Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof
View Patent ↗A method for manufacturing an integrated circuit package system includes: providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an inner encapsulation; mounting an outer lead on the periphery of the base package; mounting a second integrated circuit above the base package and connected to the outer lead with the interconnects; and partially encapsulating, the base package and the outer leads with an outer encapsulation leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed.
1. A method for manufacturing an integrated circuit package system comprising:
providing a base package having a heat sink mounted above a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an inner encapsulation;
mounting an outer lead on the periphery of the base package;
mounting a second integrated circuit above the base package and connected to the outer lead with the interconnects; and
partially encapsulating, the base package and the outer leads with an outer encapsulation leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed.
2. The method as claimed in claim 1 wherein:
providing the base package includes providing the base package having the first integrated circuit above a die pad.
3. The method as claimed in claim 1 further comprising:
etching the outer lead to form a half-etched portion.
4. The method as claimed in claim 1 further comprising:
mounting a third integrated circuit above the second integrated circuit and connected thereto with a solder bump.
5. The method as claimed in claim 1 further comprising:
providing a process tape and mounting the base package thereto.
6. A method for manufacturing an integrated circuit package system comprising:
providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with bond wires, and the inner lead partially encapsulated by an inner encapsulation and further connected to a heat sink above the first integrated circuit;
mounting an outer lead on the periphery of the base package;
mounting a second integrated circuit above the base package and connected to the outer lead with the bond wires; and
partially encapsulating, the base package and the outer leads with an outer encapsulation leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed.
7. The method as claimed in claim 6 wherein:
providing the base package includes providing a heat sink support extending downward from the heat sink and a lead extension extending upward from the inner lead and connecting the heat sink the lead extension to the heat sink support.
8. The method as claimed in claim 6 wherein:
mounting the second integrated circuit includes attaching the second integrated circuit with a die attach adhesive.
9. The method as claimed in claim 6 wherein:
encapsulating the outer lead partially with the outer encapsulation includes exposing a side portion and a portion of a top surface of the outer lead.
10. An integrated circuit package system comprising:
a base package having a heat sink mounted above a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an inner encapsulation;
an outer lead mounted on the periphery of the base package;
a second integrated circuit mounted above the base package and connected to the outer lead with the interconnects; and
an outer encapsulation partially encapsulating, the base package and the outer lead with leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed.
11. The system as claimed in claim 10 further comprising:
a die pad coupled to the first integrated circuit and the first integrated circuit is mounted above the die pad.
12. The system as claimed in claim 10 further comprising:
a half-etched portion in the outer lead.
13. The system as claimed in claim 10 further comprising:
a third integrated circuit mounted above the second integrated circuit; and
a solder bump connecting the third integrated circuit to the second integrated circuit.
14. The system as claimed in claim 10 further comprising:
a bottom surface of the inner encapsulation exposed from the outer encapsulation.
15. The system as claimed in claim 10 wherein:
the interconnects are bond wires.
16. The system as claimed in claim 15 further comprising:
a heat sink support extending downward from the heat sink; and
a lead extension extending upward from the inner lead and the heat sink support is connected to the lead extension.
17. The system as claimed in claim 15 further comprising:
a die attach adhesive attaching the second integrated circuit above the base package.
18. The system as claimed in claim 15 wherein:
the outer encapsulation partially encapsulates the outer lead exposing a side portion and a portion of a top surface of the outer lead.