IP Library Granted Patent US 8,270,213
Granted Patent B2
US 8,270,213 · App. 12/962,343 · Granted Sep 18, 2012

Flash memory array system including a top gate memory cell

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Quick Facts
Patent No.
US 8,270,213
App. No.
12/962,343
Granted
Sep 18, 2012
Kind
B2
Abstract

A memory system includes memory cells arranged in sectors. A decoder corresponding to a sector disables memory cells having a defective top gate. The decoder may include a low voltage or high voltage latch for the disabling. A top gate handling algorithm is included. The memory system may include dynamic top gate coupling. A programming algorithm and waveforms with top gate handling is included.

Claims (49)

1. A memory system comprising:

a plurality of memory cells arranged in sectors, each memory cell having a top gate; and

control circuitry coupled to the plurality of memory cells, wherein the control circuitry is configured to program the plurality of memory cells via:

pulling up all unselected bitlines and selected bitlines to a first bias voltage;

pulling up a selected source line to a second bias voltage;

pulling up a selected word line to a bias programming wordline voltage;

pulling up the selected source line to a bias source line programming voltage;

pulling up a selected top gate to a top gate programming voltage;

releasing the selected bitlines from the first bias voltage; and

pulling down the selected bitlines to a stable bias voltage via application of a programming current, wherein the memory cell has complete programming conditions at its terminal.

2. The memory system of claim 1 wherein the control circuitry includes a top gate handling logic circuit.

3. The memory system of claim 2 wherein the memory cells are multilevel memory cells.

4. The memory system of claim 2 wherein the memory cells are tip erased memory cells.

5. The memory system of claim 2 wherein the memory cells are source side injection memory cells.

6. The memory system of claim 5 , wherein each memory cell further comprising:

a floating gate,

a select gate,

wherein said floating gate having a tip adjacent to said select gate for erasing said floating gate through said tip to said select gate.

7. The memory system of claim 5 , wherein each memory cell further comprising:

a floating gate,

wherein said floating gate having a tip adjacent to said top gate for erasing said floating gate through said tip to said top gate.

8. The memory system of claim 1 further comprising:

a plurality of word lines coupled to at least one other individual line.

9. The memory system of claim 1 wherein the control circuitry, at the end of programming, is further configured to:

ramp down the top gate voltage;

ramp down the word line voltage;

ramp down the source line voltage; and

ramp down the voltages on all of the bitlines.

10. The memory system of claim 1 wherein the memory cells are tip erased memory cells.

11. The memory system of claim 10 wherein the top gate line is dynamically coupled to the word line.

12. The memory system of claim 10 wherein the top gate line is floating.

13. The memory system of claim 1 wherein the memory cells are source side injection memory cells.

14. The memory system of claim 13 wherein the top gate line is dynamically coupled to the word line.

15. The memory system of claim 13 wherein the top gate line is floating.

16. The memory system of claim 1 wherein the memory cells are multilevel memory cells.

17. The memory system of claim 16 wherein the top gate line is dynamically coupled to the word line.

18. The memory system of claim 16 wherein the top gate line is floating.

19. The memory system of claim 1 further comprising circuitry configured to provide top gate capacitance loading and/or coupling handling.

20. The memory system of claim 19 wherein the memory cells are multilevel memory cells.

21. The memory system of claim 19 wherein the memory cells are tip erased memory cells.

22. The memory system of claim 19 wherein the memory cells are source side injection memory cells.

23. The memory system of claim 1 wherein the top gates are coupled using dynamic coupling and/or pseudo-dynamic coupling.

24. The memory system of claim 23 wherein the memory cells are multilevel memory cells.

25. The memory system of claim 23 wherein the memory cells are tip erased memory cells.

26. The memory system of claim 23 wherein the memory cells are source side injection memory cells.

27. The memory system of claim 1 wherein the top gate line is dynamically coupled to the word line.

28. The memory system of claim 1 further comprising a first weak driver for driving the word line, and a second weak driver for driving the top gate line.

29. The memory system of claim 1 wherein the top gate line is floating.

30. The memory system of claim 29 wherein the memory cells are multilevel memory cells.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →