Using interrupted through-silicon-vias in integrated circuits adapted for stacking
In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack.
1. An integrated circuit apparatus comprising:
a semiconductor substrate;
an active circuit and interconnect layer provided on said semiconductor substrate;
a plurality of vias extending through said semiconductor substrate from said active circuit and interconnect layer to a surface of said semiconductor substrate opposite said active circuit and interconnect layer;
a plurality of bottom bond pads provided on said surface, said bond pads axially aligned with and electrically connected to respective ones of said vias; and
a plurality of top bond pads on said active circuit and interconnect layer, each top bond pad being axially aligned with its respective one of said vias, a first top bond pad of said top bond pads being electrically connected to its respective first via, and a second top bond pad of said top bond pads being:
electrically isolated relative to its respective second via; and
electrically coupled to an offset via that is offset from the respective second via.
2. The integrated circuit apparatus of claim 1 wherein the second top bond pad is offset from the first top bond pad in a first direction, the offset via is offset from the associated axially aligned via in a second direction, and the first direction and the second direction form an angle.
3. The integrated circuit apparatus of claim 2 wherein the angle is 45°.
4. The integrated circuit apparatus of claim 2 wherein the angle is 90°.
5. The integrated circuit apparatus of claim 2 wherein the angle is 180°.
6. The integrated circuit apparatus of claim 1 wherein each bond pad is connected to a solder ball.
7. The integrated circuit apparatus of claim 2 wherein the angle is 0°.
8. The integrated circuit apparatus of claim 1 wherein the respective first via and the offset via are the same via.
9. The integrated circuit apparatus of claim 1 wherein the respective first via and the offset via are the different vias.