Integrated circuit package system employing device stacking

1. A method of manufacturing an integrated circuit packaging system comprising:

providing an inner lead and an outer lead, the inner lead having an inner peripheral side with a non-linear contour;

forming a bump contact, having a groove in and a mesa from the inner lead or the outer lead, the groove adjacent to the mesa;

mounting a first device adjacent to the inner lead;

connecting a second device to the mesa; and

forming an encapsulation material over the first device, the inner lead, and the outer lead and covering the second device.

2. The method as claimed in claim 1 wherein providing the inner lead includes providing the inner lead having an inner half etched portion along an inner bottom side of the inner lead and extending from the inner peripheral side of the inner lead.

3. The method as claimed in claim 1 further comprising:

mounting a third device over the second device;

connecting the third device to the outer lead; and

wherein:

forming the bump contact includes forming the bump contact from the outer lead.

4. The method as claimed in claim 1 further comprising:

mounting a third device over the second device;

connecting the third device to the outer lead; and

wherein:

forming the bump contact includes forming the bump contact from the inner lead.

5. The method as claimed in claim 1 wherein:

providing the inner lead and the outer lead includes providing the inner lead between the outer lead and the first device; and

forming the bump contact includes forming the bump contact from the outer lead.

6. A method of manufacturing an integrated circuit packaging system comprising:

providing an inner lead and an outer lead, the inner lead having an inner peripheral side with a non-linear contour;

forming a bump contact, having a groove in and a mesa from the inner lead or the outer lead, the groove adjacent to the mesa;

mounting a first device adjacent to the inner lead;

connecting a second device to the mesa;

mounting a third device over the second device with an inter device structure in between; and

forming an encapsulation material over the first device, the inner lead, and the outer lead and covering the second device and the third device.

7. The method as claimed in claim 6 wherein:

providing the outer lead includes providing the outer lead having an upper top side and a lower top side, the lower top side at a lower position of the outer lead than the upper top side; and

forming the bump contact includes forming the bump contact from the lower top side.

8. The method as claimed in claim 6 wherein:

providing the inner lead and the outer lead includes providing the inner lead having an inner top side of the inner lead and an outer top side of the outer lead, the inner top side co-planar with the outer top side; and

forming the bump contact includes forming the bump contact from the inner top side.

9. The method as claimed in claim 6 further comprising:

providing a perimeter lead adjacent to and on a side of the outer lead facing away from the inner lead; and

connecting the third device and the perimeter lead.

10. The method as claimed in claim 6 wherein forming the encapsulation material includes forming the encapsulation material with a lower portion of the inner lead and the outer lead extending from the encapsulation material.

11. An integrated circuit packaging system comprising:

a first device;

an outer lead around the first device;

an inner lead, having an inner peripheral side with a non-linear contour, adjacent to the first device;

a bump contact, having a groove in and a mesa from the inner lead or the outer lead, the groove adjacent to the mesa;

a second device connected to the mesa; and

an encapsulation material over the first device, the inner lead, and the outer lead and covering the second device.

12. The system as claimed in claim 11 wherein the inner lead includes an inner half etched portion along an inner bottom side of the inner lead and extending from the inner peripheral side of the inner lead.

13. The system as claimed in claim 11 further comprising:

a third device over the second device and connected to the outer lead; and

wherein:

the bump contact is along the outer lead.

14. The system as claimed in claim 11 further comprising:

a third device over the second device and to the outer lead; and

wherein:

the bump contact along the inner lead.

15. The system as claimed in claim 11 wherein:

the inner lead is between the outer lead and the first device; and

the bump contact is along the outer lead.

16. The system as claimed in claim 11 further comprising:

a third device over the second device with an inter device structure in between;

wherein:

the first device is connected to the inner lead; and

the encapsulation material covers the third device.

17. The system as claimed in claim 11 wherein:

the outer lead has an upper top side and a lower top side, the lower top side at a lower position of the outer lead than the upper top side; and

the bump contact is along the lower top side.

18. The system as claimed in claim 11 wherein:

the inner lead has an inner top side;

the outer lead has an outer top side co-planar with the inner top side; and

the bump contact is along the inner top side.

19. The system as claimed in claim 11 further comprising:

a perimeter lead adjacent to and on a side of the outer lead facing away from the inner lead; and

wherein:

the third device is connecting to the perimeter lead.

20. The system as claimed in claim 11 wherein a lower portion of the inner lead and the outer lead extends from the encapsulation material.