HGST, INC.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 046939/0587 →
RELEASE OF SECURITY INTEREST Recorded Aug 16, 2016
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: HGST, INC.
Reel/Frame 039689/0950 →
SECURITY AGREEMENT Recorded Jul 19, 2016
From: HGST, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 039389/0684 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME AND ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 035748 FRAME 0909. ASSIGNOR(S) HEREBY CONFIRMS THE NAME AND ADDRESS OF THE ASSIGNEE SI HGST, INC.,3403 YERBA BUENA ROAD,SAN JOSE, CA 95135. Recorded Jun 2, 2015
From: CONTOUR SEMICONDUCTOR, INC.
To: HGST, INC.
Reel/Frame 035831/0594 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2015
From: CONTOUR SEMICONDUCTOR, INC.
To: HGST NETHERLANDS B.V.
Reel/Frame 035748/0909 →
RELEASE OF SECURITY INTEREST Recorded May 20, 2015
From: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.; PERRIN, DONALD; RUNNING DEER FOUNDATION; RUNNING DEER TRUST
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 035749/0956 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2015
From: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.; PERRIN, DONALD; RUNNING DEER FOUNDATION; RUNNING DEER TRUST
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 035685/0571 →
RELEASE OF SECURITY INTEREST Recorded Jun 24, 2014
From: AMERICAN CAPITAL, LTD.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 033225/0330 →
SECURITY INTEREST Recorded Jun 20, 2014
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.; PERRIN, DONALD; RUNNING DEER FOUNDATION; RUNNING DEER TRUST
Reel/Frame 033204/0428 →
SECURITY INTEREST Recorded May 30, 2014
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.
Reel/Frame 033063/0617 →
SECURITY AGREEMENT Recorded Jan 18, 2013
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; RUNNING DEER TRUST; RUNNING DEER FOUNDATION; SARAH G. KURZON 2001 REVOCABLE TRUST; PERRIN, DONALD
Reel/Frame 029659/0615 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2007
From: SHEPARD, DANIEL R.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 020067/0022 →