IP Library Granted Patent US 8,810,267
Granted Patent B2
US 8,810,267 · App. 13/238,010 · Granted Aug 19, 2014

Device identification and temperature sensor circuit

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Quick Facts
Patent No.
US 8,810,267
App. No.
13/238,010
Granted
Aug 19, 2014
Kind
B2
Abstract

An integrated circuit includes a device identification circuit and a temperature sensor diode connected in parallel from a common node. The device identification circuit includes a resistor connected to a diode-connected transistor. The device identification circuit and the temperature sensor diode are adapted to not be simultaneously operating in an ON state. A first voltage is applied to the common node to place the device identification circuit in an ON state and place the temperature sensor diode in an OFF state to identify the integrated circuit. A second voltage is applied to the common node to place the device identification circuit in an OFF state and place the temperature sensor diode in an ON state to determine a temperature of the integrated circuit.

Claims (33)

1. A method for identifying an integrated circuit and determining-a temperature of the integrated circuit, the method comprising:

using an identification circuit of the integrated circuit to identify the integrated circuit;

using a temperature sensor of the integrated circuit to determine the temperature of the integrated circuit,

wherein the identification circuit and the temperature sensor are connected in parallel;

operating the identification circuit to identify the integrated circuit while simultaneously preventing electrical current from flowing through the temperature sensor such that the temperature sensor is not operating; and

operating the temperature sensor to determine the temperature of the integrated circuit while simultaneously preventing electrical current from flowing through the identification circuit such that the identification circuit is not operating.

2. The method of claim 1 , wherein the identification circuit comprises a resistor connected to a diode-connected transistor.

3. The method of claim 1 , wherein the temperature sensor is a diode connected in parallel with the identification circuit.

4. The method of claim 2 , further comprising determining a resistance value of the resistor included in the identification circuit, the integrated circuit being identified based on the determined resistance value.

5. The method of claim 3 , wherein the identification circuit and the temperature-sensor diode are connected to a common node, the method further comprising applying a first voltage to the common node to place (i) the identification circuit in an ON state to identify the integrated circuit and (ii) the temperature-sensor diode in an OFF state.

6. The method of claim 5 , further comprising applying a second voltage to the common node to place (i) the identification circuit in an OFF state and (ii) the temperature-sensor diode in an ON state to determine the temperature of the integrated circuit.

7. The method of claim 1 , wherein temperature is measured by measuring an electrical parameter of the temperature sensor, comparing the measured parameter against a plurality of parameter values associated with known temperatures, and determining the temperature of the integrated circuit based on the comparison.

8. The method of claim 7 , wherein the temperature sensor comprises a diode and the electrical parameter is current through the diode.

9. The method of claim 7 , wherein the temperature sensor comprises a diode and the electrical parameter is voltage across the diode.

10. The method of claim 1 , further comprising placing the identification circuit in an ON state while simultaneously placing the temperature sensor in an OFF state.

11. The method of claim 1 , further comprising placing the temperature sensor in an ON state while simultaneously placing the identification circuit in an OFF state.

12. A method for identifying an integrated circuit and determining a temperature of the integrated circuit, the method comprising:

using an identification circuit of the integrated circuit to identify the integrated circuit; and

using a temperature sensor of the integrated circuit to determine the temperature of the integrated circuit;

wherein the temperature sensor is a diode, the identification circuit and the temperature-sensor diode being connected to a common node; and

applying a first voltage to the common node to place (i) the identification circuit in an ON state to identify the integrated circuit and (ii) the temperature-sensor diode in an OFF state such that electrical current is prevented from flowing through the temperature-sensor diode.

13. The method of claim 12 , further comprising applying a second voltage to the common node to place (i) the identification circuit in an OFF state such that electrical current is prevented from flowing through the identification circuit and (ii) the temperature-sensor diode in an ON state to determine the temperature of the integrated circuit.

14. The method of claim 12 , wherein the identification circuit comprises a resistor connected to a diode-connected transistor, further comprising determining a resistance value of the resistor included in the identification circuit, the integrated circuit being identified based on the determined resistance value.

15. The method of claim 12 , wherein temperature is measured by measuring an electrical parameter of the temperature sensor, comparing the measured parameter against a plurality of parameter values associated with known temperatures, and determining the temperature of the integrated circuit based on the comparison.

16. The method of claim 15 , wherein the electrical parameter is current through the temperature-sensor diode.

17. The method of claim 15 , wherein the electrical parameter is voltage across the temperature-sensor diode.

18. A method for identifying an integrated circuit and determining a temperature of the integrated circuit, the method comprising:

using an identification circuit of the integrated circuit to identify the integrated circuit; and

using a temperature sensor of the integrated circuit to determine the temperature of the integrated circuit;

wherein the identification circuit and the temperature sensor are connected to a common node; and

applying a first voltage to the common node to place (i) the identification circuit in an ON state to identify the integrated circuit and (ii) the temperature sensor in an OFF state such that electrical current is prevented from flowing through the temperature sensor.

19. The method of claim 18 , further comprising applying a second voltage to the common node to place (i) the identification circuit in an OFF state such that electrical current is prevented from flowing through the identification circuit and (ii) the temperature sensor in an ON state to determine the temperature of the integrated circuit.

20. The method of claim 18 , wherein the temperature sensor is a diode, wherein temperature is measured by measuring an electrical parameter of the temperature sensor, comparing the measured parameter against a plurality of parameter values associated with known temperatures, and determining the temperature of the integrated circuit based on the comparison.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
RELEASE OF SECURITY INTEREST Recorded Sep 22, 2015
From: TRUESENSE IMAGING, INC
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 036656/0412 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2014
From: TRUESENSE IMAGING, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033460/0457 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT Recorded May 19, 2014
From: PNC BANK, NATIONAL ASSOCIATION
To: TRUESENSE IMAGING, INC.
Reel/Frame 032936/0167 →
CHANGE OF NAME Recorded Dec 29, 2011
From: IMAGE SENSOR TECHNOLOGIES ACQUISITION CORPORATION
To: TRUESENSE IMAGING, INC.
Reel/Frame 027463/0523 →
SECURITY AGREEMENT Recorded Dec 9, 2011
From: TRUESENSE IMAGING, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 027354/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2011
From: EASTMAN KODAK COMPANY
To: IMAGE SENSOR TECHNOLOGIES ACQUISITION CORPORATION
Reel/Frame 027328/0892 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2011
From: WANG, SHEN; NELSON, EDWARD T.
To: EASTMAN KODAK COMPANY
Reel/Frame 026939/0600 →