IP Library › Granted Patent US 8,018,042
Granted Patent B2
US 8,018,042 · App. 12/315,741 · Granted Sep 13, 2011

Integrated circuit with flexible planar leads

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Quick Facts
Patent No.
US 8,018,042
App. No.
12/315,741
Granted
Sep 13, 2011
Kind
B2
Abstract

A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress, allowing direct mounting of the device to a member and able withstand extreme thermal cycling between −20° C. to +80° C. encountered in terrestrial applications. Advantageously, the microelectronic device is adapted to be both weldable and solderable. The invention may comprise a solar cell diode, which is flexible and so thin that it can be affixed directly to the solar panel proximate the solar cell.

Claims (16)

1. A microelectronic device, comprising:

an integrated circuit having an upper major surface and a lower major surface;

a first planar flexible lead consisting of essentially a metallic material coupled to the integrated circuit and adapted to route an electrical signal;

a second planar flexible lead consisting of essentially a metallic material coupled to the integrated circuit and adapted to route an electrical signal;

a package including a ring encapsulating the integrated circuit, wherein the first planar flexible lead and the second planar flexible lead form an integral portion of the package;

wherein the first flexible lead freely extends from the package and is coupled to the integrated circuit lower major surface and the second flexible lead freely extends from the package and is coupled to the integrated circuit upper major surface;

wherein the ring, the first flexible lead and the second flexible lead are configured to provide stress relief to the integrated circuit.

2. The microelectronic device as specified in claim 1 wherein the first planar flexible lead forms a wall of the package.

3. The microelectronic device as specified in claim 1 wherein the metallic material is a copper, gold or silver material.

4. The microelectronic device as specified in claim 1 wherein the first flexible lead and the second flexible lead are configured to be weldable.

5. The microelectronic device as specified in claim 1 wherein the first flexible lead and the second flexible lead are configured to sandwich the integrated circuit.

6. The microelectronic device as specified in claim 1 wherein the integrated circuit is a die.

7. The microelectronic device as specified in claim 1 wherein the integrated circuit is a diode.

8. The microelectronic device as specified in claim 1 wherein the first and second flexible leads have thicknesses no greater than approximately 0.003 inch.

9. The microelectronic device as specified in claim 1 wherein the integrated circuit has a thickness no greater than around approximately 0.014 inch.

10. The microelectronic device as specified in claim 1 wherein the total sandwiched thickness is no greater than around approximately 0.02 inch.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT Recorded Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2009
From: AUTRY, TRACY
To: MICROSEMI CORPORATION
Reel/Frame 022068/0473 →