IP Library Granted Patent US 10,109,325
Granted Patent B2
US 10,109,325 · App. 15/878,121 · Granted Oct 23, 2018

Interconnections for 3D memory

Inventor: Toru Tanzawa (Tokyo, JP)
Assignee: Micron Technology, Inc.
G11C5/063G11C5/02G11C5/06G11C7/12G11C7/222G11C16/10G11C16/26H01L27/11524H01L27/11529H01L27/11551G11C16/0483G11C16/08G11C16/16
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Quick Facts
Patent No.
US 10,109,325
App. No.
15/878,121
Granted
Oct 23, 2018
Kind
B2
Abstract

Apparatuses and methods for interconnections for 3D memory are provided. One example apparatus can include a stack of materials including a plurality of pairs of materials, each pair of materials including a conductive line formed over an insulation material. The stack of materials has a stair step structure formed at one edge extending in a first direction. Each stair step includes one of the pairs of materials. A first interconnection is coupled to the conductive line of a stair step, the first interconnection extending in a second direction substantially perpendicular to a first surface of the stair step.

Claims (31)

1. An apparatus, comprising:

a memory array including a plurality of access lines;

an equalization circuit coupled to the array; and

a controller coupled to the memory array, wherein the controller is configured to:

cause a first voltage to be applied to a selected one of the access lines;

cause a second voltage to be applied to a non-selected one of the access lines;

disable the equalization circuit while performing a program operation;

cause the selected one of the access lines and the non-selected one of the access lines to be discharged to an equalization potential subsequent to performance of a program operation; and

enable the equalization circuit while discharging the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

2. The apparatus of claim 1 , wherein the controller is further configured to cause the selected one of the access lines and the non-selected one of the access lines to be discharged to a ground reference potential subsequent to discharge of the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

3. The apparatus of claim 1 , wherein the equalization potential is different than a ground reference potential.

4. The apparatus of claim 1 , further comprising:

a first global control line coupled to the selected access line; and

a second global control line coupled to the non-selected access line, wherein the controller is configured to cause the first global control line and the second global control line to be discharged to an equalization potential subsequent to performance of the program operation.

5. The apparatus of claim 1 , further comprising:

a first global control line coupled to the selected access line; and

a second global control line coupled to the non-selected access line, wherein the controller is configured to cause the first global control line and the second global control line to be discharged to a potential different than the equalization potential discharge of the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

6. A method, comprising:

performing a program operation on a memory array including a string of memory cells and control lines coupled to the string and comprising:

disabling an equalization circuit coupled to the control lines and the string;

providing a first voltage level to a selected one of the control lines,

providing a second voltage level to a non-selected one of the control lines, the second voltage level being higher than the first voltage level;

after performing the program operation:

providing a third voltage level to the selected one of the control lines, wherein the third voltage level is higher than a ground reference potential; and

enabling the equalization circuit such that the selected one of the control lines is coupled to the non-selected one of the control lines.

7. The method of claim 6 , wherein the control lines comprise global control lines, local control lines, or combinations thereof.

8. The method of claim 6 , comprising after performing the program operation, controlling the selected one of the control lines and the non-selected one of the control lines to be substantially equal to the ground reference potential.

9. The method of claim 6 , comprising:

after performing the program operation, providing a fourth voltage level to the non-selected one of the control lines; and

after providing the fourth voltage level to the non-selected one of the control lines, discharging the selected one of the control lines and the non-selected one of the control lines to the ground reference potential.

10. The method of claim 6 , comprising discharging the selected one the control lines to the ground reference potential after providing the third voltage level to the selected one of the control lines.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 7 TO PATENT SECURITY AGREEMENT Recorded Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2018
From: TANZAWA, TORU
To: MICRON TECHNOLOGY, INC.
Reel/Frame 044705/0011 →
Continuity (5)
Continuation 15692512 · Aug 31, 2017
Continuation 15164400 · May 25, 2016
Continuation 14813711 · Jul 30, 2015
Division 13774522 · Feb 22, 2013
Related Publication 20180151201A1 · May 31, 2018