IP Library Granted Patent US 9,634,018
Granted Patent B2
US 9,634,018 · App. 15/050,309 · Granted Apr 25, 2017

Split gate non-volatile memory cell with 3D finFET structure, and method of making same

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Quick Facts
Patent No.
US 9,634,018
App. No.
15/050,309
Granted
Apr 25, 2017
Kind
B2
Abstract

A non-volatile memory cell including a semiconductor substrate having a fin shaped upper surface with a top surface and two side surfaces. Source and drain regions are formed in the fin shaped upper surface portion with a channel region there between. A conductive floating gate includes a first portion extending along a first portion of the top surface, and second and third portions extending along first portions of the two side surfaces, respectively. A conductive control gate includes a first portion extending along a second portion of the top surface, second and third portions extending along second portions of the two side surfaces respectively, a fourth portion extending up and over at least some of the floating gate first portion, and fifth and sixth portions extending out and over at least some of the floating gate second and third portions respectively.

Claims (43)

1. A non-volatile memory cell comprising:

a semiconductor substrate of a first conductivity type having a fin shaped upper surface portion having a top surface and two side surfaces;

spaced apart first and second regions of a second conductivity type different than the first conductivity type in the fin shaped upper surface portion, with a channel region extending between the first region and the second region;

wherein the channel region has a first portion that includes a first portion of the top surface and first portions of the two side surfaces, and has a second portion that includes a second portion of the top surface and second portions of the two side surfaces,

a conductive floating gate that includes:

a first portion that extends along and is insulated from the first portion of the top surface,

a second portion that extends along and is insulated from the first portion of one of the two side surfaces, and

a third portion that extends along and is insulated from the first portion of the other of the two side surfaces;

a conductive control gate that includes:

a first portion that extends along and is insulated from the second portion of the top surface,

a second portion that extends along and is insulated from the second portion of one of the two side surfaces,

a third portion that extends along and is insulated from the second portion of the other of the two side surfaces,

a fourth portion that extends up and over and is insulated from at least some of the floating gate first portion,

a fifth portion that extends out and over and is insulated from at least some of the floating gate second portion, and

a sixth portion that extends out and over and is insulated from at least some of the floating gate third portion.

2. The non-volatile memory cell of claim 1 , wherein the floating gate includes a sloping upper surface that terminates in a sharp edge that faces and is insulated from the control gate.

3. The non-volatile memory cell of claim 1 , wherein the channel region first portion is adjacent to the first region, and the channel region second portion is adjacent to the second region.

4. The non-volatile memory cell of claim 3 , wherein the floating gate partially extends over the first region.

5. A non-volatile memory array comprising:

a semiconductor substrate of a first conductivity type having a plurality of parallel fin shaped upper surface portions extending in a first direction each having a top surface and two side surfaces;

a plurality of memory cells formed on each one of the fin shaped upper surface portions, wherein each memory cell includes:

spaced apart first and second regions of a second conductivity type different than the first conductivity type in the one fin shaped upper surface portion, with a channel region extending between the first region and the second region;

wherein the channel region has a first portion that includes a first portion of the top surface and first portions of the two side surfaces, and has a second portion that includes a second portion of the top surface and second portions of the two side surfaces,

a conductive floating gate that includes:

a first portion that extends along and is insulated from the first portion of the top surface,

a second portion that extends along and is insulated from the first portion of one of the two side surfaces, and

a third portion that extends along and is insulated from the first portion of the other of the two side surfaces;

a conductive control gate that includes:

a first portion that extends along and is insulated from the second portion of the top surface,

a second portion that extends along and is insulated from the second portion of one of the two side surfaces,

a third portion that extends along and is insulated from the second portion of the other of the two side surfaces,

a fourth portion that extends up and over and is insulated from at least some of the floating gate first portion,

a fifth portion that extends out and over and is insulated from at least some of the floating gate second portion, and

a sixth portion that extends out and over and is insulated from at least some of the floating gate third portion;

a plurality of control gate lines each extending in a second direction perpendicular to the first direction and electrically connected to one of the control gates for each of the fin shaped upper surface portions.

6. The non-volatile memory array of claim 5 , further comprising:

a plurality of parallel diffusion lines in the substrate extending in the second direction, wherein each diffusion line is electrically connected to two of the first regions in each of the fin shaped upper surface portions.

7. The non-volatile memory array of claim 5 , further comprising:

a plurality of contacts each extending from and electrically connected to two of the first regions; and

a plurality of source lines extending in the second direction and electrically connected to one of the plurality of contacts for each of the fin shaped upper surface portions.

8. The non-volatile memory array of claim 5 , wherein each of the floating gates includes a sloping upper surface that terminates in a sharp edge that faces and is insulated from one of the control gates.

9. The non-volatile memory array of claim 5 , wherein each of the channel region first portions is adjacent to one of the first regions, and each of the channel region second portions is adjacent to one of the second regions.

10. The non-volatile memory array of claim 9 , wherein each of the floating gates partially extends over one of the first regions.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2016
From: SU, CHIEN-SHENG; YANG, JENG-WEI; WU, MAN-TANG; CHEN, CHUN-MING; TRAN, HIEU VAN; DO, NHAN
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 038431/0074 →