IP Library Granted Patent US 9,542,051
Granted Patent B2
US 9,542,051 · App. 14/566,183 · Granted Jan 10, 2017

Analog elimination of ungrounded conductive objects in capacitive sensing

Inventors: Burke Davison (Chandler, AZ); Xiang Gao (Chandler, AZ); Yann LeFaou (Chandler, AZ)
Assignee: MICROCHIP TECHNOLOGY INCORPORATED
G06F3/044H03K17/962H03K2017/9606H03K2017/9613H03K2217/960705H03K2217/960725H03K2217/960765H03K2217/960775
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Quick Facts
Patent No.
US 9,542,051
App. No.
14/566,183
Granted
Jan 10, 2017
Kind
B2
Abstract

In a method for performing a touch determination with a capacitive sensor, a self capacitance measurement of a capacitive sensor is initiated, wherein at the same time a mutual capacitance measurement including the capacitive sensor is performed. Such a method can be performed such that the self capacitance measurement and the mutual capacitance measurement differentially cancel with ungrounded conductive objects approaching or touching the capacitive sensor and additively combine for grounded objects approaching or touching the capacitive sensor.

Claims (31)

1. A method for performing a touch determination with a capacitive sensor, comprising:

performing a calibration method, wherein the calibration method is performed before performing the touch determination, the calibration method comprising:

performing an individual self capacitance measurement and storing a first measurement value;

performing an individual mutual capacitance measurement and storing a second measurement value; and

calculating a scale factor from said first and second measurement values;

initiating a self capacitance measurement of a capacitive sensor, wherein at the same time a mutual capacitance measurement including the capacitive sensor is performed; and

applying said scale factor to said self capacitance or said mutual capacitance measurement.

2. The method according to claim 1 , wherein after the sensor has been set to a high impedance state during the self capacitance measurement, capacitively coupling a pulse into the capacitive sensor for performing the mutual capacitance measurement.

3. The method according to claim 2 , wherein a shield or guard electrode is arranged in proximity to the capacitive sensor to provide a capacitive coupling.

4. The method according to claim 1 , wherein the self capacitance measurement is a capacitive voltage divider measurement.

5. The method according to claim 1 , wherein the self capacitance measurement is a charge time measurement.

6. A method for performing a touch determination with a capacitive sensor, comprising:

performing a calibration method to determine a scaling factor, wherein the calibration method is performed before performing the touch determination, the calibration method comprising:

performing an individual self capacitance measurement and storing a first measurement value;

performing an individual mutual capacitance measurement and storing a second measurement value; and

calculating a scaling factor from said first and second measurement values;

initiating a self capacitance measurement of a capacitive sensor,

initiating a mutual capacitance measurement including the capacitive sensor;

performing a scaling of either an output value of the self capacitance measurement or the mutual capacitance measurement; and

combining the output values of the self capacitance measurement and the mutual capacitance measurement.

7. The method according to claim 6 , wherein combining the output values comprises adding the output values.

8. The method according to claim 6 , wherein a shield or guard electrode is arranged in proximity to the capacitive sensor to provide a capacitive coupling.

9. The method according to claim 6 , wherein the self capacitance measurement is a capacitive voltage divider measurement.

10. The method according to claim 6 , wherein the self capacitance measurement is a charge time measurement.

11. A method for performing a touch determination with a capacitive sensor, comprising:

performing a calibration method, wherein the calibration method is performed before performing the touch determination, the calibration method comprising:

performing an individual self capacitance measurement and storing a first measurement value;

performing an individual mutual capacitance measurement and storing a second measurement value; and

calculating a scale factor from said first and second measurement values;

initiating a self capacitance measurement of a capacitive sensor, wherein at the same time a mutual capacitance measurement including the capacitive sensor is performed such that the self capacitance measurement and the mutual capacitance measurement differentially cancel with ungrounded conductive objects approaching or touching said capacitive sensor and additively combine for grounded objects approaching or touching said capacitive sensor; and

applying said scale factor to said self capacitance or said mutual capacitance measurement.

Assignments (16)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2026
From: MICROCHIP TECHNOLOGY INCORPORATED; MICROCHIP TECHNOLOGY IRELAND LIMITED; MICROSEMI SOC CORPORATION; ATMEL CORPORATION; SILICON STORAGE TECHNOLOGY, INC.; MICROCHIP TECHNOLOGY GERMANY GMBH
To: CRESTONE IP MANAGEMENT, LLC
Reel/Frame 075979/0008 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2014
From: DAVISON, BURKE; GAO, XIANG; LEFAOU, YANN
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 034479/0820 →
Continuity (2)
Provisional Application 62068450 · Oct 24, 2014
Related Publication 20160117014A1 · Apr 28, 2016