IP Library Granted Patent US 7,729,150
Granted Patent B2
US 7,729,150 · App. 12/176,281 · Granted Jun 1, 2010

High-speed and low-power differential non-volatile content addressable memory cell and array

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Quick Facts
Patent No.
US 7,729,150
App. No.
12/176,281
Granted
Jun 1, 2010
Kind
B2
Abstract

A differential non-volatile content addressable memory array has a differential non-volatile content addressable memory cell which uses a pair of non-volatile storage elements. Each of the non-volatile storage elements can be a split-gate floating gate transistor or a stack gate floating gate transistor having a first terminal, a second terminal, a channel therebetween and a floating gate over at least a portion of the channel to control the conduction of electrons in the channel, and a control gate. The floating gate storage transistor can be in one of two states: a first state, such as erase, in which current can flow between the first terminal and the second terminal, and a second state, such as programmed, in which substantially no current flows between the first terminal and the second terminal. A pair of differential compare data lines connects to the control gate of each of the pair of non-volatile floating gate transistors. A match line connects to the first terminal of each of the pair of non-volatile floating gate transistors to a first voltage. Finally, the second terminals of each storage element is connected to a second voltage, different from the first voltage. A current passing through the memory cell is indicative of a mis-match between the contents of the compare data lines and the contents of the storage elements.

Claims (38)

1. A non-volatile content addressable memory cell comprising:

a non-volatile storage element capable of being in one of two non-volatile states: a first state in which a first current flows through said storage element, and a second state in which a second current less than said first current flows through said storage element;

a match line;

a volatile storage element capable of storing said first state and said second state; said volatile storage element having a first output for controlling the flow of current from said match line; and

a data line for supplying data to said non-volatile storage element, and for transferring the data from said non-volatile storage element to said volatile storage element; and for controlling the flow of current from said match line.

2. The non-volatile content addressable memory cell of claim 1 wherein said non-volatile storage element comprises:

a first terminal in a semiconductor substrate;

a second terminal in said semiconductor substrate;

a channel between said second terminal and said first terminal;

a floating gate disposed over a first portion of said channel and said second terminal and is insulated therefrom; and

a control gate having a first section disposed over a second portion of said channel and insulated therefrom, and having a second section over said floating gate and is insulated therefrom.

3. A non-volatile content addressable memory array comprising:

a plurality of cells arranged in a plurality of rows and columns; each cell comprising:

a non-volatile storage element capable of being in one of two non-volatile states: a first state in which a first current flows through said storage element, and a second state in which a second current less than said first current flows through said storage element;

a match line connecting cells arranged in the same row;

a volatile storage element capable of storing said first state and said second state; said volatile storage element having a first output for controlling the flow of current from said match line; and

a plurality of data lines each connecting cells in the same column, and for supplying data to one of said non-volatile storage elements, and for transferring the data from said non-volatile storage element to said volatile storage element; and for controlling the flow of current from said match line.

4. The non-volatile content addressable memory cell of claim 3 wherein said non-volatile storage element comprises:

a first terminal in a semiconductor substrate;

a second terminal in said semiconductor substrate;

a channel between said second terminal and said first terminal;

a floating gate disposed over a first portion of said channel and said second terminal and is insulated therefrom;

a control gate having a first section disposed over a second portion of said channel and insulated therefrom, and having a second section over said floating gate and is insulated therefrom; and

wherein said data line connects to said first terminal of each non-volatile storage element.

5. The memory cell of claim 1 wherein a single bit/compare line is used both for storing data into non-volatile memory and for comparing data on a compare line with data in the volatile storage element.

6. The memory cell of claim 1 wherein a compare data signal is used to control current flow in a channel.

7. The memory cell of claim 1 wherein a compare data line is not connected to a transistor channel, thereby reducing leakage current.

8. The memory cell of claim 6 wherein a compare data line is not connected to a transistor channel, thereby reducing leakage current.

9. The memory cell of claim 2 wherein said data line connects to said first terminal of said non-volatile storage element.

10. The memory cell of claim 3 wherein a single bit/compare line is used both for storing data into non-volatile memory and for comparing data on a compare line with data in the volatile storage element.

11. The memory cell of claim 3 wherein a compare data signal is used to control current flow in a channel.

12. The memory cell of claim 3 wherein a compare data line is not connected to a transistor channel, thereby reducing leakage current.

13. The memory cell of claim 3 wherein said non-volatile storage element comprises:

a first terminal in a semiconductor substrate;

a second terminal in said semiconductor substrate;

a channel between said second terminal and said first terminal;

a floating gate disposed over a first portion of said channel and said second terminal and is insulated therefrom; and

a control gate having a first section disposed over a second portion of said channel and insulated therefrom, and having a second section over said floating gate and is insulated therefrom.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →