Method for manufacturing semiconductor package system with die support pad
View Patent ↗A method for manufacturing a semiconductor package system includes: providing a leadframe, having an open center, with leads adjacent to a peripheral edge of the leadframe; making a die support pad, formed without tie bars, separately from the leadframe; providing a coverlay tape for positioning the support pad centered within the leadframe; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the leads; and connecting a bonding pad on the semiconductor die to one of the leads using a bonding wire.
1. A method for manufacturing a semiconductor package system comprising:
providing a leadframe, having an open center, with leads adjacent to a peripheral edge of the leadframe;
making a die support pad, formed without tie bars, separately from the leadframe;
providing a coverlay tape for positioning the support pad centered within the leadframe;
attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the leads; and
connecting a bonding pad on the semiconductor die to one of the leads using a bonding wire.
2. The method as claimed in claim 1 wherein attaching the semiconductor die to the die support pad through the die attach adhesive includes attaching the semiconductor die overhanging the leads.
3. The method as claimed in claim 1 wherein attaching the semiconductor die to the die support pad through the die attach adhesive includes pre-coating the die support pad with the die attach adhesive before attaching the semiconductor die.
4. The method as claimed in claim 1 wherein making the die support pad separately from the leadframe includes making the die support pad with a die support pad groove formed at the bottom surface of the die support pad.
5. The method as claimed in claim 1 wherein providing the leadframe with the leads includes providing the leadframe with corner leads adjacent to each other without an intervening portion of the leadframe.
6. A method for manufacturing a semiconductor package system comprising:
providing a leadframe, having an open center, with leads adjacent to a peripheral edge of the leadframe;
making a die support pad, formed without tie bars, separately from the leadframe;
providing a coverlay tape for positioning the support pad centered within the leadframe;
attaching a semiconductor die to the die support pad through a die attach adhesive, a space between the semiconductor die and the leads being filled with the die attached adhesive; and
connecting a bonding pad on the semiconductor die to one of the leads using a bonding wire.
7. The method as claimed in claim 6 wherein attaching the semiconductor die to the die support pad through the die attach adhesive includes attaching the semiconductor die overhanging the leads.
8. The method as claimed in claim 6 wherein attaching the semiconductor die to the die support pad through the die attach adhesive includes pre-coating the semiconductor die with the die attach adhesive before attaching to the die support pad.
9. The method as claimed in claim 6 further comprising:
encapsulating the semiconductor die, the bonding pad, the bonding wire, the die attach adhesive, the die support pad, and the leads in a mold compound; and
singulating the leadframe.
10. The method as claimed in claim 6 wherein providing the leadframe with the leads includes providing the leadframe with corner leads adjacent to each other without an intervening portion of the leadframe.