Non-volatile flash memory cell
A method for manufacturing a flash memory device on a substrate may include: preparing the substrate with shallow trench isolation to define active sections; depositing a floating gate oxide layer on the prepared substrate; depositing a floating gate polysilicon layer on the floating gate oxide layer; polishing the floating gate polysilicon layer to isolate a plurality of floating gates above the active sections of the substrate; depositing a silicon nitride layer on top of the plurality of floating gates; patterning and etching the silicon nitride layer to create silicon nitride features; depositing a set of oxide spacers along sides of the silicon nitride features; implanting a source junction into the substrate beneath the individual floating gates; removing the floating gate polysilicon layer except where beneath individual oxide spacers, then removing the set of oxide spacers; depositing an inter-poly layer on top of the remaining floating gates; depositing a second polysilicon layer on top of the inter-poly layer; and patterning and etching the second polysilicon layer to separate the second polysilicon layer into word line devices and erase gates.
1. A method for manufacturing a flash memory device on a substrate, the method comprising:
preparing the substrate with shallow trench isolation to define and separate active sections;
depositing a floating gate oxide layer on the prepared substrate;
depositing a floating gate polysilicon layer on the floating gate oxide layer;
polishing the floating gate polysilicon layer to isolate a pair of floating gate structures above the active sections of the substrate;
depositing a silicon nitride layer on top of the floating gate structures;
patterning and etching the silicon nitride layer to create silicon nitride features;
depositing oxide sidewall spacers on lateral sidewalls of the silicon nitride features, each oxide sidewall spacer having a lateral width;
implanting a source junction into the substrate between the floating gate structures;
removing portions of the floating gate polysilicon layer except for areas beneath the oxide sidewall spacers, thereby defining a vertically elongated floating gate under each oxide sidewall spacer, each vertically elongated floating gate having a lateral width corresponding to the lateral width of the oxide sidewall spacer over that vertically elongated floating gate;
removing the oxide sidewall spacers;
depositing an inter-poly layer on top of the vertically elongated floating gates;
depositing a second polysilicon layer on top of the inter-poly layer; and
patterning and etching the second polysilicon layer to separate the second polysilicon layer into word line devices and erase gates.
2. A method according to claim 1 , wherein patterning and etching the silicon nitride layer includes:
depositing a photoresist layer on the silicon nitride layer;
patterning the photoresist layer; and
etching the silicon nitride layer where exposed by the photoresist layer.
3. A method according to claim 1 , wherein each oxide spacer has a dimension of about 120 nanometers.
4. A method according to claim 1 , wherein each vertically elongated floating gates has a dimension of about 120 nanometers.
5. A method according to claim 1 , wherein the second polysilicon layer has a thickness greater than one half times a distance between the pair of vertically elongated floating gates.
6. A method according to claim 1 , wherein a distance between the pair of vertically elongated floating gates is approximately 390 nanometers.
7. A method according to claim 1 , wherein the word line devices have a dimension of approximately 0.18 micrometers.
8. A method according to claim 1 , wherein a gap between the word line devices and the erase gate is approximately 0.04 micrometers.
9. A flash memory device comprising:
a substrate with shallow trench isolation defining and separating active sections;
a floating gate oxide layer disposed on the substrate;
a pair of floating gates above the active sections of the substrate, each floating gate being elongated in a vertical direction such that a vertical dimension of each floating gate from a bottom end of the floating gate to a top end of the floating gate is greater than a horizontal dimension of that floating gate;
a source junction implanted into the substrate between the pair of floating gates;
an inter-poly layer extending over the top end of each of the pair of floating gates; and
a second polysilicon layer on top of the inter-poly layer, patterned and etched to separate the second polysilicon layer into an erase gate structure located laterally between a pair of word line structures, wherein the erase gate structure extends laterally between the pair of floating gates, and wherein the pair of word line structures and the erase gate structure are physically separated from the pair of floating gates by the inter-poly layer.
10. A flash memory device according to claim 9 , wherein each of the floating gates has a dimension of about 120 nanometers.
11. A flash memory device according to claim 9 , wherein the second polysilicon layer has a thickness greater than one half times a distance between the pair of floating gates.
12. A flash memory device according to claim 9 , wherein a distance between the pair of floating gates is approximately 390 nanometers.
13. A flash memory device according to claim 9 , wherein each of the pair of word line structures has a dimension of approximately 0.18 micrometers.
14. A flash memory device according to claim 9 , wherein a gap between each of the pair of word line structure and the erase gate structure located laterally between the pair of word line structures is approximately 0.04 micrometers.