Methods of forming conductive and insulating layers
View Patent ↗Methods of forming conductive and insulating layers for semiconductor devices and packages. Substrate is provided with integrated circuit device and interconnect structure mounted thereon, the interconnect structure adjacent the integrated circuit device. The integrated circuit device and portions of the interconnect structure can be covered with an encapsulation exposing a portion of the interconnect structure. Conductive material is formed over the exposed portion of the interconnect structure by a depositing process followed by a heating process to alter the chemical properties of the conductive material. Optionally, a dispersing process may be incorporated.
1. A method of making a semiconductor device comprising:
providing a substrate;
disposing a first semiconductor die over a surface of the substrate with an active surface of the first semiconductor die oriented toward the substrate;
disposing an interconnect structure over the surface of the substrate adjacent to the first semiconductor die, wherein a surface of the interconnect structure is substantially coplanar with a back surface opposite the active surface of the first semiconductor die;
disposing an encapsulation material around the first semiconductor die and the interconnect structure;
disposing an insulating material over the encapsulation material and contacting the back surface of the first semiconductor die; and
forming a first conductive material over a portion of the interconnect structure and the insulating material by,
(i) depositing the first conductive material over the portion of the interconnect structure and the insulating material including a first state, wherein the first state comprises a liquid, viscous, or paste form, and
(ii) heating the first conductive material from the first state to a second state different from the first state, wherein the second state comprises a solid, crystal, or sintered form.
2. The method of claim 1 , further comprising disposing a semiconductor package over the first conductive material, the semiconductor package including a second semiconductor die.
3. The method of claim 2 , further comprising forming a plurality of external interconnects over the substrate, opposite the first semiconductor die.
4. The method of claim 1 , further comprising treating the portion of the interconnect structure with a deflashing process.
5. The method of claim 1 , wherein the first conductive material includes silver (Ag), platinum (Pt), gold (Au), copper (Cu), carbon nanotube (CNT), graphene, organic metal, or mixtures thereof.
6. The method of claim 1 , further comprising treating the portion of the interconnect structure with hydrophilic plasma.
7. The method of claim 1 , further comprising forming a second conductive material over the first conductive material, the second conductive material and the first conductive material including substantially similar geometric footprints.
8. A method of making a semiconductor device comprising:
providing a substrate;
disposing a first semiconductor die over a surface of the substrate;
providing an interconnect structure by,
(i) providing a core including a non-conductive polymeric material, and
(i) forming an outer layer over the core;
disposing the interconnect structure over the surface of the substrate adjacent to the first semiconductor die;
disposing an encapsulation material over and around the first semiconductor die and interconnect structure after disposing the first semiconductor die and interconnect structure over the substrate;
forming a conductive material over a portion of the interconnect structure and the encapsulation material by,
(i) depositing the conductive material including a first state, and
(ii) heating the conductive material from the first state to a second state, wherein the second state is different from the first state; and
disposing an isolating material over the encapsulation material.
9. The method of claim 8 , further comprising disposing a semiconductor package over the conductive material and the isolating material, the semiconductor package including a second semiconductor die.
10. The method of claim 9 , further comprising forming a plurality of external interconnects over the substrate, opposite the first semiconductor die.
11. The method of claim 8 , further comprising treating the portion of the interconnect structure with a deflashing process.
12. The method of claim 8 , wherein the isolating material includes dielectric ink, dielectric paste, thermosetting resin, or mixtures thereof.
13. The method of claim 8 , further comprising treating the portion of the interconnect structure with hydrophilic plasma.
14. A method of making a semiconductor device comprising:
providing a substrate;
disposing a first semiconductor die over a surface of the substrate;
disposing an interconnect structure over the surface of the substrate adjacent to the first semiconductor die;
disposing an encapsulation material around the first semiconductor die and interconnect structure after disposing the first semiconductor die and interconnect structure over the substrate;
disposing an isolating material over the encapsulation material;
printing a first conductive ink over a portion of the interconnect structure and the isolating material; and
curing the conductive ink over the isolating material by heating.
15. The method of claim 14 , further including printing the first conductive ink using an inkjet head comprising a plurality of nozzles.
16. The method of claim 14 , further including printing a second conductive ink over the first conductive ink.
17. The method of claim 14 , further including treating a portion of the interconnect structure with a deflashing process.
18. The method of claim 14 , wherein providing the interconnect structure further includes:
providing a core; and
forming an outer layer over the core.
19. The method of claim 18 , wherein the core includes a non-conductive polymeric material.
20. A method of making a semiconductor device comprising:
providing a substrate;
disposing a first semiconductor die over a surface of the substrate;
disposing an interconnect structure over the surface of the substrate adjacent to the first semiconductor die;
disposing an encapsulation material over the first semiconductor die and the interconnect structure; and
printing a first conductive ink over a portion of the interconnect structure and the encapsulation material; and
curing the first conductive ink by heating.
21. The method of claim 20 , further including printing the first conductive ink using an inkjet head comprising a plurality of nozzles.
22. The method of claim 20 , further including printing a second conductive ink over the first conductive ink.
23. The method of claim 20 , further including treating a portion of the interconnect structure with a deflashing process.
24. The method of claim 20 , wherein providing the interconnect structure further includes:
providing a core; and
forming an outer layer over the core.
25. The method of claim 24 , wherein the core includes a non-conductive polymeric material.