Integrated circuit packaging system with step mold and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

attaching an integrated circuit die to the substrate, the integrated circuit die having peripheral sides;

connecting the integrated circuit die to the substrate with a first bond wire, the first bond wire disposed about one of the peripheral sides;

molding a step mold covering one of the peripheral sides and the first bond wire;

attaching an intermediate die directly over the integrated circuit die, offset to one of the peripheral sides adjacent to the step mold;

directly connecting the intermediate die to the substrate with a second bond wire; and

encapsulating the intermediate die, the integrated circuit die, the step mold, the second bond wire, and the substrate with an encapsulation, the encapsulation not contacting the first bond wire.

2. The method as claimed in claim 1 wherein:

molding the step mold includes exposing the peripheral sides adjacent to the step mold; and

attaching the intermediate die includes attaching the intermediate die offset to one of the peripheral sides exposed by the step mold.

3. The method as claimed in claim 1 further comprising directly connecting the intermediate die to the integrated circuit die.

4. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

attaching an integrated circuit die to the substrate, the integrated circuit die having peripheral sides

connecting the integrated circuit die to the substrate with a bond wire, the bond wire disposed about one of the peripheral sides;

molding a step mold covering one of the peripheral sides and encapsulating the bond wire;

attaching an intermediate die directly over the integrated circuit die, offset to one of the peripheral sides adjacent to the step mold;

directly connecting the intermediate die to the substrate with an intermediate bond wire;

attaching a top die to the step mold and directly over the integrated circuit die and the intermediate die;

connecting the top die to the substrate with a top bond wire; and

encapsulating the top die, the intermediate die, the integrated circuit die, the step mold, the top bond wire, the intermediate bond wire, and the substrate with an encapsulation, the encapsulation not contacting the bond wire.

5. The method as claimed in claim 4 wherein attaching the intermediate die includes attaching a flip chip.

6. The method as claimed in claim 4 wherein attaching the intermediate die includes attaching a stack packaging.

7. An integrated circuit packaging system comprising:

a substrate;

an integrated circuit die attached to the substrate, the integrated circuit die having peripheral sides;

a bond wire operable to connect the integrated circuit die to the substrate, the bond wire disposed about one of the peripheral sides;

a step mold covering one of the peripheral sides and the bond wire;

an intermediate die attached directly over the integrated circuit die, offset to one of the peripheral sides adjacent to the step mold;

an intermediate bond wire operable to connect the intermediate die directly to the substrate; and

an encapsulation configured to encapsulate the intermediate die, the integrated circuit die, the step mold, the intermediate bond wire, and the substrate, the encapsulation not contacting the bond wire.

8. The system as claimed in claim 7 wherein:

the step mold exposes the peripheral sides adjacent to the step mold; and

the intermediate die is attached offset to one of the peripheral sides exposed by the step mold.

9. The system as claimed in claim 7 wherein the intermediate bond-wire is directly connected to the intermediate die and the integrated circuit die.

10. The system as claimed in claim 7 further comprising:

a top die attached to the step mold and directly over the integrated circuit die and the intermediate die;

a top bond wire operable to connect the top die directly to the substrate;

the encapsulation further configured to encapsulate the top die and the top bond wire.

11. The system as claimed in claim 10 wherein the intermediate die is a stack packaging.