Granted Patent B2

US 8,256,660 · App. 13/053,141 · Granted Sep 4, 2012

Abstract

Claims (48)

1. A method of manufacturing a semiconductor package system comprising:

providing a die having a contact pad;

providing a lead finger having a substantially trapezoidal cross-section;

attaching a bump to the lead finger, the bump clamping down on a top and a side of the lead finger;

connecting the bump to the contact pad; and

forming an encapsulant over the lead finger and the die, the encapsulant leaving a bottom of the lead finger exposed.

2. The method as claimed in claim 1 wherein providing the lead finger provides the lead finger with a top having a flat upper surface.

3. The method as claimed in claim 1 wherein providing the lead finger provides the lead finger with a top having a non-flat upper surface.

4. The method as claimed in claim 1 wherein connecting the bump to the contact pad includes attaching a bond wire between the bump and the contact pad.

5. The method as claimed in claim 1 wherein connecting the bump to the contact pad includes stitch bonding a bond wire to the bump.

6. A method of manufacturing a semiconductor package system comprising:

providing a die having a contact pad;

providing a die paddle and a lead finger, the lead finger having a substantially trapezoidal cross-section;

attaching the die to the die paddle with the contact pad up;

attaching a bump to the lead finger, the bump clamping down on a top and a side of the lead finger;

attaching a bond wire between the bump and the contact pad; and

forming an encapsulant over the lead finger, the die, and the bond wire, the encapsulant leaving a bottom of the lead finger exposed.

7. The method as claimed in claim 6 wherein providing the lead finger provides the lead finger with a top having a flat or non-flat surface.

8. The method as claimed in claim 6 wherein providing the lead finger provides the lead finger with a top having a width less than or equal to about 40 microns.

9. The method as claimed in claim 6 further comprising providing a further lead finger spaced from the lead finger with a fine pitch spacing of less than or equal to about 90 microns.

10. The method as claimed in claim 6 further comprising:

attaching a bond wire to the contact pad uses ball bonding; and

attaching the bond wire to the bump uses stitch bonding.

11. A method of manufacturing a semiconductor package system comprising:

providing a die having a plurality of contact pads;

forming a leadframe having a plurality of lead fingers, the plurality of lead fingers having a fine pitch and each having a substantially trapezoidal cross-section;

attaching a plurality of bumps to the plurality of lead fingers, the plurality of bumps on the tops and extending down the sides of the plurality of lead fingers;

attaching a plurality of bond wires to the plurality of contact pads;

attaching the plurality of bond wires to the plurality of bumps; and

forming an encapsulant over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.

12. A semiconductor package system comprising:

a die having a contact pad;

a lead finger having a substantially trapezoidal cross-section;

the bump clamping down on a top and a side of the lead finger, the bump connected to the contact pad; and

an encapsulant over the lead finger and the die, the encapsulant with a bottom of the lead finger exposed.

13. The system as claimed in claim 12 wherein the lead finger has a top with a flat upper surface.

14. The system as claimed in claim 12 wherein the lead finger has a top with a non-flat upper surface.

15. The system as claimed in claim 12 wherein the bump is connected to the contact pad by a bond wire.

16. The system as claimed in claim 12 wherein the bump is connected to the contact pad by a bond wire attached to the bump by a stitch bond.

17. The system as claimed in claim 12 further comprising:

a die paddle having the die attached thereto with the contact pad up;

a bond wire connected between the contact pad and the bump; and

the encapsulant over the bond wire.

18. The system as claimed in claim 17 further comprising a further lead finger having a flat or a non-flat surface.

19. The system as claimed in claim 17 further comprising a further lead finger having a width less than or equal to about 40 microns.

20. The system as claimed in claim 17 further comprising a further lead finger spaced from the lead finger with a fine pitch spacing of less than or equal to about 90 microns.

21. The system as claimed in claim 17 wherein:

the bond wire is attached to the contact pad by a ball bond and to the bump by a stitch bond.

Assignments (6)