Granted Patent B2

US 9,070,611 · App. 13/193,664 · Granted Jun 30, 2015

Abstract

Claims (36)

1. An image sensor comprising:

a substrate layer of a first conductivity type;

a first contact for receiving a predetermined constant potential;

a second contact for receiving a time variant potential; and

a plurality of pixels with at least one pixel comprising:

a front-side photodetector of the first conductivity type disposed in the substrate layer adjacent to a front-side of the substrate layer;

a front-side pinning layer of a second conductivity type disposed in the front-side photodetector spanning the front-side photodetector, wherein the first contact is electrically connected to the front-side pinning layer;

a backside photodetector of the first conductivity type disposed in the substrate layer adjacent to a backside of the substrate layer;

a backside pinning layer of the second conductivity type spanning the backside photodetector, wherein the second contact is electrically connected to the backside pinning layer and the backside pinning layer being completely separated from the front-side pinning layer by a material of the first conductivity type such that the front-side pinning layer and the backside pinning layer are not in contact; and

an electrostatic barrier disposed in the substrate layer between the front-side photodetector and the backside photodetector, the time-variant potential configures the electrostatic barrier to one of: (i) electrically isolate the front-side photodetector and the backside photodetector and (ii) electrically couple the front-side photodetector and the backside photodetector as a function of the time-variant potential.

2. The image sensor as in claim 1 , wherein the backside pinning layer is further disposed in the substrate layer.

3. The image sensor as in claim 2 , wherein the backside pinning layer is continuous and connected for a subset of pixels, and isolated from adjacent subsets of pixels.

4. The image sensor as in claim 3 , wherein the subset of pixels comprises a row of pixels.

5. The image sensor as in claim 1 , wherein the at least one pixel further comprises:

a well of the second conductivity type disposed in the substrate layer adjacent to the front-side of the substrate layer;

a front-side transfer gate adjacent to the front-side photodetector; and

a charge to voltage conversion region of the first conductivity type disposed in the well adjacent to the transfer gate.

6. The image sensor as in claim 5 , wherein the at least one pixel further comprises a reset transistor with a reset gate.

7. The image sensor as in claim 1 , wherein the at least one pixel further comprises a reset transistor with a reset gate adjacent to the front-side photodetector.

8. The image sensor as in claim 1 , further comprising a color filter array disposed over the plurality of pixels, wherein a depth of the backside photodetector of a respective pixel is varied by pixel position corresponding to a color filter element of the color filter array associated with the respective pixel.

9. The image sensor as in claim 1 , wherein the image sensor comprises a back illuminated image sensor and a depth of the backside photodetector shields the front-side photodetector from visible light.

10. The image sensor as in claim 1 , further comprising:

a backside barrier region of the second conductivity type disposed in the substrate layer between at least two adjacent backside photodetectors; and

a lateral overflow drain of the first conductivity type disposed in the backside barrier region and connected to a potential.

11. The image sensor as in claim 1 , wherein the image sensor is disposed in an image capture device.

12. An image sensor comprising:

a substrate layer of a first conductivity type;

a first contact for receiving a predetermined constant potential;

a second contact for receiving a time-variant potential; and

a plurality of pixels with at least one pixel comprising:

a front-side photodetector of the first conductivity type disposed in the substrate layer adjacent to a front-side of the substrate layer;

a front-side pinning layer of a second conductivity type disposed in the front-side photodetector spanning the front-side photodetector, wherein the first contact is electrically connected to the front-side pinning layer;

a backside photodetector of the first conductivity type disposed in the substrate layer adjacent to a backside of the substrate layer;

a backside pinning layer of the second conductivity type spanning the backside photodetector, wherein the second contact is electrically connected to the backside pinning layer and the backside pinning layer being completely separated from the front-side pinning layer by a material of the first conductivity type such that the front-side pinning layer and the backside pinning layer are not in contact; and

fully depleted photodetector regions at the front-side photodetector and at the backside photodetector and a middle barrier region separating the fully depleted photodetector regions in response to the time-variant potential, the time-variant potential configures the middle barrier region to electrically isolate the front-side fully depleted photodetector region and the backside fully depleted photodetector region and to electrically couple the front-side fully depleted photodetector region and the backside fully depleted photodetector region as a function of the time-variant potential.

13. The image sensor as in claim 12 , wherein the front-side and backside photodetectors are formed by implants and wherein the front-side and backside photodetector implants are spaced from each other a predetermined distance to form the middle barrier region.

Assignments (10)