IP Library Granted Patent US 9,355,734
Granted Patent B2
US 9,355,734 · App. 14/196,839 · Granted May 31, 2016

Sensing circuits for use in low power nanometer flash memory devices

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Quick Facts
Patent No.
US 9,355,734
App. No.
14/196,839
Granted
May 31, 2016
Kind
B2
Abstract

Improved sensing circuits for use in low power nanometer flash memory devices are disclosed.

Claims (41)

1. A sensing circuit for use in a memory device, comprising:

a memory data read block for sensing a selected memory cell;

a memory reference read block for sensing a reference memory cell;

a differential amplifier block comprising a first capacitor comprising a first terminal and a second terminal, a second capacitor comprising a first terminal and a second terminal, a precharge circuit for charging the second terminal of the first capacitor and the second terminal of the second capacitor prior to a sensing operation, and an output;

wherein the first terminal of the first capacitor is connected to the memory data read block and the second terminal of the first capacitor is connected to the differential amplifier block and the first terminal of the second capacitor is connected to the memory reference read block and the second terminal of the second capacitor is connected to the differential amplifier block;

wherein during the sensing operation the output of the differential amplifier block indicates a value stored in the selected memory cell.

2. The sensing circuit of claim 1 , wherein the selected memory cell is a split gate flash memory cell.

3. The sensing circuit of claim 2 , wherein the reference memory cell is a split gate flash memory cell.

4. The sensing circuit of claim 1 , wherein the precharge circuit comprises a plurality of switches that turn on before the sensing operation and turn off during the sensing operation.

5. The sensing circuit of claim 4 , wherein one of the plurality of switches when turned on connects a sensed node of the memory data read block to a voltage source.

6. The sensing circuit of claim 5 , wherein one of the plurality of switches when turned on connects a sensed node of the memory reference read block to a voltage source.

7. The sensing circuit of claim 1 , wherein the memory data read block comprises a current source, a cascading sensing NMOS transistor, a bitline clamp NMOS transistor, and a diode connected sensing load PMOS transistor.

8. The sensing circuit of claim 7 , wherein the memory reference read block comprises a current source, a reference bitline clamp NMOS transistor, a cascading sensing NMOS transistor, and a diode connected sensing load PMOS transistor.

9. The sensing circuit of claim 8 , wherein the differential amplifier block further comprises input differential pair NMOS transistors, current mirror load PMOS transistors, and output PMOS transistor, a current bias NMOS transistor, and an output current bias NMOS transistor.

10. The sensing circuit of claim 1 , wherein the differential amplifier includes a cross coupled inverter pair in the differential input path.

11. The sensing circuit of claim 1 , wherein the memory reference read block supplies a replica reference bias.

12. A method of determining the value stored in a selected memory cell, comprising:

precharging a first terminal of a first capacitor and a first terminal of a second capacitor using a precharge circuit;

sensing a selected memory cell at a sensed node using a memory data read block;

sensing a reference memory cell at a reference node using a memory reference read block;

comparing the sensed node and the reference node using the differential amplifier block, the differential amplifier block comprising the first capacitor, the second capacitor, and an output, and wherein a second terminal of the first capacitor is connected to the memory data read block and the first terminal of the first capacitor is connected to the differential amplifier block and a second terminal of the second capacitor is connected to the memory reference read block and the first terminal of the second capacitor is connected to the differential amplifier block; and

indicating at the output of the differential amplifier block a value stored in the selected memory cell.

13. The method of claim 12 , wherein the selected memory cell is a split gate flash memory cell.

14. The method of claim 13 , wherein the reference memory cell is a split gate flash memory cell.

15. The method of claim 12 , wherein the precharge circuit comprises a plurality of switches, and wherein the precharging step comprises turning on the plurality of switches.

16. The method of claim 15 , wherein the precharging step comprises connecting the sensed node of the memory data read block to a voltage source.

17. The method of claim 16 , wherein precharging step further comprises connecting the sensed node of the reference read block to a voltage source.

18. The method of claim 12 , wherein the memory data read block comprises a current source, a cascading sensing NMOS transistor, a bitline clamp NMOS transistor, and a diode connected sensing load PMOS transistor.

19. The method of claim 18 , wherein the memory reference read block comprises a current source, a reference bitline clamp NMOS transistor, a cascading sensing NMOS transistor, and a diode connected sensing load PMOS transistor.

20. The method of claim 19 , wherein the differential amplifier block further comprises input differential pair NMOS transistors, current mirror load PMOS transistors, an output PMOS transistor, a current bias NMOS transistor, and an output current bias NMOS transistor.

21. A method of determining a value stored in a selected memory cell, comprising:

precharging a first terminal of a first capacitor and a first terminal of a second capacitor using a precharge circuit;

sensing a selected memory cell at a sensed node using a memory data read block;

sensing a reference memory cell at a reference node using a memory reference read block;

comparing the sensed node and the reference node during a ramping period using the differential amplifier block, the differential amplifier block comprising the first capacitor, the second capacitor, and an output, wherein a second terminal of the first capacitor is connected to the memory data read block and the first terminal of the first capacitor is connected to the differential amplifier block and a second terminal of the second capacitor is connected to the memory reference read block and the first terminal of the second capacitor is connected to the differential amplifier block; and

indicating at the output of the differential amplifier block the value stored in the selected memory cell.

22. The method of claim 21 , wherein the selected memory cell is a split gate flash memory cell.

23. The method of claim 21 , wherein the sensed node is ramping down in the sensing period.

24. The method of claim 21 , wherein the reference node is ramping up in the sensing period.

25. The method of claim 21 , wherein the differential amplifier block comprises a comparator.

26. The method of claim 25 , wherein the comparator is a single comparator.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2014
From: TRAN, HIEU VAN; NGUYEN, HUNG QUOC; LY, ANH; VU, THUAN
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 032681/0222 →