Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
View Patent ↗A semiconductor device has a first thermally conductive layer formed over a first surface of a semiconductor die. A second surface of the semiconductor die is mounted to a sacrificial carrier. An encapsulant is deposited over the first thermally conductive layer and sacrificial carrier. The encapsulant is planarized to expose the first thermally conductive layer. A first insulating layer is formed over the second surface of the semiconductor die and a first surface of the encapsulant. A portion of the first insulating layer over the second surface of the semiconductor die is removed. A second thermally conductive layer is formed over the second surface of the semiconductor die within the removed portion of the first insulating layer. An electrically conductive layer is formed within the insulating layer around the second thermally conductive layer. A heat sink can be mounted over the first thermally conductive layer.
1. A semiconductor device, comprising:
a semiconductor die;
a first thermally conductive layer formed over a first surface of the semiconductor die;
an encapsulant deposited around the semiconductor die;
a second thermally conductive layer formed over a second surface of the semiconductor die opposite the first surface of the semiconductor die; and
a first interconnect structure formed over a first surface of the encapsulant.
2. The semiconductor device of claim 1 , wherein the first interconnect structure includes:
an insulating layer formed over the first surface of the encapsulant; and
a conductive layer formed over the first surface of the encapsulant.
3. The semiconductor device of claim 1 , further including a conductive via formed through the semiconductor die between the first thermally conductive layer and second thermally conductive layer.
4. The semiconductor device of claim 1 , further including:
a second interconnect structure formed over a second surface of the encapsulant opposite the first surface of the encapsulant; and
a conductive via formed through the encapsulant between the first interconnect structure and second interconnect structure.
5. The semiconductor device of claim 1 , further including a conductive bump formed between the semiconductor die and first interconnect structure.
6. The semiconductor device of claim 1 , further including a heat sink mounted over the semiconductor die.
7. A semiconductor device, comprising:
a first semiconductor component;
a first thermally conductive layer formed over a first surface of the first semiconductor component;
an encapsulant deposited around the first semiconductor component; and
a first interconnect structure formed over a first surface of the encapsulant.
8. The semiconductor device of claim 7 , further including a second thermally conductive layer formed over a second surface of the first semiconductor component opposite the first surface of the first semiconductor component.
9. The semiconductor device of claim 7 , further including a conductive via formed through the first semiconductor component.
10. The semiconductor device of claim 7 , further including a second interconnect structure formed over a second surface of the encapsulant opposite the first surface of the encapsulant.
11. The semiconductor device of claim 8 , further including a third thermally conductive layer formed over the first thermally conductive layer.
12. The semiconductor device of claim 7 , further including a second semiconductor component mounted to the first thermally conductive layer opposite the first semiconductor component.
13. The semiconductor device of claim 12 , further including a second thermally conductive layer formed over the second semiconductor component.
14. A semiconductor device, comprising:
a first semiconductor component;
a first thermally conductive layer formed over a first surface of the first semiconductor component; and
a first interconnect structure formed over a second surface of the first semiconductor component opposite the first surface of the first semiconductor component, the first interconnect structure including a second thermally conductive layer disposed over the first semiconductor component.
15. The semiconductor device of claim 14 , further including an encapsulant deposited around the first semiconductor component.
16. The semiconductor device of claim 14 , further including a conductive via formed through the first semiconductor component.
17. The semiconductor device of claim 14 , further including a second interconnect structure formed over the first surface of the first semiconductor component.
18. The semiconductor device of claim 14 , further including a second semiconductor component mounted to the first thermally conductive layer opposite the first semiconductor component.
19. The semiconductor device of claim 14 , further including a heat sink mounted over the first semiconductor component.
20. A semiconductor device, comprising:
a first semiconductor component;
a first thermally conductive layer formed over a first surface of the first semiconductor component; and
a second thermally conductive layer formed over a second surface of the first semiconductor component opposite the first surface of the first semiconductor component.
21. The semiconductor device of claim 20 , further including an encapsulant deposited around the first semiconductor component.
22. The semiconductor device of claim 20 , further including an interconnect structure formed over the first surface or the second surface of the first semiconductor component.
23. The semiconductor device of claim 20 , further including a conductive via formed through the first semiconductor component between the first thermally conductive layer and second thermally conductive layer.
24. The semiconductor device of claim 20 , further including a second semiconductor component mounted to the first thermally conductive layer opposite the first semiconductor component.