Stackable integrated circuit package system with multiple interconnect interface

1. A method of manufacture of a stackable integrated circuit package system comprising:

forming a first integrated circuit die having a small interconnect and a large interconnect provided thereon;

forming an external interconnect, having an upper tip and a lower tip each of substantially similar thickness and both including an exposed surface, from a lead frame;

mounting the first integrated circuit die on the external interconnect with the small interconnect on the lower tip and below the upper tip;

encapsulating with a first mold compound around the small interconnect and around the large interconnect with an exposed surface; and

processing the first mold compound and the first integrated circuit die to include a first mold compound sidewall coplanar with a first integrated circuit die sidewall; and

forming a step-shaped recess along a boundary of the first mold compound adjacent the first mold compound sidewall.

2. The method as claimed in claim 1 further comprising:

encapsulating the integrated circuit die and the external interconnect in a second mold compound.

3. The method as claimed in claim 1 further comprising:

encapsulating the integrated circuit die and the external interconnect in a second mold compound with both the upper tip and the lower tip including an exposed surface.

4. The method as claimed in claim 1 further comprising:

providing an additional integrated circuit die or integrated circuit package connected to the external interconnect, the large interconnect, the first integrated circuit die, or a combination thereof.

5. The method as claimed in claim 1 wherein forming the first integrated circuit die includes forming large interconnects with a distribution in a configuration of an array distribution, a peripheral distribution, a partially depopulated distribution, a multiple pitch distribution, or a combination thereof.

6. A method of manufacture of a stackable integrated circuit package system comprising:

forming a first integrated circuit die having a small interconnect and a large interconnect provided thereon;

forming a lead, having an upper tip and a lower tip each of substantially similar thickness and both including an exposed surface, from a padless lead frame;

mounting the first integrated circuit die on the lead with the small interconnect on the lower tip and below the upper tip; and

encapsulating with a first mold compound around the small interconnect and the large interconnect with an exposed surface; and

processing the first mold compound and the first integrated circuit die to include a first mold compound sidewall coplanar with a first integrated circuit die sidewall; and

forming a step-shaped recess along a boundary of the first mold compound adjacent the first mold compound sidewall.

7. The method as claimed in claim 6 further comprising:

encapsulating the integrated circuit die and the lead in a further encapsulant; and

exposing a non-active side of the integrated circuit die.

8. The method as claimed in claim 6 further comprising:

attaching a second integrated circuit die to the stackable integrated circuit package system; and

encapsulating the second integrated circuit die.

9. The method as claimed in claim 6 further comprising:

attaching a first integrated circuit package to the stackable integrated circuit package system.

10. The method as claimed in claim 6 further comprising:

attaching another stackable integrated circuit package system to the stackable integrated circuit package system; and

attaching a second integrated circuit package on the another stackable integrated circuit package system.

11. A stackable integrated circuit package system comprising:

a first integrated circuit die having a small interconnect and a large interconnect provided thereon;

an external interconnect, having an upper tip and a lower tip each of substantially similar thickness and both including an exposed surface, electrically connected to the first integrated circuit die with the small interconnect on the lower tip and below the upper tip; and

a first mold compound surrounding the small interconnect and the large interconnect with an exposed surface, the first mold compound including a step-shaped recess along a boundary of the first mold compound adjacent a first mold compound sidewall, the first mold compound sidewall coplanar with a first integrated circuit die sidewall.

12. The system as claimed in claim 11 further comprising:

a second mold compound to surround the first integrated circuit die and the external interconnect.

13. The system as claimed in claim 11 further comprising:

a second mold compound to cover the first integrated circuit die and the external interconnect with both the upper tip and the lower tip including an exposed surface.

14. The system as claimed in claim 11 further comprising:

an additional integrated circuit die or integrated circuit package connected to the external interconnect, the large interconnect, the first integrated circuit die, or a combination thereof.

15. The system as claimed in claim 11 wherein the first integrated circuit die having large interconnects provided thereon with a distribution in a configuration of an array distribution, a peripheral distribution, a partially depopulated distribution, a multiple pitch distribution, or a combination thereof.

16. The system as claimed in claim 11 wherein:

the first integrated circuit die is a flip chip;

the external interconnect, having the upper tip and the lower tip, is a lead;

the first integrated circuit die on the external interconnect with the small interconnect on the lower tip and below the upper tip has an active side; and

the first mold compound to surround the small interconnect and the large interconnect with the exposed surface is an epoxy mold compound.

17. The system as claimed in claim 16 further comprising:

a second mold compound to surround the first integrated circuit die and the lead; and

a non-active side of the first integrated circuit die exposed.

18. The system as claimed in claim 16 further comprising:

a second integrated circuit die on the stackable integrated circuit package system; and

a mold compound to cover the second integrated circuit die.

19. The system as claimed in claim 16 further comprising a first integrated circuit package on the stackable integrated circuit package system.

20. The system as claimed in claim 16 further comprising:

another stackable integrated circuit package system on the stackable integrated circuit package system; and

a second integrated circuit package on the another stackable integrated circuit package system.