Non-volatile memory cell with buried select gate, and method of making same
View Patent ↗A memory device, and method of making the same, in which a trench is formed into the surface of a semiconductor substrate. Source and drain regions define a channel region there between. The drain is formed under the trench. The channel region includes a first portion that extends along a bottom wall of the trench, a second portion that extends along a sidewall of the trench, and a third portion that extends along the surface of the substrate. The floating gate is disposed over the channel region third portion. The control gate is disposed over the floating gate. The select gate is at least partially disposed in the trench and adjacent to the channel region first and second portions. The erase gate disposed adjacent to and insulated from the floating gate.
1. An electrically programmable and erasable memory device comprising:
a substrate of semiconductor material having a first conductivity type and a surface;
a trench formed into the surface of the substrate;
first and second spaced-apart regions formed in the substrate and having a second conductivity type, with a channel region in the substrate there between, wherein the second region is formed under the trench, and the channel region includes a first portion that extends substantially along a bottom wall of the trench, a second portion that extends substantially along a sidewall of the trench, and a third portion that extends substantially along the surface of the substrate;
an electrically conductive floating gate disposed over and insulated from the channel region third portion for controlling a conductivity of the channel region third portion;
an electrically conductive control gate disposed adjacent to and insulated from the floating gate;
an electrically conductive select gate at least partially disposed in the trench and adjacent to and insulated from the channel region first and second portions for controlling a conductivity of the channel region first and second portions; and
an electrically conductive erase gate disposed adjacent to and insulated from the floating gate.
2. The device of claim 1 , wherein the erase gate is disposed over and insulated from the first region.
3. The device of claim 1 , wherein the select gate includes an upper portion thereof that extends out of the trench.
4. The device of claim 1 , wherein the control gate is disposed over and insulated from the floating gate.
5. The device of claim 1 , further comprising:
a second trench formed into the surface of the substrate;
a third region formed in the substrate and having a second conductivity type, with a second channel region in the substrate between the first and third regions, wherein the third region is formed under the second trench, and the second channel region includes a first portion that extends substantially along a bottom wall of the second trench, a second portion that extends substantially along a sidewall of the second trench, and a third portion that extends substantially along the surface of the substrate;
an electrically conductive second floating gate disposed over and insulated from the second channel region third portion for controlling a conductivity of the second channel region third portion;
an electrically conductive second control gate disposed adjacent to and insulated from the second floating gate; and
an electrically conductive second select gate at least partially disposed in the second trench and adjacent to and insulated from the second channel region first and second portions for controlling a conductivity of the second channel region first and second portions;
wherein the erase gate is disposed adjacent to and insulated from the second floating gate.
6. An array of electrically programmable and erasable memory devices comprising:
a substrate of semiconductor material having a first conductivity type and a surface;
spaced apart isolation regions formed on the substrate which are substantially parallel to one another and extend in a first direction, with an active region between each pair of adjacent isolation regions; and
each of the active regions including a plurality of pairs of memory cells, wherein each of the memory cell pairs comprises:
a pair of trenches formed into the surface of the substrate,
a pair of second regions each formed in the substrate under one of the pair of trenches,
a first region formed in the substrate, wherein a pair of channel regions are each in the substrate between the first region and one of the second regions, wherein the first and second regions have a second conductivity type, and wherein each of the channel regions includes a first portion that extends substantially along a bottom wall of one of the trenches, a second portion that extends substantially along a sidewall of that one trench, and a third portion that extends substantially along the substrate surface,
a pair of electrically conductive floating gates each disposed over and insulated from one of the channel region third portions for controlling a conductivity of that channel region third portion,
a pair of an electrically conductive control gates disposed adjacent to and insulated from one of the floating gates,
a pair of electrically conductive select gates each at least partially disposed in one of the trenches and adjacent to and insulated from one of the channel region first and second portions for controlling a conductivity of those channel region first and second portions, and
an electrically conductive erase gate disposed adjacent to and insulated from the pair of floating gates.
7. The array of claim 6 , wherein for each of the memory cell pairs, the erase gate is disposed over and insulated from the first region.
