IP Library Granted Patent US 9,672,930
Granted Patent B2
US 9,672,930 · App. 14/726,124 · Granted Jun 6, 2017

Low power operation for flash memory system

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Quick Facts
Patent No.
US 9,672,930
App. No.
14/726,124
Granted
Jun 6, 2017
Kind
B2
Abstract

The present invention relates to a circuit and method for low power operation in a flash memory system. In disclosed embodiments of a selection-decoding circuit path, pull-up and pull-down circuits are used to save values at certain output nodes during a power save or shut down modes, which allows the main power source to be shut down while still maintaining the values.

Claims (52)

1. A non-volatile memory device comprising:

a first circuit capable of operating in a shut down mode, wherein during shut down mode:

a power source for the first circuit is shut down;

a first node in the first circuit is selectively connected to a second circuit that drives the first node to a high level and maintains the high level after the power source for the first circuit is shut down; and

a second node in the first circuit is selectively connected to a third circuit that drives the second node to a low level and maintains the low level after the power source for the first circuit is shut down.

2. The memory device of claim 1 , wherein the first circuit is a decoder circuit.

3. The memory device of claim 1 , wherein the first circuit is a test mode circuit.

4. The memory device of claim 2 , further comprising a bulk voltage coupled to bulks of one or more transistors in the decoder circuit.

5. The memory device of claim 2 , wherein the decoder circuit comprises a row decoder circuit.

6. The memory device of claim 1 , wherein the first node is selectively connected to the second circuit through a first switch.

7. The memory device of claim 6 , wherein the second node is selectively connected to the third circuit through a second switch.

8. The memory device of claim 1 , wherein a third node in the first circuit is selectively connected to the second circuit that drives the third node to a high level.

9. The memory device of claim 1 , wherein a fourth node in the first circuit is selectively connected to the third circuit that drives the fourth node to a low level.

10. The memory device of claim 8 , wherein a fourth node in the first circuit is selectively connected to the third circuit that drives the fourth node to a low level.

11. The method of claim 1 , wherein the first node and second node hold the same level from shut down mode to active mode.

12. A method of executing a shut down mode in a non-volatile memory device comprising a first circuit, the method comprising:

asserting a signal that indicates the shut down mode;

in response to the signal, shutting down a power source for the first circuit;

selectively connecting a first node in the first circuit to a second circuit that drives the first node to a high level and maintains the high level after the shutting down step; and

selectively connecting a second node in the first circuit to a third circuit that drives the second node to a low level and maintains the low level after the shutting down step.

13. The method of claim 12 , wherein the first circuit is a decoder circuit.

14. The method of claim 12 , wherein the first circuit is a test mode circuit.

15. The method of claim 13 , further comprising coupling a bulk voltage to bulks of one or more transistors in the decoder circuit.

16. The method of claim 13 , wherein the decoder circuit comprises a row decoder circuit.

17. The method of claim 12 , wherein the step of selectively connecting the first node to the second circuit comprises closing a first switch.

18. The method of claim 17 , wherein the step of selectively connecting the second node to the third circuit comprises closing a second switch.

19. The method of claim 12 , further comprising selectively connecting a third node in the first circuit to the second circuit to drive he third node to a high level.

20. The method of claim 12 , further comprising selectively connecting a fourth node in the first circuit to the third circuit to drive the fourth node to a low level.

21. The method of claim 19 , further comprising selectively connecting a fourth node in the first circuit to the third circuit to drive the fourth node to a low level.

22. The method of claim 12 , wherein the first node and second node hold the same level from shut down mode to active mode.

23. A method of executing a shut down mode in a non-volatile memory device comprising a first circuit, the method comprising:

asserting a signal that indicates the shut down mode;

in response to the signal, shutting down a power source for the first circuit;

selectively connecting a first node in the first circuit to a second circuit that drives the first node to a high level and maintains the high level after the shutting down step; and

selectively connecting a second node in the first circuit to a third circuit that drives the second node to a low level and maintains the low level after the shutting down step.

24. A method of executing a shut down mode in a non-volatile memory device comprising a first circuit, the method comprising:

asserting a signal that indicates the shut down mode;

in response to the signal, shutting down a power source for the first circuit;

selectively connecting a first node in the first circuit to a second circuit that drives the first node to a high level; and

selectively connecting a second node in the first circuit to a third circuit that drives the second node to a low level;

wherein the first node and second node hold the same level from shut down mode to active mode;

asserting a shut down mode for circuit blocks comprising an array, row decoder, column decoder, high voltage decoder, sensing block, data out block, testmode block, trimbits-live block, trimbits block, command decoder, data in block, analog low voltage block, analog high voltage block, non-volatile controller, and

not asserting the shut down mode for circuit blocks comprising a power sequence controller, pin interface, and global power switch during a hard power down mode.

25. The method of claim 23 , further comprising:

asserting the shut down mode for circuit blocks comprising part of an array, part of a row decoder, part of a column decoder, part of a high voltage decoder, part of a sensing block, data out block, testmode block, trimbits block, data in block, analog high voltage block, non-volatile controller, and

not asserting the shut down mode for circuit blocks comprising trimbits-live block, command decoder, analog low voltage block, power sequence controller, pin interface, and global power switch in a standby mode.

26. The method of claim 23 , further comprising:

asserting the shut down mode for circuit blocks comprising part of an array, part of a row decoder, part of a column decoder, part of a high voltage decoder, part of a sensing block, testmode block, trimbits block, data in block, analog high voltage block, non-volatile controller, and

not asserting the shut down mode for circuit blocks comprising data out block, trimbits-live block, command decoder, analog low voltage block, power sequence controller, pin interface, and global power switch in the active mode.

27. The method of claim 23 , further comprising:

asserting the shut down mode for circuit blocks comprising part of an array, part of a row decoder, part of a column decoder, part of a high voltage decoder, sensing block, data out block, testmode block, and

not asserting the shut down mode for circuit blocks comprising trimbits-live block, trimbits block, command decoder, data in block, analog low voltage block, analog high voltage block, non-volatile controller, power sequence controller, pin interface, and global power switch in the non-volatile operation mode.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2015
From: TRAN, HIEU VAN; VU, THUAN; LY, ANH; NGUYEN, HUNG QUOC; NGUYEN, VIET TAN
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 035974/0518 →