IP Library Granted Patent US 9,568,597
Granted Patent B2
US 9,568,597 · App. 13/965,490 · Granted Feb 14, 2017

Ultrasound capacitive T/R switch device, circuit

Inventors: Benedict Choy (Cupertino, CA); Ching Chu (San Jose, CA); Andy Tu (Saratoga, CA)
Assignee: Microchip Technology Inc.
G01S7/52017
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Quick Facts
Patent No.
US 9,568,597
App. No.
13/965,490
Granted
Feb 14, 2017
Kind
B2
Abstract

An ultrasound image system has a plurality of channels. At least one of the plurality of channels has a capacitive T/R switch.

Claims (64)

1. An ultrasound image system comprising:

a plurality of channels, wherein at least one of the plurality of channels has a capacitive T/R switch and a piezo transducer element coupled to the capacitive T/R switch.

2. The ultrasound imaging system of claim 1 , wherein the capacitive T/R switch comprises:

a pair of capacitive diodes; and

a pair of bleed resistors coupled to the pair of capacitive diodes.

3. The ultrasound system of claim 1 , wherein the capacitive T/R switch comprises:

a first variable capacitive diode, a terminal of the first variable capacitive diode forming a first terminal of the T/R switch;

a second variable capacitive diode, a terminal of the second variable capacitive diode forming a second terminal of the T/R switch; and

a pair of bleed resistors coupled to the first variable capacitive diode and the second variable capacitive diode.

4. The ultrasound imaging system of claim 1 , further comprising a bias control device coupled to the capacitive T/R switch.

5. The ultrasound imaging system of claim 3 , further comprising a bias control device coupled to a third terminal of the capacitive T/R switch.

6. The ultrasound imaging system of claim 1 , wherein the at last one channel comprises:

a Tx pulser;

a pair of isolation diodes coupled to the Tx pulser;

and

an Rx circuit coupled to a second terminal of the capacitive T/R switch;

wherein the piezo transducer element is coupled to the pair of isolation diodes and to a first terminal of the capacitive T/R switch.

7. The ultrasound imaging system of claim 6 , wherein the Rx circuit comprises:

a pair of diode protectors coupled to the second terminal of the capacitive T/R switch;

a coupling capacitor coupled to the pair of diode protectors; and

a low noise preamplifier coupled to the coupling capacitor.

8. The ultrasound imaging system of claim 1 , wherein the capacitive T/R switch generates a C-V curve having a rapidly capacitance falling area between near zero and knee point of voltages.

9. The ultrasound imaging system of claim 1 , wherein the capacitive T/R switch is a semiconductor device comprising:

an N-type substrate having a plurality of trenches formed therein;

a P-type poly-Silicon material formed within each of the plurality of trenches; and

metal layers applied to the N-type substrate and the P-type poly-Silicon to form terminals of the capacitive T/R switch.

10. The ultrasound imaging system of claim 1 , wherein the capacitive T/R switch is a semiconductor device comprising:

a P-type substrate having a plurality of trenches formed therein;

a N-type poly-Silicon material formed within each of the plurality of trenches; and

metal layers applied to the P-type substrate and the N-type poly-Silicon to form terminals of the capacitive T/R switch.

11. The ultrasound imaging system of claim 9 , wherein a junction capacitance of at least two of the trenches changes with a terminal voltage.

12. The ultrasound imaging system of claim 9 , wherein a junction capacitance of at least two of the trenches changes with a terminal voltage, the junction capacitance having a C-V curve having a rapid dC/dV turning knee point.

13. An ultrasound image system comprising:

a plurality of channels, wherein each channel comprises:

a Tx pulser;

a pair of isolation diodes coupled to the Tx pulser;

a piezo transducer element coupled to the pair of isolation diodes

a T/R switch having a first terminal coupled to the piezo transducer; and

an Rx circuit coupled to a second terminal of the T/R switch;

wherein the T/R switch of at least one of the plurality of channels is a capacitive T/R switch.

14. The ultrasound imaging system of claim 13 , wherein the capacitive T/R switch comprises:

a pair of diodes; and

a pair of bleed resistors coupled to the pair of diodes.

15. The ultrasound imaging system of claim 13 , wherein the capacitive T/R switch comprises:

a first variable capacitive diode, an anode of the first variable capacitive diode forming a first terminal of the T/R switch;

a second variable capacitive diode, an anode of the second variable capacitive diode forming a second terminal of the T/R switch; and

a pair of bleed resistors coupled to the first variable capacitive diode and the second variable capacitive diode.

16. The ultrasound imaging system of claim 13 , further comprising a bias control device coupled to a third terminal of the capacitive T/R switch.

17. The ultrasound imaging system of claim 13 , wherein the capacitive T/R switch generates a C-V curve having a rapidly capacitance falling area between near zero and knee point of voltages.

18. The ultrasound imaging system of claim 12 , wherein the capacitive T/R switch is a semiconductor device comprising:

an N-type substrate having a plurality of trenches formed therein;

a P-type poly-Silicon material formed within each of the plurality of trenches; and

metal layers applied to the N-type substrate and the P-type poly-Silicon to form terminals of the capacitive T/R switch.

19. The ultrasound imaging system of claim 12 , wherein the capacitive T/R switch is a semiconductor device comprising:

n P-type substrate having a plurality of trenches formed therein;

a N-type poly-Silicon material formed within each of the plurality of trenches; and

metal layers applied to the P-type substrate and the N-type poly-Silicon to form terminals of the capacitive T/R switch.

20. The ultrasound imaging system of claim 18 , wherein a junction capacitance of at least two of the trenches changes with a terminal voltage.

21. A capacitive T/R switch comprising:

a pair of capacitive diodes; and

a pair of bleed resistors coupled to the pair of capacitive diodes.

22. The capacitive T/R switch of claim 21 , wherein the pair of diodes comprises:

a first variable capacitive diode, a terminal of the first variable capacitive, diode forming a first terminal of the T/R switch; and

a second variable capacitive diode, a terminal of the second variable capacitive diode forming a second terminal of the T/R switch.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
CHANGE OF NAME Recorded Apr 4, 2016
From: SUPERTEX, INC.
To: SUPERTEX LLC
Reel/Frame 038337/0407 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2016
From: SUPERTEX LLC
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 038048/0307 →
CHANGE OF NAME Recorded Mar 21, 2016
From: SUPERTEX, INC.
To: SUPERTEX LLC
Reel/Frame 038179/0962 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 13, 2013
From: CHOY, BENEDICT C.K.; CHU, CHING; TU, ANDY
To: SUPERTEX, INC.
Reel/Frame 030997/0864 →
Continuity (1)
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