Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a package stack assembly, having a contact pad, on the base substrate; applying an encapsulation having a cavity with a tapered side directly over the package stack assembly, the contact pad exposed in the cavity; attaching a recessed circuitry unit in the cavity and on the contact pad, a chamber of the cavity formed by the recessed circuitry unit and the tapered side of the cavity; and mounting a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a base substrate having a package connector;
attaching a package stack assembly having a contact pad on a side of the base substrate opposite and facing away from the package connector;
applying an encapsulation having a cavity with a tapered side directly over the package stack assembly, the contact pad exposed in the cavity;
attaching a recessed circuitry unit having a non-horizontal side in the cavity, the recessed circuitry unit on the contact pad, a chamber of the cavity formed by the non-horizontal side and the tapered side of the cavity; and
mounting a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation; and
applying a thermal adhesive to the thermal structure, the encapsulation, and the recessed circuitry unit, the thermal adhesive separating the thermal structure from the encapsulation and the recessed circuitry unit.
2. The method as claimed in claim 1 further comprising applying an underfill around the contact pad between the recessed circuitry unit and the package stack assembly.
3. The method as claimed in claim 1 wherein applying the thermal adhesive includes applying the thermal adhesive in the chamber.
4. The method as claimed in claim 1 further comprising applying an underfill around the contact pad.
5. The method as claimed in claim 1 wherein applying the thermal adhesive includes attaching the thermal adhesive to the thermal structure, the recessed circuitry unit, and interior of the cavity.
6. An integrated circuit packaging system comprising:
a base substrate;
a package stack assembly having a contact pad attached on a side of the base substrate wherein the base substrate includes a package connector on a side of base substrate that faces away from the package stack assembly;
an encapsulation having a cavity with a tapered side applied directly over the package stack assembly, the contact pad exposed in the cavity;
a recessed circuitry unit in the cavity and on the contact pad, a chamber of the cavity formed by the recessed circuitry unit and the tapered side of the cavity, the recessed circuitry unit having a non-horizontal side and the cavity includes a chamber of the cavity formed by the non-horizontal side and the tapered side of the cavity;
a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation; and
a thermal adhesive applied to the thermal structure, the encapsulation, and the recessed circuitry unit, the thermal structure separated from the encapsulation and the recessed circuitry unit by the thermal adhesive.
7. The system as claimed in claim 6 further comprising an underfill applied around the contact pad between the recessed circuitry unit and the package stack assembly.
8. The system as claimed in claim 6 wherein the thermal adhesive is in the chamber.
9. The system as claimed in claim 6 further comprising an underfill around the contact pad.
10. The system as claimed in claim 6 wherein the thermal adhesive includes the thermal adhesive attached to the thermal structure, the recessed circuitry unit, and interior of the cavity.