IP Library › Granted Patent US 10,114,657
Granted Patent B2
US 10,114,657 · App. 15/874,165 · Granted Oct 30, 2018

Memory interface initialization with processor in reset

Inventors: Dean Mitcham Jenkins (La Canada-Flintridge, CA); Dale C. Main (La Canada-Flintridge, CA)
Assignee: Western Digital Technologies, Inc.
G06F9/4408G06F3/065G06F3/0619G06F3/0625G06F3/0679G06F9/4403G06F2206/1014
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Quick Facts
Patent No.
US 10,114,657
App. No.
15/874,165
Granted
Oct 30, 2018
Kind
B2
Abstract

A device comprises control circuitry including a processor, a memory interface, memory interface initialization circuitry, and non-volatile storage storing initialization parameters for initializing the memory interface. The control circuitry is configured to, while the processor is held in reset, initialize the memory interface using the initialization parameters and the memory interface initialization circuitry, after the memory interface has been initialized, receive instructions from a non-volatile memory module over the memory interface, and, after the processor has been released from reset, execute the instructions using the processor.

Claims (49)

1. A device comprising:

control circuitry comprising:

a processor;

a memory interface;

memory interface initialization circuitry; and

non-volatile storage storing initialization parameters for initializing the memory interface;

wherein the control circuitry is configured to:

while the processor is held in reset, initialize the memory interface using the initialization parameters and the memory interface initialization circuitry;

after the memory interface has been initialized, receive instructions from a non-volatile memory module over the memory interface; and

after the processor has been released from reset, execute the instructions using the processor.

2. The device of claim 1 , wherein the control circuitry is further configured to, while the processor is held in reset, train the memory interface using the initialization parameters and the memory interface initialization circuitry.

3. The device of claim 1 , wherein the memory interface initialization circuitry comprises state machine circuitry.

4. The device of claim 1 , wherein the non-volatile storage comprises one-time programmable data storage.

5. The device of claim 4 , wherein the one-time programmable data storage comprises a plurality of hardware registers.

6. The device of claim 1 , wherein the control circuitry comprises an application-specific integrated circuit (ASIC).

7. The device of claim 1 , wherein the memory interface initialization circuitry comprises a field-programmable gate array.

8. The device of claim 1 , wherein the initialization parameters indicate characteristics of a data transmission path that couples the memory interface initialization circuitry to the non-volatile memory module.

9. The device of claim 8 , wherein the data transmission path is associated with a printed circuit board on which the control circuitry and the non-volatile memory module are mounted.

10. The device of claim 1 , wherein the initialization parameters indicate characteristics of the non-volatile memory module.

11. The device of claim 1 , wherein:

the control circuitry is further configured to, while the processor is held in reset, read bootstrap option data; and

said initializing the memory interface is based at least in part on the bootstrap option data.

12. A method of executing instructions in a device, the method comprising:

while a processor of a device is held in reset:

accessing initialization parameters stored in non-volatile storage of the device;

providing the initialization parameters to memory interface initialization circuitry; and

initializing a memory interface of the device using the initialization parameters and the memory interface initialization circuitry;

after the memory interface has been initialized, receiving instructions from a non-volatile memory module over the memory interface; and

after the processor has been released from reset, executing the instructions using the processor.

13. The method of claim 12 , wherein the memory interface is a double data rate (DDR) interface.

14. The method of claim 12 , wherein the non-volatile storage comprises one or more hardware registers.

15. The method of claim 14 , wherein the one or more hardware registers comprise one or more fuses burned during a manufacturing process.

16. The method of claim 12 , further comprising, while the processor is held in reset, reading bootstrap option data, wherein said initializing the memory interface is based at least in part on the bootstrap option data.

17. The method of claim 12 , further comprising, while the processor is held in reset, training the memory interface using the initialization parameters and the memory interface initialization circuitry.

18. The method of claim 12 , wherein the memory interface initialization circuitry comprises state machine circuitry.

19. The method of claim 12 , wherein:

the initialization parameters indicate characteristics of a data transmission path that couples the memory interface initialization circuitry to the non-volatile memory module; and

the data transmission path is associated with a board on which the memory interface is mounted.

20. A data storage device comprising:

a non-volatile memory module; and

control circuitry comprising:

a processor;

a memory interface;

memory interface initialization circuitry; and

non-volatile storage storing initialization parameters for initializing the memory interface;

wherein the control circuitry is configured to:

while the processor is held in reset, initialize the memory interface using the initialization parameters and the memory interface initialization circuitry;

after the memory interface has been initialized, receive instructions from the non-volatile memory module over the memory interface; and

after the processor has been released from reset, execute the instructions using the processor.

Assignments (9)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
Continuity (2)
Continuation 14675531 · Mar 31, 2015
Related Publication 20180143841A1 · May 24, 2018
Cited By (1)
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