IP Library Granted Patent US 8,199,590
Granted Patent B1
US 8,199,590 · App. 12/889,653 · Granted Jun 12, 2012

Multiple time programmable non-volatile memory element

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Quick Facts
Patent No.
US 8,199,590
App. No.
12/889,653
Granted
Jun 12, 2012
Kind
B1
Abstract

A multiple time programmable non-volatile memory element and associated programming methods that allow for integration of non-volatile memory with other CMOS integrated circuitry utilizing standard CMOS processing. The multiple time programmable non-volatile memory element includes a capacitor, an access transistor that is electrically coupled to the capacitor at a connection node, and a plurality of one time programmable non-volatile memory cells. Each of the plurality of one time programmable non-volatile memory cells is electrically coupled to the connection node and includes a select transistor that is electrically coupled to an antifuse element. The antifuse element is configured to have changed resistivity in response to one or more voltage pulses received at the connection node, the change in resistivity representing a change in logic state.

Claims (18)

1. A non-volatile memory, comprising:

a plurality of multiple time programmable non-volatile memory elements, each respective multiple time programmable non-volatile memory element including:

a capacitor;

an access transistor electrically coupled to the capacitor at a connection node; and

a plurality of one time programmable non-volatile memory cells corresponding in number to a number of times the respective multiple time programmable non-volatile memory element can be programmed to have a logic state that is either one of a first logic state and a second logic state that is logically opposite the first logic state, each of the plurality of one time programmable non-volatile memory cells being electrically coupled in parallel with one another to the connection node and including a select transistor that is electrically coupled to an antifuse element, the antifuse element being configured to have changed resistivity in response to one or more voltage pulses received at the connection node, the change in resistivity representing a change in the logic state of the respective multiple time programmable non-volatile memory element.

2. The non-volatile memory of claim 1 , wherein the select transistor is electrically coupled between the connection node and the antifuse element in each of the plurality of one time programmable non-volatile memory cells.

3. The multiple time programmable non-volatile memory element of claim 2 , wherein the antifuse element is an antifuse element transistor having a gate that is connected to the select transistor in each of the plurality of one time programmable non-volatile memory cells.

4. The multiple time programmable non-volatile memory element of claim 2 , wherein the select transistor has a drain and a source, and wherein the drain of the select transistor is connected to the connection node and the source of the select transistor is connected to the antifuse element in each of the plurality of one time programmable non-volatile memory cells.

5. The multiple time programmable non-volatile memory element of claim 4 , wherein the antifuse element is an antifuse element transistor having a gate that is connected to the source of the select transistor in each of the plurality of one time programmable non-volatile memory cells.

6. The multiple time programmable non-volatile memory element of claim 5 , wherein each respective one time programmable non-volatile memory cell of the plurality of programmable non volatile memory cells of the respective multiple time programmable non-volatile memory element can be individually selected and programmed to have either one of the first logic state and the second logic state independently of any other one time programmable non-volatile memory cell of the plurality of one time programmable non-volatile memory cells of the respective multiple time programmable non-volatile memory element.

7. The multiple time programmable non-volatile memory element of claim 4 , wherein the antifuse element is an antifuse element transistor having a source and a drain that are connected together and to the source of the select transistor in each of the plurality of one time programmable non-volatile memory cells.

8. The multiple time programmable non-volatile memory element of claim 1 , wherein one of a source and a drain of the access transistor is electrically coupled to the capacitor at the connection node.

9. The multiple time programmable non-volatile memory element of claim 1 , wherein the antifuse element is electrically coupled between the connection node and the select transistor in each of the plurality of one time programmable non-volatile memory cells.

10. The multiple time programmable non-volatile memory element of claim 9 , wherein the antifuse element is an antifuse element transistor having a gate, a source and a drain, and wherein the gate of the antifuse element transistor is connected to the connection node and the source and drain of the antifuse element transistor are connected together and to the select transistor in each of the plurality of one time programmable non-volatile memory cells.

11. The multiple time programmable non-volatile memory element of claim 10 , wherein the select transistor has a source and a drain, and wherein one of the source and the drain of the select transistor is connected to the source and drain of the antifuse element in each of the plurality of one time programmable non-volatile memory cells.

12. The multiple time programmable non-volatile memory element of claim 10 , wherein the select transistor has a source and a drain, and wherein the drain of the select transistor is connected to the source and drain of the antifuse element in each of the plurality of one time programmable non-volatile memory cells.

13. The multiple time programmable non-volatile memory element of claim 12 , wherein each respective one time programmable non-volatile memory cell of the plurality of programmable non volatile memory cells of the respective multiple time programmable non-volatile memory element can be individually selected and programmed to have either one of the first logic state and the second logic state independently of any other one time programmable non-volatile memory cell of the plurality of one time programmable non-volatile memory cells of the respective multiple time programmable non-volatile memory element.

14. The multiple time programmable non-volatile memory element of claim 1 , wherein each respective one time programmable non-volatile memory cell of the plurality of programmable non volatile memory cells of the respective multiple time programmable non-volatile memory element can be individually selected and programmed to have either one of the first logic state and the second logic state independently of any other one time programmable non-volatile memory cell of the plurality of one time programmable non-volatile memory cells of the respective multiple time programmable non-volatile memory element.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2015
From: NOVOCELL SEMICONDUCTOR, INC.
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 035117/0761 →