Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a base circuit assembly having an integrated circuit device;

mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device;

applying an encapsulant over the inner interconnect and the outer interconnect; and

removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and the outer interconnect.

2. The method as claimed in claim 1 wherein removing the portion of the pre-formed conductive frame includes removing a portion of the inner interconnect and a portion of the encapsulant to form an encapsulant cavity.

3. The method as claimed in claim 1 wherein:

providing the base circuit assembly includes providing a bottom substrate with the integrated circuit device thereon;

mounting the pre-formed conductive frame having the inner interconnect includes mounting the inner interconnect having a vertical portion mounted to the bottom substrate; and

removing the portion of the pre-formed conductive frame includes exposing a planar portion integral to the vertical portion.

4. The method as claimed in claim 1 further comprising:

connecting a first component to the inner interconnect;

mounting a second component over the first component; and

connecting the second component to the outer interconnect.

5. The method as claimed in claim 1 wherein:

providing the base circuit assembly having the integrated circuit device includes providing the integrated circuit device having a through silicon via; and

mounting the pre-formed conductive frame having the inner interconnect includes mounting the inner interconnect on the through silicon via.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a base circuit assembly having an integrated circuit device and a bottom substrate;

mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device;

applying an encapsulant over the base circuit assembly, the inner interconnect, and the outer interconnect; and

removing a portion of the pre-formed conductive frame exposing an inner exposed contact surface of the inner interconnect and an outer exposed contact surface of the outer interconnect.

7. The method as claimed in claim 6 wherein applying the encapsulant includes surrounding the inner interconnect and the outer interconnect with the encapsulant.

8. The method as claimed in claim 6 further comprising:

connecting a first component with the inner exposed contact surface over the top substrate;

mounting a second component over the first component; and

connecting the second component with the outer exposed contact surface.

9. The method as claimed in claim 6 wherein providing the base circuit assembly includes providing the integrated circuit device mounted to the bottom substrate.

10. The method as claimed in claim 6 wherein mounting the pre-formed conductive frame having the inner interconnect includes mounting the inner interconnect having a vertical portion mounted to the bottom substrate between the integrated circuit device and the outer interconnect.

11. An integrated circuit packaging system comprising:

a base circuit assembly having an integrated circuit device;

an outer interconnect;

an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device; and

an encapsulant applied over the inner interconnect and the outer interconnect and with the inner interconnect and the outer interconnect substantially exposed.

12. The system as claimed in claim 11 wherein the encapsulant includes an encapsulant cavity.

13. The system as claimed in claim 11 wherein:

the base circuit assembly includes a bottom substrate with the integrated circuit device thereon; and

the inner interconnect includes a planar portion and a vertical portion, the vertical portion mounted to the bottom substrate and integral to the planar portion.

14. The system as claimed in claim 11 further comprising:

a first component connected with the inner interconnect;

a second component mounted over the first component; and

the second component connected with the outer interconnect.

15. The system as claimed in claim 11 wherein:

the base circuit assembly having the integrated circuit device includes the integrated circuit device having a through silicon via; and

the inner interconnect is on the through silicon via.

16. The system as claimed in claim 11 wherein:

the base circuit assembly includes a bottom substrate; and

the encapsulant is over the base circuit assembly and with an inner exposed contact surface of the inner interconnect and an outer exposed contact surface of the outer interconnect substantially exposed.

17. The system as claimed in claim 16 wherein the encapsulant surrounds the inner interconnect and the outer interconnect.

18. The system as claimed in claim 16 further comprising:

a first component connected with the inner exposed contact surface; and

a second component mounted over the first component and connected with the outer exposed contact surface.

19. The system as claimed in claim 16 wherein the base circuit assembly includes the bottom substrate having the integrated circuit device thereon.

20. The system as claimed in claim 16 wherein the inner interconnect includes a vertical portion mounted to the bottom substrate between the integrated circuit device and the outer interconnect.