Integrated circuit packaging system with heat conduction and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

mounting an integrated circuit over the substrate;

mounting a lid base over the substrate, the lid base having:

a base indentation and a hole with the integrated circuit within the hole,

a cavity below the base indentation, and

a leg portion, wherein a first leg portion is below a substrate bottom side of the substrate and a second leg portion is directly on a substrate non-horizontal side of the substrate;

attaching a thermal interface layer to the integrated circuit;

attaching a base-slug adhesive layer to the lid base, the base-slug adhesive layer within the cavity; and

mounting a heat slug directly on the thermal interface layer over the integrated circuit, the heat slug having:

a slug non-horizontal side partially within the base indentation, and

a slug bottom side with the base-glue adhesive layer directly on portions of the slug non-horizontal side and the slug bottom side.

2. The method as claimed in claim 1 wherein mounting the heat slug includes mounting the heat slug having a slug protrusion, the slug protrusion extending from the slug bottom side and partially within the base indentation.