Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die
View Patent ↗A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.
1. A semiconductor device, comprising:
a substrate;
a semiconductor die disposed over the substrate; and
a dispensing needle disposed in fluid communication across a width of the semiconductor die and including an outlet disposed adjacent to a gap between the semiconductor die and the substrate.
2. The semiconductor device of claim 1 , further including an underfill material deposited between the semiconductor die and the substrate.
3. The semiconductor device of claim 1 , wherein a width of the dispensing needle is substantially equal to the width of the semiconductor die.
4. The semiconductor device of claim 1 , wherein the dispensing needle includes a T-shaped shank.
5. The semiconductor device of claim 1 , wherein the outlet comprises a first edge longer than a second edge.
6. A semiconductor device, comprising:
a substrate;
a semiconductor die disposed over the substrate;
a stationary dispensing needle disposed in fluid communication with the semiconductor die, the stationary dispensing needle including a width substantially equal to a width of the semiconductor die; and
an underfill material deposited between the semiconductor die and the substrate.
7. The semiconductor device of claim 6 , wherein the dispensing needle includes a plurality of pole portions between a shank and an outlet.
8. The semiconductor device of claim 6 , wherein the dispensing needle includes a T-shaped shank.
9. The semiconductor device of claim 6 , wherein the dispensing needle includes a plate between a shank and an outlet.
10. The semiconductor device of claim 6 , wherein the dispensing needle includes an outlet comprising a first edge substantially equal to a second edge.
11. The semiconductor device of claim 6 , wherein the dispensing needle includes an outlet comprising a first edge longer than a second edge.
12. A semiconductor device, comprising:
a substrate;
a semiconductor die disposed over the substrate;
a stationary dispensing needle disposed in fluid communication across a width of the semiconductor die; and
an underfill material deposited between the semiconductor die and the substrate.
13. The semiconductor device of claim 12 , wherein a width of the dispensing needle is substantially equal to the width of the semiconductor die.
14. The semiconductor device of claim 12 , wherein the dispensing needle includes a plurality of pole portions between a shank and an outlet.
15. The semiconductor device of claim 12 , wherein the dispensing needle includes a T-shaped shank.
16. The semiconductor device of claim 12 , wherein the dispensing needle includes a plate between a shank and an outlet.
17. The semiconductor device of claim 12 , wherein the dispensing needle includes an outlet comprising a first edge substantially equal to a second edge.
18. The semiconductor device of claim 12 , wherein the dispensing needle includes an outlet comprising a first edge longer than a second edge.