Integrated circuit packaging system with stack device

1. An integrated circuit packaging system comprising:

a base substrate;

a molded under-fill on the base substrate;

a substrate contact extender formed through the molded under-fill and in direct contact with the base substrate, the substrate contact extender includes a cone shape;

a stack device mounted over the molded under-fill;

a coupling connector attached from the substrate contact extender to the stack device; and

a base encapsulation formed on the stack device, the substrate contact extender, and encapsulating the coupling connector, wherein the base encapsulation is in direct contact with an under-fill top side of the molded under-fill.

2. The system as claimed in claim 1 wherein:

the stack device includes a redistribution layer;

the base encapsulation includes a cavity exposing the redistribution layer at a non-periphery portion of the stack device; and

further comprising:

a package interconnect on the redistribution layer.

3. The system as claimed in claim 1 further comprising:

a base integrated circuit on the base substrate;

a chip contact extender through the molded under-fill and in direct contract with the base integrated circuit;

an intermediate flip chip on the chip contact extender; and

wherein:

the base encapsulation encapsulates the intermediate flip chip.

4. The system as claimed in claim 1 further comprising:

a base integrated circuit having a base bond pad mounted on the base substrate;

a chip contact extender through the molded under-fill and in direct contact with the base bond pad;

an intermediate wire-bonded chip mounted over the molded under-fill;

an intermediate interconnect attached from the chip contact extender to an active side of the intermediate wire-bonded chip; and

wherein:

the base encapsulation encapsulates the intermediate wire-bonded chip.