IP Library Granted Patent US 9,664,571
Granted Patent B2
US 9,664,571 · App. 14/560,342 · Granted May 30, 2017

Digital temperature sensor with integrated timer and burst mode

Inventors: Ezana Aberra (Austin, TX); Patrick Richards (Peoria, AZ)
Assignee: MICROCHIP TECHNOLOGY INCORPORATED
G01K1/00G01K7/01G01K2219/00
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Quick Facts
Patent No.
US 9,664,571
App. No.
14/560,342
Granted
May 30, 2017
Kind
B2
Abstract

An integrated temperature sensor device has a temperature sensor providing an analog signal corresponding to an ambient temperature, an analog-to-digital converter coupled to the sensor conditioning circuit and receiving the analog temperature signal, and a timer and control circuit which is operable to be configured to control the temperature sensor device to perform a sequence of temperature measurements and shut-down time periods, wherein multiple temperature measurements are taken during the measurement period, wherein the timer and control circuit is further operable to be programmed to set the number of temperature measurements and the length of the shut-down period.

Claims (26)

1. Integrated temperature sensor device comprising:

a temperature sensor coupled with a sensor conditioning circuit providing a single analog signal, wherein the temperature sensor is biased by the sensor conditioning circuit such that an ambient temperature can be derived from the single analog signal;

an analog-to-digital converter coupled to the sensor conditioning circuit and receiving the single analog signal; and

a timer and control circuit which is configured to perform a sequence of temperature measurement periods and shut-down time periods, wherein multiple temperature measurements are taken during each measurement period and the integrated temperature sensor device is switched into a low power mode during the shut-down time periods, wherein the timer and control circuit is programmable to set a number of temperature measurements and a length of the shut-down period.

2. The integrated temperature sensor device according to claim 1 , wherein the number of measurements ranges between 2 and 128.

3. The integrated temperature sensor device according to claim 1 , further comprising a power control unit configured to switch the integrated temperature sensor device into a sleep mode during the shut-down period.

4. The integrated temperature sensor device according to claim 1 , wherein the programmable length of the shut-down period ranges from 0.5 to 128 seconds.

5. The integrated temperature sensor device according to claim 1 , wherein the control circuit comprises an averaging circuit for averaging a plurality of temperature values received during each sequence of temperature measurements.

6. The integrated temperature sensor device according to claim 5 , wherein the control circuit comprises a comparator for comparing each temperature value or an averaged temperature value with a threshold value.

7. The integrated temperature sensor device according to claim 6 , wherein the device comprises an external connection coupled with the comparator for output of an alert signal.

8. The integrated temperature sensor device according to claim 1 , wherein the sensor element is a semiconductor diode and wherein the conditioning circuit biases the semiconductor diode such that the analog signal is proportional to the temperature or has a known linear or non-linear relationship.

9. The integrated temperature sensor device according to claim 1 , further comprising a temperature register coupled with the analog-to-digital converter for storing the output of the analog-to-digital converter.

10. The integrated temperature sensor device according to claim 5 , further comprising an average register coupled with the control circuit for storing the average temperature value.

11. The integrated temperature sensor device according to claim 1 , further comprising a digital filter coupled with the analog-to-digital converter.

12. The integrated temperature sensor device according to claim 11 , further comprising a filter register coupled with the digital filter for storing the filtered temperature value.

13. The integrated temperature sensor device according to claim 1 , further comprising a control register coupled with a digital filter for storing filter coefficients of a programmable digital filter.

14. The integrated temperature sensor device according to claim 13 , wherein the control register is set to 0 to disable the digital filter and/or wherein the control register selects one of a plurality of predefined filter coefficients.

15. The integrated temperature sensor device according to claim 1 , further comprising a serial interface.

16. The integrated temperature sensor device according to claim 15 , wherein the serial interface is selected form the group consisting of SPI, I2C, or a single wire serial interface.

17. Integrated temperature sensor device comprising:

a diode coupled with a sensor conditioning circuit providing a voltage signal, wherein the diode is biased by the sensor conditioning circuit such that an ambient temperature can be derived from the voltage signal;

an analog-to-digital converter coupled to the sensor conditioning circuit and receiving the voltage signal; and

a timer and control circuit which is configured to perform a sequence of temperature measurement periods and shut-down time periods, wherein multiple temperature measurements are taken during each measurement period and the integrated temperature sensor device is switched into a low power mode during the shut-down time periods, wherein the timer and control circuit is programmable to set a number of temperature measurements and a length of the shut-down period.

18. The integrated temperature sensor device according to claim 17 , wherein the control circuit comprises an averaging circuit for averaging a plurality of temperature values received during each sequence of temperature measurements.

19. The integrated temperature sensor device according to claim 17 , wherein the voltage signal is proportional to the temperature or has a known linear or non-linear relationship.

20. The integrated temperature sensor device according to claim 19 , further comprising memory storing a table for retrieving a temperature value depending on a measured voltage.

Assignments (16)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2026
From: MICROCHIP TECHNOLOGY INCORPORATED; MICROCHIP TECHNOLOGY IRELAND LIMITED; MICROSEMI SOC CORPORATION; ATMEL CORPORATION; SILICON STORAGE TECHNOLOGY, INC.; MICROCHIP TECHNOLOGY GERMANY GMBH
To: CRESTONE IP MANAGEMENT, LLC
Reel/Frame 075979/0008 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2014
From: ABERRA, EZANA; RICHARDS, PATRICK
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 034479/0448 →
Continuity (2)
Provisional Application 61921183 · Dec 27, 2013
Related Publication 20150185082A1 · Jul 2, 2015