Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package
View Patent ↗A semiconductor device includes a semiconductor die. An encapsulant is disposed around the semiconductor die to form a peripheral area. An interconnect structure is formed over a first surface of the semiconductor die and encapsulant. A plurality of vias is formed partially through the peripheral area of the encapsulant and offset from the semiconductor die. A portion of the encapsulant is disposed over a second surface of the semiconductor die opposite the first surface. The plurality of vias comprises a depth greater than a thickness of the portion of the encapsulant. A first portion of the plurality of vias is formed in a row offset from a side of the semiconductor die. A second portion of the plurality of vias is formed as an array of vias offset from a corner of the semiconductor die. A repair material disposed within the plurality of vias.
1. A semiconductor device, comprising:
a semiconductor die;
an encapsulant disposed over the semiconductor die and physically contacting a first surface of the semiconductor die;
an interconnect structure formed over a first surface of the encapsulant and over an active surface of the semiconductor die opposite the first surface of the semiconductor die; and
a plurality of vias formed partially through a second surface of the encapsulant opposite the first surface of the encapsulant with a portion of the encapsulant remaining between the vias and the first surface of the encapsulant, wherein a first area of the second surface of the encapsulant at a corner of the semiconductor device includes a greater number of the vias than a second area of the second surface of the encapsulant equal in size to the first area, the second area extending from a side surface of the semiconductor die to an edge of the semiconductor device.
2. The semiconductor device of claim 1 , wherein a depth of the vias is greater than a distance between the first surface of the semiconductor die and the second surface of the encapsulant.
3. The semiconductor device of claim 1 , wherein a depth of a first via of the plurality of vias is different from a depth of a second via of the plurality of vias.
4. The semiconductor device of claim 1 , wherein a diameter of a first via of the plurality of vias is 100-500 micrometers.
5. The semiconductor device of claim 1 , wherein a diameter of a first via of the plurality of vias is different from a diameter of a second via of the plurality of vias.
6. A semiconductor device, comprising:
a semiconductor die;
an encapsulant disposed around the semiconductor die;
a plurality of vias formed through a first surface of the encapsulant with a first portion of the encapsulant remaining between the vias and a second surface of the encapsulant opposite the first surface of the encapsulant, wherein a first area of the encapsulant at a corner of the semiconductor device includes a greater number of the vias than a second area of the encapsulant equal in size to the first area and located between a side surface of the semiconductor die and an edge of the semiconductor device; and
a conductive layer formed over the second surface of the encapsulant and a first surface of the semiconductor die.
7. The semiconductor device of claim 6 , wherein:
a second portion of the encapsulant is disposed over a second surface of the semiconductor die opposite the first surface of the semiconductor die; and
a depth of the vias is greater than a thickness of the second portion of the encapsulant.
8. The semiconductor device of claim 6 , wherein:
a depth (Dl) of the vias is less than a distance (D 2 ) extending from the first surface of the encapsulant to the second surface of the encapsulant; and
a ratio of Dl:D 2 is less than or equal to 4:5.
9. The semiconductor device of claim 6 , further including a repair material disposed within the vias.
10. The semiconductor device of claim 9 , wherein a surface of the repair material is recessed below or coplanar with the first surface of the encapsulant.
11. The semiconductor device of claim 6 , further including a support layer comprising an insulating material disposed over the semiconductor die and encapsulant.
12. The semiconductor device of claim 11 , wherein the vias are formed through the support layer.
13. A semiconductor device, comprising:
a semiconductor die;
an encapsulant disposed around the semiconductor die;
a plurality of vias formed in a first surface of the encapsulant with a first portion of the encapsulant disposed between the vias and a second surface of the encapsulant opposite the first surface of the encapsulant; and
a repair material disposed in the vias and physically contacting the encapsulant along a sidewall of the vias.
14. The semiconductor device of claim 13 , further including an interconnect structure formed over the semiconductor die and encapsulant.
15. The semiconductor device of claim 13 , wherein the vias are formed in a row offset from a side surface of the semiconductor die.
16. The semiconductor device of claim 13 , wherein a surface of the repair material is coplanar with or recessed below the first surface of the encapsulant.
17. The semiconductor device of claim 13 , further including a support layer comprising an insulating material disposed over the semiconductor die and encapsulant.
18. The semiconductor device of claim 17 , wherein the vias are formed through the support layer.
19. The semiconductor device of claim 13 , wherein a density of a first group of the vias at a corner of the semiconductor device is greater than a density of a second group of the vias offset from a side surface of the semiconductor die.
20. The semiconductor device of claim 13 , wherein the vias are formed offset from a corner of the semiconductor die.
21. The semiconductor device of claim 13 , wherein a second portion of the encapsulant is disposed over a surface of the semiconductor die and a depth of the vias is greater than a distance between the surface of the semiconductor die and the first surface of the encapsulant.