Integrated circuit package system with offset stacked die and method of manufacture thereof

1. An integrated circuit package system comprising:

a first integrated circuit die having an interconnect proximal side;

a second integrated circuit die over the first integrated circuit die, the second integrated circuit die having an interconnect distal side and an interconnect proximal side offset in a first direction from the interconnect proximal side of the first integrated circuit die;

an interdie layer over the second integrated circuit die;

a third integrated circuit die over the interdie layer, the third integrated circuit die having an interconnect proximal side aligned with the interconnect distal side of the second integrated circuit die, and the interdie layer is recessed from the interconnect proximal side of the second integrated circuit die and the interconnect proximal side of the third integrated circuit die;

a fourth integrated circuit die over the third integrated circuit die, the fourth integrated circuit die having an interconnect proximal side offset in a second direction from the interconnect proximal side of the third integrated circuit die with the second direction opposite to the first direction, wherein the first, second, third, and fourth integrated circuit dies are a same size;

a lower interconnect connected to an upper surface near the interconnect proximal side of the first integrated circuit die and an upper surface near the interconnect proximal side of the second integrated circuit die;

an upper interconnect connected to an upper surface near the interconnect proximal side of the third integrated circuit die and an upper surface near the interconnect proximal side of the fourth integrated circuit die; and

a single package encapsulant in direct contact with the first integrated circuit die, the second integrated circuit die, the third integrated circuit die, the fourth integrated circuit die, and the interdie layer.

2. The system as claimed in claim 1 wherein:

the second integrated circuit die having the interconnect proximal side of the second integrated circuit die offset in a first direction is offset a first distance; and

the fourth integrated circuit die having the interconnect proximal side offset in a second direction is offset a second distance and the second distance is the same as the first distance.

3. The system as claimed in claim 1 wherein the lower interconnect has a loop height higher than a height of the second integrated circuit die.

4. The system as claimed in claim 1 wherein:

the single package encapsulant encapsulates the first, second, third, and fourth integrated circuit dies.

5. The system as claimed in claim 1 wherein the lower interconnect is partially within the interdie layer.

6. The system as claimed in claim 1 wherein the first, second, third, and fourth integrated circuit dies have active surfaces facing in a same direction.

7. The system as claimed in claim 6 further comprising a lower die stack having at least three dies including the first integrated circuit die and the second integrated circuit die.

8. The system as claimed in claim 6 further comprising:

a substrate having the first integrated circuit die attached thereto; and

wherein:

the lower interconnect connects the substrate to the first integrated circuit die.

9. The system as claimed in claim 6 wherein the interdie layer includes planar dimensions less than planar dimensions of the second integrated circuit die.

10. The system as claimed in claim 6 wherein the interdie layer includes the lower interconnect embedded partially within the interdie layer.

11. A method of manufacturing an integrated circuit package system comprising:

providing a first integrated circuit die having an interconnect proximal side;

attaching a second integrated circuit die over the first integrated circuit die, the second integrated circuit die having an interconnect distal side and an interconnect proximal side offset in a first direction from the interconnect proximal side of the first integrated circuit die;

forming an interdie layer over the second integrated circuit die;

attaching a third integrated circuit die over the interdie layer, the third integrated circuit die having an interconnect proximal side aligned with the interconnect distal side of the second integrated circuit die, and the interdie layer is recessed from the interconnect proximal side of the second integrated circuit die and the interconnect proximal side of the third integrated circuit die;

attaching a fourth integrated circuit die over the third integrated circuit die, the fourth integrated circuit die having an interconnect proximal side offset in a second direction from the interconnect proximal side of the third integrated circuit die with the second direction opposite from the first direction wherein the first, second, third, and fourth integrated circuit dies are a same size and have active surfaces facing in a same direction;

connecting a lower interconnect to an upper surface near the interconnect proximal side of the first integrated circuit die and an upper surface near the interconnect proximal side of the second integrated circuit die;

connecting an upper interconnect to an upper surface near the interconnect proximal side of the third integrated circuit die and an upper surface near the interconnect proximal side of the fourth integrated circuit die; and

forming a single package encapsulant in direct contact with the first integrated circuit die, the second integrated circuit die, the third integrated circuit die, the fourth integrated circuit die, and the interdie layer.

12. The method as claimed in claim 11 wherein:

attaching the second integrated circuit die includes attaching the second integrated circuit die offset a first distance; and

attaching the fourth integrated circuit die includes attaching the fourth integrated circuit die offset a second distance and the second distance is the same as the first distance.

13. The method as claimed in claim 11 wherein connecting the lower interconnect includes connecting the lower interconnect having a loop height higher than a height of the second integrated circuit die.

14. The method as claimed in claim 11 wherein:

forming the single package encapsulant includes encapsulating the first, second, third, and fourth integrated circuit dies.

15. The method as claimed in claim 11 wherein connecting the lower interconnect includes connecting the lower interconnect partially within the interdie layer.

16. The method as claimed in claim 11 further comprising forming a lower die stack having at least three dies including the first integrated circuit die and the second integrated circuit die.

17. The method as claimed in claim 11 further comprising:

attaching the first integrated circuit die to a substrate; and

wherein:

connecting the lower interconnect includes connecting the lower interconnect to the substrate from the first integrated circuit die.

18. The method as claimed in claim 11 wherein forming the interdie layer includes forming the interdie layer having planar dimensions less than planar dimensions of the second integrated circuit die.

19. The method as claimed in claim 11 wherein forming the interdie layer includes embedding the lower interconnect partially within the interdie layer.