IP Library Granted Patent US 8,274,100
Granted Patent B2
US 8,274,100 · App. 12/845,791 · Granted Sep 25, 2012

CCD sensors with multiple contact patterns

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Quick Facts
Patent No.
US 8,274,100
App. No.
12/845,791
Granted
Sep 25, 2012
Kind
B2
Abstract

A pixel array in an image sensor includes multiple pixels. The pixel array includes vertical shift registers for shifting charge out of the pixel array. The vertical shift registers can be interspersed between the pixels, such as in an interline image sensor, or the photosensitive areas in the pixels can operate as vertical shift registers. The pixels are divided into blocks of pixels. One or more electrodes are disposed over each pixel. Conductive strips are disposed over the electrodes. Contacts are used to connect selected electrodes to respective conductive strips. The contacts in at least one block of pixels are positioned according to one contact pattern while the contacts in one or more other blocks are positioned according to a different contact pattern. The different contact patterns reduce or eliminate visible patterns in the contact locations.

Claims (14)

1. An image sensor comprising: a pixel array divided into a plurality of blocks of pixels with each block including two or more pixels, the pixel array including a plurality of vertical shift registers for shifting charge out of the pixel array; one or more electrodes disposed over each pixel; a plurality of conductive strips disposed over the electrodes; and a first plurality of contacts connecting selected electrodes to respective conductive strips of the plurality of the conductive strips, wherein the contacts in at least one block of pixels are positioned according to one contact pattern and the contacts in one or more other blocks of pixels are positioned according to a different contact pattern.

2. The image sensor as in claim 1 , further comprising a second plurality of contacts connecting at least one end of each of the electrodes to one or more bus lines.

3. The image sensor as in claim 1 , wherein the image sensor is implemented as one of a frame transfer CCD image sensor, an interline CCD image sensor, or a full frame CCD image sensor.

4. The image sensor as in claim 1 , wherein the conductive strips comprise metal strips.

5. The image sensor as in claim 1 , wherein the electrodes comprise polysilicon electrodes.

6. The image sensor as in claim 1 , further comprising conductive strips connecting at least one end of selected electrodes to respective bus lines.

7. The image sensor as in claim 1 , further comprising at least one horizontal shift register for receiving charge from at least some of the vertical shift registers.

8. The image sensor as in claim 1 , wherein each of the plurality of conductive strips extends vertically across the entire pixel array.

9. The image sensor as in claim 1 , wherein each of the plurality of conductive strips extends vertically over only a portion of the pixel array.

10. The image sensor as in claim 1 , wherein each block of pixels comprises at least 16pixels.

11. The image sensor as in claim 1 , wherein each block of pixels comprises at least 25pixels.

12. The image sensor as in claim 1 , wherein each of the one or more electrodes extends linearly across a plurality of pixels.

13. The image sensor as in claim 12 , wherein each of the plurality of the conductive strips extends linearly across the one or more electrodes of each pixel.

14. The image sensor as in claim 13 , wherein the conductive strips of the plurality of the conductive strips and one or more electrodes are approximately perpendicular to each other.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
RELEASE OF SECURITY INTEREST Recorded Sep 22, 2015
From: TRUESENSE IMAGING, INC
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 036656/0412 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2014
From: TRUESENSE IMAGING, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033460/0457 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT Recorded May 19, 2014
From: PNC BANK, NATIONAL ASSOCIATION
To: TRUESENSE IMAGING, INC.
Reel/Frame 032936/0167 →
CHANGE OF NAME Recorded Dec 29, 2011
From: IMAGE SENSOR TECHNOLOGIES ACQUISITION CORPORATION
To: TRUESENSE IMAGING, INC.
Reel/Frame 027463/0523 →
SECURITY AGREEMENT Recorded Dec 9, 2011
From: TRUESENSE IMAGING, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 027354/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2011
From: EASTMAN KODAK COMPANY
To: IMAGE SENSOR TECHNOLOGIES ACQUISITION CORPORATION
Reel/Frame 027328/0892 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2010
From: WANG, SHEN
To: EASTMAN KODAK COMPANY
Reel/Frame 024758/0313 →