IP Library Granted Patent US 8,829,637
Granted Patent B2
US 8,829,637 · App. 13/193,667 · Granted Sep 9, 2014

Image sensor with controllable vertically integrated photodetectors using a buried layer

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Quick Facts
Patent No.
US 8,829,637
App. No.
13/193,667
Granted
Sep 9, 2014
Kind
B2
Abstract

An image sensor includes front-side and backside photodetectors of a first conductivity type disposed in a substrate layer of the first conductivity type. A front-side pinning layer of a second conductivity type is connected to a first contact. The first contact receives a predetermined potential. A backside pinning layer of the second conductivity type is connected to a second contact. The second contact receives an adjustable and programmable potential.

Claims (44)

1. An image sensor comprising:

a substrate layer of a first conductivity type;

a first conductive contact pad configured to receive a potential;

a second contact configured to receive an adjustable and programmable second potential;

a third contact configured to receive an adjustable and programmable third potential; and

a plurality of pixels with at least one pixel including:

a front-side photodetector of the first conductivity type disposed in the substrate layer adjacent to a front-side of the substrate layer;

a front-side pinning layer of a second conductivity type disposed in the front-side photodetector spanning the front-side photodetector, wherein the first conductive contact pad is directly electrically connected to the front-side pinning layer;

a backside photodetector of the first conductivity type disposed in the substrate layer adjacent to a backside of the substrate layer;

a backside pinning layer of the second conductivity type disposed in the backside photodetector spanning the backside photodetector, wherein the second contact is electrically connected to the backside pinning layer; and

a buried layer of the second conductivity type (i) configured to form an electrostatic barrier between the front-side photodetector and the backside photodetector, (ii) disposed in the substrate layer between the front-side photodetector and backside photodetector, and (iii) electrically connected to the third contact, the buried layer of the second conductivity type and the front side pinning layer being separated by a region of the first conductivity type and being electrically independent, and the buried layer of the second conductivity type and the back side pinning layer being separated by a region of the first conductivity type and being electrically independent.

2. The image sensor as in claim 1 , wherein the electrostatic barrier is responsive to particular potentials received by the second and third contacts.

3. The image sensor as in claim 1 , wherein the electrostatic barrier between the front-side photodetector and the backside photodetector is removable in response to potentials received by the second and third contacts.

4. The image sensor as in claim 3 , wherein an electrostatic potential of the backside photodetector defines an electric field for transfer of charge from the backside photodetector to the front-side photodetector.

5. The image sensor as in claim 3 , wherein an electrostatic potential of the backside photodetector defines an electric field for transfer of charge from the backside photodetector to the front-side photodetector.

6. The image sensor as in claim 1 , wherein the buried layer is continuous and connected for a subset of pixels and the buried layer is isolated from adjacent subsets of pixels.

7. The image sensor as in claim 6 , wherein the subset of pixels comprises a row of pixels.

8. The image sensor as in claim 6 , wherein at least one subset of pixels is configured to receive a first set of values of the second and third potentials, and at least one other subset of pixels is configured to receive a second set of values of the second and third potentials different from the first set of values.

9. The image sensor as in claim 6 , wherein at least one subset of pixels is configured to receive a first set of values of the second and third potentials, and at least one other subset of pixels is configured to receive a second set of values of the second and third potentials different from the first set of values.

10. The image sensor as in claim 1 , wherein the at least one pixel further comprises:

a connecting backside barrier region of the second conductivity type disposed in between at least two adjacent backside photodetectors, the backside barrier region having a shallower electrostatic potential than the two adjacent backside photodetectors; and

a lateral overflow drain of the first conductivity type disposed in the backside barrier region and connected to a fourth potential.

11. The image sensor as in claim 10 , wherein the fourth potential is adjustable and programmable.

12. The image sensor as in claim 1 , wherein a depth of backside photodetector is sufficient to shield the front-side photodetector from visible light.

13. The image sensor as in claim 1 , wherein the image sensor is included in an image capture device.

14. The image sensor as in claim 1 , wherein the buried layer defines a gap therethrough that is aligned with the front-side photodetector and the backside photodetector, a continuous region of the first conductivity type extending through the gap.

15. The image sensor as in claim 1 , wherein the electrostatic barrier is responsive to particular potentials received by the second and third contacts.

16. The image sensor as in claim 1 , wherein the electrostatic barrier between the front-side photodetector and the backside photodetector is removable in response to potentials received by the second and third contacts.

17. The image sensor as in claim 1 , wherein the buried layer is continuous and connected for a subset of pixels and the buried layer is isolated from adjacent subsets of pixels.

18. The image sensor as in claim 1 , wherein the at least one pixel further comprises:

a connecting backside barrier region of the second conductivity type disposed in between at least two adjacent backside photodetectors, the backside barrier region having a shallower electrostatic potential than the two adjacent backside photodetectors; and

a lateral overflow drain of the first conductivity type disposed in the backside barrier region and connected to a fourth potential.

19. The image sensor as in claim 1 , wherein the buried layer defines a gap therethrough that is aligned with the front-side photodetector and the backside photodetector, a continuous region of the first conductivity type extending through the gap.

20. An image sensor comprising:

a substrate layer of a first conductivity type;

a first contact configured to receive a potential;

a second contact configured to receive an adjustable and programmable second potential;

a third contact configured to receive an adjustable and programmable third potential; and

a plurality of pixels with at least one pixel including:

a front-side photodetector of the first conductivity type disposed in the substrate layer adjacent to a front-side of the substrate layer;

a front-side pinning layer of a second conductivity type disposed in the front-side photodetector spanning the front-side photodetector, wherein the first contact is electrically connected to the front-side pinning layer;

a backside photodetector of the first conductivity type disposed in the substrate layer adjacent to a backside of the substrate layer;

a backside pinning layer of the second conductivity type disposed in the backside photodetector spanning the backside photodetector, wherein the second contact is electrically connected to the backside pinning layer; and

a buried layer of the second conductivity type (i) configured to form an electrostatic barrier between the front-side photodetector and the backside photodetector, (ii) disposed in the substrate layer of the first conductivity type with the substrate layer of the first conductivity type disposed between the buried layer of the second conductivity type and the front-side photodetector and with the substrate layer of the first conductivity type disposed between the buried layer of the second conductivity type and the back-side photodetector, and (iii) electrically connected to the third contact, the buried layer of the second conductivity type and the front side pinning layer being separated by a region of the first conductivity type and being electrically independent, and the buried layer of the second conductivity type and the back side pinning layer being separated by a region of the first conductivity type and being electrically independent.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
RELEASE OF SECURITY INTEREST Recorded Sep 22, 2015
From: TRUESENSE IMAGING, INC
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 036656/0412 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2014
From: TRUESENSE IMAGING, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033460/0457 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT Recorded May 19, 2014
From: PNC BANK, NATIONAL ASSOCIATION
To: TRUESENSE IMAGING, INC.
Reel/Frame 032936/0167 →
CHANGE OF NAME Recorded Dec 29, 2011
From: IMAGE SENSOR TECHNOLOGIES ACQUISITION CORPORATION
To: TRUESENSE IMAGING, INC.
Reel/Frame 027463/0523 →
SECURITY AGREEMENT Recorded Dec 9, 2011
From: TRUESENSE IMAGING, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 027354/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2011
From: EASTMAN KODAK COMPANY
To: IMAGE SENSOR TECHNOLOGIES ACQUISITION CORPORATION
Reel/Frame 027328/0892 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2011
From: MCCARTEN, JOHN P.; GUIDASH, ROBERT MICHAEL
To: EASTMAN KODAK COMPANY
Reel/Frame 026672/0823 →