IP Library Granted Patent US 7,848,140
Granted Patent B2
US 7,848,140 · App. 12/507,783 · Granted Dec 7, 2010

Flash memory array system including a top gate memory cell

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Quick Facts
Patent No.
US 7,848,140
App. No.
12/507,783
Granted
Dec 7, 2010
Kind
B2
Abstract

A memory system includes memory cells arranged in sectors. A decoder corresponding to a sector disables memory cells having a defective top gate. The decoder may include a low voltage or high voltage latch for the disabling. A top gate handling algorithm is included. The memory system may include dynamic top gate coupling. A programming algorithm and waveforms with top gate handling is included.

Claims (27)

1. A memory system comprising:

a plurality of memory cells arranged in sectors, the top gates of a first group of memory cells in a sector being coupled to a first line, source lines of a second group of memory cells in the sector being coupled to a second line, the top gates of a third group of memory cells in the sector being coupled to a third line, source lines of a fourth group of memory cells in the sector being coupled to a fourth line, the first group including memory cells in the second and fourth groups, the third group including memory cells in the second and fourth groups, but not in the first group.

2. The memory system of claim 1 wherein the memory cells are multilevel memory cells.

3. The memory system of claim 2 wherein the memory cells are tip erased memory cells.

4. The memory system of claim 2 wherein the memory cells are source side injection memory cells.

5. The memory system of claim 2 , wherein each memory cell further comprising:

a floating gate,

wherein said floating gate having a tip adjacent to said top gate for erasing said floating gate through said tip to said top gate.

6. The memory system of claim 2 further comprising:

a plurality of word lines coupled to at least one other individual line.

7. The memory system of claim 2 further comprising an enable transistor that controls a top gate line including one or both of the first line and/or the third line, wherein the enable transistor is configured to be turned off after a top gate reaches a bias level so that the top gate line floats and follows voltages on a word line.

8. The memory system of claim 2 wherein one or both of the first line and/or the third line are floating.

9. The memory system of claim 2 further comprising a first weak driver for driving a word line, and a second weak driver for driving one or both of the first line and/or the third line.

10. The memory system of claim 9 wherein one or both of the first line and/or the third line are floating.

11. The memory system of claim 2 further comprising a weak driver for driving one or both of the first line and/or the third line.

12. The memory system of claim 1 wherein the memory cells are tip erased memory cells.

13. The memory system of claim 1 wherein the memory cells are source side injection memory cells.

14. The memory system of claim 1 , wherein each memory cell further comprising:

a floating gate,

wherein said floating gate having a tip adjacent to said top gate for erasing said floating gate through said tip to said top gate.

15. The memory system of claim 1 further comprising:

a plurality of word lines coupled to at least one other individual line.

16. The memory system of claim 1 further comprising an enable transistor that controls a top gate line including one or both of the first line and/or the third line, wherein the enable transistor is configured to be turned off after a top gate reaches a bias level so that the top gate line floats and follows voltages on a word line.

17. The memory system of claim 1 wherein one or both of the first line and/or the third line are floating.

18. The memory system of claim 1 further comprising a first weak driver for driving a word line, and a second weak driver for driving one or both of the first line and/or the third line.

19. The memory system of claim 18 wherein one or both of the first line and/or the third line are floating.

20. The memory system of claim 1 further comprising a weak driver for driving one or both of the first line and/or the third line.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →