Wafer center finding with kalman filter
A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
1. A device comprising:
a robotic arm having an end effector for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm;
a linear array of charge coupled devices coupled to the robotic arm, the linear array of charge coupled devices being configured to capture edge data from the wafer, resting on the end effector, to provide an actual position of the wafer; and
a processor configured
to apply an extended Kalman filter to the encoder data to provide an estimated position of the wafer,
determine an error between the actual position of the wafer and the estimated position of the wafer, and
update one or more variables for the extended Kalman filter based upon the error.
2. The device of claim 1 , wherein the processor is configured to recalculate the estimated position of the wafer each time edge data is received.
3. The device of claim 1 , wherein the processor is configured to determine the estimated position of the wafer with reference to the end effector of the robotic arm.
4. The device of claim 1 , wherein the processor is configured to determine the estimated position of the wafer and the actual position of the wafer with reference to a center axis of the robotic arm.
5. The device of claim 1 , further comprising a wafer handling device wherein the robotic arm is disposed within the wafer handling device and is configured to move the wafer between two openings of the wafer handling device.
6. The device of claim 1 , further comprising a wafer handling device having openings configured for connection to a load lock and a process module, the robotic arm being disposed within the wafer handling device and being configured to move the wafer between the load lock and the process module.
7. The device of claim 1 , wherein the estimated position of the wafer includes a wafer center.
8. The device of claim 1 , wherein the estimated position of the wafer includes a wafer radius.
9. The device of claim 1 , wherein the end effector includes a rotating chuck configured to support the wafer on the end effector, the linear array of charge coupled devices being disposed relative to the rotating chuck to capture the edge data from the wafer disposed on the rotating chuck.
10. The device of claim 9 , wherein the processor is configured to effect detection of an alignment feature of the wafer from the edge data.
11. The device of claim 1 , further comprising at least another linear array of charge coupled devices positioned so that the linear array of charge coupled devices and the at least another linear array of charge coupled devices capture edge data at different locations around an edge of the wafer.
12. The device of claim 1 , comprising a power source coupled to the linear array of charge coupled devices, the power source being configured to wirelessly provide power to the linear array of charge coupled devices.
13. A method comprising:
disposing a linear array of charge-coupled devices coupled to a robotic arm including an end effector adapted to handle a wafer;
providing one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm;
applying the encoder data to an extended Kalman filter to provide an estimated position of the wafer;
handling the wafer and capturing edge data from the wafer, resting on the end effector, with the linear array of charge-coupled devices to provide an actual position of the wafer;
determining an error between the actual position of the wafer and the estimated position of the wafer; and
updating one or more variables for the extended Kalman filter based upon the error.
14. The method of claim 13 , further wherein applying the encoder data includes recalculating the estimated position of the wafer each time edge data is received.
15. The method of claim 13 , wherein the estimated position of the wafer includes a wafer center.
16. The method of claim 13 , wherein the estimated position of the wafer includes a wafer radius.
17. The method of claim 13 , wherein the estimated position of the wafer is determined with reference to the end effector of the robotic arm.
18. The method of claim 13 , wherein the estimated position of the wafer and the actual position of the wafer are determined with reference to a center axis of the robotic arm.
19. The method of claim 13 , wherein the robotic arm is disposed within a wafer handling device and handling the wafer includes moving the wafer between two openings of the wafer handling device.
20. The method of claim 13 , wherein the robotic arm is disposed within a wafer handling device and handling the wafer includes moving the wafer between a load lock and a process module connected to the wafer handling device.