IP Library Granted Patent US 10,312,248
Granted Patent B2
US 10,312,248 · App. 14/935,201 · Granted Jun 4, 2019

Virtual ground non-volatile memory array

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Quick Facts
Patent No.
US 10,312,248
App. No.
14/935,201
Granted
Jun 4, 2019
Kind
B2
Abstract

A memory device with memory cell pairs each having a single continuous channel region, first and second floating gates over first and second portions of the channel region, an erase gate over a third portion of the channel region between the first and second channel region portions, and first and second control gates over the first and second floating gates. For each of the pairs of memory cells, the first region is electrically connected to the second region of an adjacent pair of memory cells in the same active region, and the second region is electrically connected to the first region of an adjacent pair of the memory cells in the same active region.

Claims (32)

1. A memory device, comprising:

a substrate of semiconductor material of a first conductivity type;

spaced apart isolation regions formed on the substrate which are substantially parallel to one another and have lengths that extend in a first direction, with an active region between each pair of adjacent isolation regions also having lengths extending in the first direction;

each of the active regions including a plurality of pairs of memory cells, each of the memory cell pairs includes:

first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a continuous channel region in the substrate extending entirely between the first and second regions,

a first floating gate disposed vertically over and insulated from a first portion of the channel region adjacent to the first region,

a second floating gate disposed vertically over and insulated from a second portion of the channel region adjacent to the second region,

an erase gate disposed vertically over and insulated from a third portion of the channel region between the first and second channel region portions,

a first control gate disposed vertically over and insulated from the first floating gate, and

a second control gate disposed vertically over and insulated from the second floating gate;

wherein the pairs of memory cells are configured in an array such that for each of the pairs of memory cells, the channel region extends entirely from the first region to the second region in the first direction, the first region is electrically connected to the second region of an adjacent pair of memory cells in the same active region, and the second region is electrically connected to the first region of an adjacent pair of the memory cells in the same active region;

a plurality of first control gate lines having lengths extending in a second direction orthogonal to the first direction and each electrically connected to one of the first control gates in each of the active regions;

a plurality of second control gate lines having lengths extending in the second direction and each electrically connected to one of the second control gates in each of the active regions;

a plurality of bit lines having lengths extending in the second direction and each electrically connected to one of the first regions and one of the second regions in each of the active regions; and

a plurality of erase gate lines having lengths extending in the first direction and each electrically connected to the erase gates in one of the active regions;

wherein the erase gate lines are metal lines having lengths extending in the first direction and are disposed vertically over the active regions and electrically connected to the erase gates via vertically extending contacts.

2. A memory device, comprising:

a substrate of semiconductor material of a first conductivity type;

spaced apart isolation regions formed on the substrate which are substantially parallel to one another and have lengths that extend in a first direction, with an active region between each pair of adjacent isolation regions also having lengths extending in the first direction;

each of the active regions including a plurality of pairs of memory cells, each of the memory cell pairs includes:

first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a continuous channel region in the substrate extending entirely between the first and second regions,

a first floating gate disposed vertically over and insulated from a first portion of the channel region adjacent to the first region,

a second floating gate disposed vertically over and insulated from a second portion of the channel region adjacent to the second region,

an erase gate disposed vertically over and insulated from a third portion of the channel region between the first and second channel region portions,

a first control gate disposed vertically over and insulated from the first floating gate, and

a second control gate disposed vertically over and insulated from the second floating gate;

wherein the pairs of memory cells are configured in an array such that for each of the pairs of memory cells, the channel region extends entirely from the first region to the second region in the first direction, the first region is electrically connected to the second region of an adjacent pair of memory cells in the same active region, and the second region is electrically connected to the first region of an adjacent pair of the memory cells in the same active region;

a plurality of first control gate lines having lengths extending in a second direction orthogonal to the first direction and each electrically connected to one of the first control gates in each of the active regions;

a plurality of second control gate lines having lengths extending in the second direction and each electrically connected to one of the second control gates in each of the active regions;

a plurality of bit lines having lengths extending in the second direction and each electrically connected to one of the first regions and one of the second regions in each of the active regions; and

a plurality of erase gate lines having lengths extending in the first direction and each electrically connected to the erase gates in one of the active regions;

wherein each of the erase gates extends into one of the isolation regions, and wherein the erase gate lines are metal lines having lengths extending in the first direction and are disposed vertically over the isolations regions and electrically connected to the erase gates via vertically extending contacts in the isolation regions.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2016
From: TRAN, HIEU VAN; NGUYEN, HUNG QUOC; DO, NHAN
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 038431/0112 →