IP Library Granted Patent US 7,778,080
Granted Patent B2
US 7,778,080 · App. 12/200,930 · Granted Aug 17, 2010

Flash memory array system including a top gate memory cell

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,778,080
App. No.
12/200,930
Granted
Aug 17, 2010
Kind
B2
Abstract

A memory system includes memory cells arranged in sectors. A decoder corresponding to a sector disables memory cells having a defective top gate. The decoder may include a low voltage or high voltage latch for the disabling. A top gate handling algorithm is included. The memory system may include dynamic top gate coupling. A programming algorithm and waveforms with top gate handling is included.

Claims (45)

1. A method comprising:

determining whether a top gate of a selected memory cell in a memory array is defective;

verifying whether an output value of the selected memory cell is a value expected when the top gate is not defective; and

programming the selected memory cell in the event that the output value is not the expected value;

wherein the memory cells are source side injection memory cells; and

wherein the memory cells are tip erased memory cells.

2. The method of claim 1 wherein the verification step includes verifying whether an output including one or more of a data output, a voltage output, and/or a current output corresponds to one or more of a data input, a voltage input, and/or a current input, respectively.

3. The method of claim 1 wherein the programming includes one terminal of the memory cell or bias thereof is fixed or incremental.

4. The method of claim 3 wherein the programming includes other terminals of the memory cell or biases being fixed or incremental.

5. The method of claim 1 further comprising performing a programming operation that uses a threshold to verify whether the memory cell is acceptable for use.

6. The method of claim 5 wherein the programming operation includes cell parameters subject to an increment or count function to determine if the threshold is reached.

7. The method of claim 1 wherein the memory array includes top gate operation using capacitance loading.

8. The method of claim 1 wherein gate metal is arranged to minimize a coupling effect between top gate lines in the memory array.

9. The method of claim 1 wherein top gates in the memory array are coupled using dynamic coupling or pseudo-dynamic coupling.

10. The method of claim 1 wherein one or more top gates are provided to enable operation using capacitance loading.

11. The method of claim 1 wherein top gates are provided to enable coupling via dynamic coupling or pseudo-dynamic coupling.

12. A memory system comprising:

a memory array comprising memory cells, wherein the memory cells are source side injection, tip erased memory cells;

circuitry including a decoder and control logic having a top gate handling circuit, wherein the circuitry is configured to:

determine whether a top gate of a memory cell selected for testing in the memory array is defective;

verify whether an output value of the memory cell is a value expected when the top gate is not defective; and

program the memory cell in the event that the output value is not the expected value.

13. The system of claim 12 wherein the circuitry is further configured to verify whether an output including one or more of a data output, a voltage output, and/or a current output corresponds to one or more of a data input, a voltage input, and/or a current input, respectively.

14. The memory system of claim 13 wherein the system is configured, in connection with program of the memory cell, such that one terminal of the memory cell or bias thereof is fixed or incremental.

15. The memory system of claim 13 the circuitry is further configured to perform a program operation that uses a threshold to verify whether the memory cell is acceptable for use.

16. The memory system of claim 15 wherein the circuitry is further configured such that the program operation includes cell parameters subject to an increment or count function to determine if the threshold is reached.

17. The memory system of claim 13 wherein the memory array is configured for top gate operation using capacitance loading.

18. The memory system of claim 13 wherein gate metal in the memory array is arranged to minimize a coupling effect between top gate lines.

19. The memory system of claim 13 wherein one or more top gates of the memory array are configured to enable operation using capacitance loading.

20. The system of claim 12 wherein the system is configured, in connection with program of the memory cell, such that one terminal of the memory cell or bias thereof is fixed or incremental.

21. The memory system of claim 12 the circuitry is further configured to perform a program operation that uses a threshold to verify whether the memory cell is acceptable for use.

22. The memory system of claim 12 wherein the circuitry is further configured such that the program operation includes cell parameters subject to an increment or count function to determine if the threshold is reached.

23. The memory system of claim 22 wherein the memory array is configured for top gate operation using capacitance loading.

24. The memory system of claim 22 wherein gate metal in the memory array is arranged to minimize a coupling effect between top gate lines.

25. The memory system of claim 22 wherein one or more top gates of the memory array are configured to enable operation using capacitance loading.

26. The memory system of claim 21 wherein the memory array is configured for top gate operation using capacitance loading.

27. The memory system of claim 21 wherein gate metal in the memory array is arranged to minimize a coupling effect between top gate lines.

28. The memory system of claim 21 wherein one or more top gates of the memory array are configured to enable operation using capacitance loading.

29. The memory system of claim 12 wherein the memory array is configured for top gate operation using capacitance loading.

30. The memory system of claim 29 wherein gate metal in the memory array is arranged to minimize a coupling effect between top gate lines.

31. The memory system of claim 29 wherein one or more top gates of the memory array are configured to enable operation using capacitance loading.

32. The memory system of claim 12 wherein gate metal in the memory array is arranged to minimize a coupling effect between top gate lines.

33. The memory system of claim 32 wherein one or more top gates of the memory array are configured to enable operation using capacitance loading.

34. The memory system of claim 12 wherein top gates in the memory array are configured to enable coupling via dynamic coupling or pseudo-dynamic coupling.

35. The memory system of claim 12 wherein one or more top gates of the memory array are configured to enable operation using capacitance loading.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →