Integrated circuit packaging system having a cavity

1. An integrated circuit packaging system comprising:

a carrier, having a carrier top side and a carrier bottom side, without an active device attached to the carrier bottom side;

an interconnect over the carrier;

a first encapsulation, having a cavity, around the interconnect over the carrier top side with the interconnect partially exposed from the first encapsulation, and with the carrier top side partially exposed with the cavity, the first encapsulation having a different material composition than the carrier; and

an integrated circuit within the cavity and over the first encapsulation.

2. The system as claimed in claim 1 wherein the integrated circuit is over the carrier top side.

3. The system as claimed in claim 1 wherein:

the integrated circuit is over the carrier; and further comprising:

a second encapsulation over the integrated circuit with the cavity filled with the second encapsulation.

4. The system as claimed in claim 1 wherein the first encapsulation is along the periphery of the carrier.

5. The system as claimed in claim 1 further comprising:

an integrated circuit package over the first encapsulation; and

a package interconnect between the integrated circuit package and the interconnect.

6. The system as claimed in claim 1 wherein:

the interconnect is formed in a vertical configuration; and

the first encapsulation is along the periphery of the carrier.

7. The system as claimed in claim 6 wherein the integrated circuit is over the carrier.

8. The system as claimed in claim 6 wherein the carrier top side includes a connection site attached to the interconnect.

9. The system as claimed in claim 6 further comprising the interconnect includes a solder ball.

10. The system as claimed in claim 6 further comprising an external interconnect attached to the carrier bottom side.