Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.
1. A method of manufacture of an integrated circuit package comprising:
providing a package carrier having a dispense port;
attaching a first integrated circuit to the package carrier and over the dispense port;
attaching an internal interconnect between the first integrated circuit and a top side of the package carrier;
attaching a second integrated circuit to the first integrated circuit, the second integrated circuit in a non-center offset configuration from the first integrated circuit;
attaching a bond wire between the second integrated circuit and the top side of the package carrier;
placing a mold chase over the first integrated circuit, the second integrated circuit, the internal interconnect and the bond wire, the mold chase on the package carrier and having a hole;
forming an encapsulation through the dispense port and the hole, the encapsulation surrounding the first integrated circuit, the second integrated circuit, the internal interconnect, and the bond wire including completely filled in a space between the first integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached; and
attaching an external interconnect to a bottom side of the package carrier with the bottom side facing away from first integrated circuit and the second integrated circuit.
2. The method as claimed in claim 1 wherein injecting the encapsulation includes injecting the encapsulation through the dispense port with the hole connected to a vacuum suction.
3. The method as claimed in claim 1 wherein:
providing the package carrier includes providing the package carrier having more than one of the dispense port; and
injecting the encapsulation includes injecting the encapsulation through the more than one of the dispense port.
4. The method as claimed in claim 1 wherein attaching the first integrated circuit includes attaching a flip chip to the package carrier, and wherein attaching the second integrated circuit includes attaching a wirebond integrated circuit to the flip chip.