IP Library Granted Patent US 7,977,628
Granted Patent B2
US 7,977,628 · App. 12/146,122 · Granted Jul 12, 2011

System and method for reducing particles and contamination by matching beam complementary aperture shapes to beam shapes

Assignee: Axcelis Technologies, Inc.
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Quick Facts
Patent No.
US 7,977,628
App. No.
12/146,122
Granted
Jul 12, 2011
Kind
B2
Abstract

An ion implantation system comprising an ion source configured to generate an ion beam along a beam path, a mass analyzer is located downstream of the ion source wherein the mass analyzer is configured to perform mass analysis of the ion beam and a beam complementary aperture located downstream of the mass analyzer and along the beam path, the beam complementary aperture having a size and shape corresponding to a cross-sectional beam envelope of the ion beam.

Claims (12)

1. An ion implantation system comprising:

an ion source configured to generate an ion beam having a first cross-sectional shape along a beam path;

a mass analyzer positioned downstream of the ion source along the beam path, wherein the mass analyzer is configured to mass analyze the ion beam, and wherein the mass analyzer is further configured to produce aberrations within the ion beam, therein defining a second cross-sectional shape of an emittance ion beam emitted from the mass analyzer; and

a beam complementary aperture positioned downstream of the mass analyzer along the beam path, wherein the beam complementary aperture has a shape corresponding to the second cross-sectional shape of the emittance ion beam,

wherein the second cross-sectional shape is generally banana-shaped.

2. The ion implantation system of claim 1 , further comprising a resolving aperture positioned upstream of the beam complementary aperture.

3. The ion implantation system of claim 1 , further comprising a plasma electron flood assembly, wherein the beam complementary aperture is positioned within the plasma electron flood assembly.

4. A method of reducing contamination associated with an implantation of ions into a workpiece, the method comprising:

forming an ion beam having a first cross-sectional shape along a beam path; mass analyzing the ion beam, therein producing aberrations within the ion beam;

measuring a second cross-sectional shape of an emittance ion beam emitted from the mass analyzer; and

positioning a beam complementary aperture along the beam path downstream of the mass analyzer, wherein the beam complementary aperture has a shape corresponding to the second cross-sectional shape of the emittance ion beam;

wherein the second cross-sectional shape is generally banana-shaped.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Apr 7, 2023
From: SILICON VALLEY BANK A DIVISION OF FIRST-CITIZENS BANK & TRUST COMPANY
To: AXCELIS TECHNOLOGIES, INC.
Reel/Frame 063270/0277 →
SECURITY INTEREST Recorded Jul 31, 2020
From: AXCELIS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 053375/0055 →
FIRST AMENDMENT TO SECURITY AGREEMENT Recorded May 10, 2011
From: AXCELIS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 026250/0524 →
SECURITY AGREEMENT Recorded Apr 8, 2010
From: AXCELIS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 024202/0494 →
CONSENT AND LICENSE AGREEMENT Recorded Apr 17, 2009
From: AXCELIS TECHNOLOGIES, INC.
To: SEN CORPORATION
Reel/Frame 022562/0758 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2008
From: GRANT, JOHN FRANCIS; SPLINTER, PATRICK RICHARD
To: AXCELIS TECHNOLOGIES, INC.
Reel/Frame 021151/0918 →
Continuity (1)
Related Publication 20090321632A1 · Dec 31, 2009