IP Library Granted Patent US 10,775,820
Granted Patent B2
US 10,775,820 · App. 15/782,145 · Granted Sep 15, 2020

On chip NMOS gapless LDO for high speed microcontrollers

Inventors: Raghuveer Murukumpet (Bangalore, IN); James Bartling (Chandler, AZ)
Assignee: MICROCHIP TECHNOLOGY INCORPORATED
G05F1/575G05F1/461G05F1/565H03F1/0211H03F3/45179
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Quick Facts
Patent No.
US 10,775,820
App. No.
15/782,145
Granted
Sep 15, 2020
Kind
B2
Abstract

A voltage regulator includes an error amplifier configured to amplify a difference between a feedback voltage and a reference voltage. The regulator also includes an N-type metal-oxide-semiconductor (NMOS) driver circuit. The driver circuit includes an n-type field effect transistor. The driver circuit is communicatively coupled to output of the error amplifier. The regulator further includes a feedback circuit communicatively coupled between the NMOS driver circuit and an input of the error amplifier to provide the feedback voltage.

Claims (50)

1. A voltage regulator, comprising:

a first error amplifier configured to amplify a difference between a feedback voltage and a reference voltage;

an N-type metal-oxide-semiconductor (NMOS) driver circuit, including an n-type field effect transistor, communicatively coupled to output of the first error amplifier;

a feedback circuit communicatively coupled between the NMOS driver circuit and an input of the first error amplifier to provide the feedback voltage;

a pump circuit configured to pump current into a gate node of the NMOS driver circuit, wherein an amount of the current is based upon a size of a voltage spike above the reference voltage on an output of the NMOS driver circuit;

a first delay buffer; and

a second delay buffer of a different length than the first delay buffer;

wherein:

a difference between trip voltage of the first delay buffer and the second delay buffer is configured to define a trip voltage for the voltage spike above the reference voltage;

the first delay buffer and the second delay buffer are mutually exclusive;

the first delay buffer and the second delay buffer are both configured to receive input from a same source; and

the second delay buffer is configured to drive a gate of the pump circuit to pump current into the gate node of the NMOS driver circuit.

2. The voltage regulator of claim 1 , further comprising the pump circuit configured to pump current into the gate node of the NMOS driver circuit upon a transient voltage drop at the output of the NMOS driver circuit.

3. The voltage regulator of claim 1 , further comprising a discharge circuit configured to discharge the gate node of the NMOS driver circuit upon a transient voltage overshoot at the output of the NMOS driver circuit.

4. The voltage regulator of claim 1 , further comprising a load connected to output of the NMOS driver circuit, the output of the NMOS driver circuit configured to provide power to the load, the load without a load capacitor connected in parallel between ground and a connection between the output of the NMOS driver circuit and the load.

5. The voltage regulator of claim 1 , further comprising a buffer circuit communicatively coupled to the output of the NMOS driver circuit and configured to signal to a discharge circuit configured to discharge the gate node of the NMOS driver circuit upon a transient voltage overshoot.

6. The voltage regulator of claim 5 , wherein the buffer circuit includes a plurality of inverters with a trip voltage corresponding to the transient voltage overshoot.

7. The voltage regulator of claim 1 , further comprising a buffer circuit communicatively coupled to the output of the NMOS driver circuit and configured to signal to the pump circuit configured to pump current into the gate node of the NMOS driver circuit upon a transient voltage drop.

8. The voltage regulator of claim 7 , wherein the buffer circuit includes a plurality of inverters.

9. The voltage regulator of claim 1 , further comprising the pump circuit configured to pump increased current into the gate node of the NMOS driver circuit based upon an increased load applied to the output of the NMOS driver circuit.

10. The voltage regulator of claim 1 , wherein the first delay buffer and the second delay buffer each include a plurality of elements.

11. The voltage regulator of claim 1 , further comprising a second error amplifier configured to receive output from the NMOS driver circuit, compare the output from the NMOS driver circuit with the reference voltage, and provide output to the first delay buffer and to the second delay buffer.

12. A microcontroller, comprising:

a first error amplifier configured to amplify a difference between a feedback voltage and a reference voltage;

an N-type metal-oxide-semiconductor (NMOS) driver circuit, including an n-type field effect transistor, communicatively coupled to output of the first error amplifier;

a feedback circuit communicatively coupled between the NMOS driver circuit and an input of the first error amplifier to provide the feedback voltage;

a pump circuit configured to pump current into a gate node of the NMOS driver circuit, wherein an amount of the current is based upon a size of a voltage spike above the reference voltage on an output of the NMOS driver circuit;

a first delay buffer; and

a second delay buffer of a different length than the first delay buffer;

wherein:

a difference between trip voltage of the first delay buffer and the second delay buffer is configured to define a trip voltage for the voltage spike above the reference voltage;

the first delay buffer and the second delay buffer both receive input from a same source; and

the second delay buffer is configured to drive a gate of the pump circuit to pump current into the gate node of the NMOS driver circuit.

13. The microcontroller of claim 12 , further comprising the pump circuit configured to pump current into the gate node of the NMOS driver circuit upon a transient voltage drop at the output of the NMOS driver circuit.

14. The microcontroller of claim 12 , further comprising a discharge circuit configured to discharge the gate node of the NMOS driver circuit upon a transient voltage overshoot at the output of the NMOS driver circuit.

15. The microcontroller of claim 12 , further comprising a load connected to output of the NMOS driver circuit, the output of the NMOS driver circuit configured to provide power to the load, the load without a load capacitor connected in parallel between ground and a connection between the output of the NMOS driver circuit and the load.

16. The microcontroller of claim 12 , further comprising a buffer circuit communicatively coupled to the output of the NMOS driver circuit and configured to signal to a discharge circuit configured to discharge the gate node of the NMOS driver circuit upon a transient voltage overshoot.

17. The microcontroller of claim 16 , wherein the buffer circuit includes a plurality of inverters with a trip voltage corresponding to the transient voltage overshoot.

18. The microcontroller of claim 12 , further comprising a buffer circuit communicatively coupled to the output of the NMOS driver circuit and configured to signal to the pump circuit configured to pump current into the gate node of the NMOS driver circuit upon a transient voltage drop.

19. The microcontroller of claim 18 , wherein the buffer circuit includes a plurality of inverters.

20. The microcontroller of claim 12 , further comprising the pump circuit configured to pump increased current into the gate node of the NMOS driver circuit based upon an increased load applied to the output of the NMOS driver circuit.

21. A method, comprising:

through a first error amplifier, amplifying a difference between a feedback voltage and a reference voltage;

communicatively coupling an N-type metal-oxide-semiconductor (NMOS) driver circuit, including an n-type field effect transistor, to output of the first error amplifier;

providing a feedback circuit communicatively coupled between the NMOS driver circuit and an input of the first error amplifier to provide the feedback voltage;

pumping current into a gate node of the NMOS driver circuit, wherein an amount of the current is based upon a size of a voltage spike above the reference voltage on an output of the NMOS driver circuit; and

evaluating a trip voltage defined by a first delay buffer and a second delay buffer of a different length than the first delay buffer, wherein:

a difference between trip voltage of the first delay buffer and the second delay buffer is configured to define the trip voltage for the voltage spike above the reference voltage;

the first delay buffer and the second delay buffer both receive input from a same source; and

the second delay buffer drives a gate of the pump circuit to pump current into the gate node of the NMOS driver circuit.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059357/0823 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059264/0384 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058214/0380 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0238 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2017
From: MURUKUMPET, RAGHUVEER; BARTLING, JAMES
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 043852/0397 →
Continuity (1)
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