8. The array of claim 6 , wherein for each of the memory cell pairs, each of the select gate includes an upper portion thereof that extends out of one of the trenches.
9. The array of claim 6 , wherein for each of the memory cell pairs, each of the control gates is disposed over and insulated from one of the floating gates.
10. A method of forming a semiconductor memory cell, comprising:
forming a trench into a surface of the substrate of semiconductor material having a first conductivity type;
forming first and second spaced-apart regions in the substrate having a second conductivity type, with a channel region in the substrate there between, wherein the second region is formed under the trench, and the channel region includes a first portion that extends substantially along a bottom wall of the trench, a second portion that extends substantially along a sidewall of the trench, and a third portion that extends substantially along the surface of the substrate;
forming an electrically conductive floating gate disposed over and insulated from the channel region third portion for controlling a conductivity of the channel region third portion;
forming an electrically conductive control gate disposed adjacent to and insulated from the floating gate;
forming an electrically conductive select gate at least partially disposed in the trench and adjacent to and insulated from the channel region first and second portions for controlling a conductivity of the channel region first and second portions; and
forming an electrically conductive erase gate disposed adjacent to and insulated from the floating gate.
11. The method of claim 10 , wherein the erase gate is disposed over and insulated from the first region.
12. The method of claim 10 , wherein the select gate includes an upper portion thereof that extends out of the trench.
13. The method of claim 10 , wherein the control gate is disposed over and insulated from the floating gate.
14. The method of claim 10 , further comprising:
forming a second trench into the surface of the substrate;
forming a third region in the substrate having a second conductivity type, with a second channel region in the substrate between the first and third regions, wherein the third region is formed under the second trench, and the second channel region includes a first portion that extends substantially along a bottom wall of the second trench, a second portion that extends substantially along a sidewall of the second trench, and a third portion that extends substantially along the surface of the substrate;
forming an electrically conductive second floating gate disposed over and insulated from the second channel region third portion for controlling a conductivity of the second channel region third portion;
forming an electrically conductive second control gate disposed adjacent to and insulated from the second floating gate; and
forming an electrically conductive second select gate at least partially disposed in the second trench and adjacent to and insulated from the second channel region first and second portions for controlling a conductivity of the second channel region first and second portions;
wherein the erase gate is disposed adjacent to and insulated from the second floating gate.
15. A method of forming an array of electrically programmable and erasable memory devices, comprising:
forming spaced apart isolation regions on a semiconductor substrate that are substantially parallel to one another and extend in a first direction, with an active region between each pair of adjacent isolation regions, wherein the substrate has a surface and a first conductivity type; and
forming a plurality of pairs of memory cells in each of the active regions, wherein the formation of each of the memory cell pairs includes:
forming a pair of trenches into the surface of the substrate,
forming a pair of second regions in the substrate each disposed under one of the pair of trenches,
forming a first region in the substrate, wherein a pair of channel regions are each in the substrate between the first region and one of the second regions, wherein the first and second regions have a second conductivity type, and wherein each of the channel regions includes a first portion that extends substantially along a bottom wall of one of the trenches, a second portion that extends substantially along a sidewall of that one trench, and a third portion that extends substantially along the substrate surface,
forming a pair of electrically conductive floating gates each disposed over and insulated from one of the channel region third portions for controlling a conductivity of that channel region third portion,
forming a pair of an electrically conductive control gates disposed adjacent to and insulated from one of the floating gates,
forming a pair of electrically conductive select gates each at least partially disposed in one of the trenches and adjacent to and insulated from one of the channel region first and second portions for controlling a conductivity of those channel region first and second portions, and
forming an electrically conductive erase gate disposed adjacent to and insulated from the pair of floating gates.
16. The method of claim 15 , wherein for each of the memory cell pairs, the erase gate is disposed over and insulated from the first region.
17. The method of claim 15 , wherein for each of the memory cell pairs, each of the select gates includes an upper portion thereof that extends out of one of the trenches.
18. The method of claim 15 , wherein for each of the memory cell pairs, each of the control gates is disposed over and insulated from one of the floating gates.