IP Library Granted Patent US 10,753,964
Granted Patent B2
US 10,753,964 · App. 15/960,848 · Granted Aug 25, 2020

Current sensing for integrated circuit devices

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Quick Facts
Patent No.
US 10,753,964
App. No.
15/960,848
Granted
Aug 25, 2020
Kind
B2
Abstract

An integrated circuit device for controlling and sensing electrical current is provided. The integrated circuit device comprises a main transistor device, configured for controlling a main current, and a plurality of sensing transistor devices, configured for controlling a combined sensing current. The main transistor device and the plurality of sensing transistor devices are connected to a common gate node. The on-state resistance of the main transistor device is lower than a combined on-state resistance of the plurality of sensing transistor devices. The sensing transistor devices are distributed throughout at least a section of the integrated circuit to reduce an influence of at least one local property of the integrated circuit device on the combined sensing current.

Claims (39)

1. An integrated circuit device for controlling and sensing electrical current, the integrated circuit device comprising

a main transistor device, configured for controlling a main current; and

a plurality of sensing transistor devices, configured for controlling a combined sensing current; wherein

the main transistor device and the plurality of sensing transistor devices are connected to a common gate node;

the on-state resistance of the main transistor device being lower than a combined on-state resistance of the plurality of sensing transistor devices;

the sensing transistor devices are distributed throughout at least a section of the integrated circuit;

the plurality of sensing transistor devices are connected in parallel to each other, so that a common sensing drain node and a common sensing source node are provided, wherein the common sensing drain node is connected to a main drain node of the main transistor device; and wherein

the common sensing source node is configured as a first kelvin voltage sensing node and the integrated circuit further comprising a voltage drive circuit configured to set a measurement voltage between the first kelvin voltage sensing node and the common sensing drain node to a voltage across the main transistor device.

2. The integrated circuit device of claim 1 , wherein the main transistor device is arranged in a transistor section of the integrated circuit device and the sensing transistor devices are distributed throughout at least the transistor portion.

3. The integrated circuit device of claim 2 , wherein the sensing transistor devices are distributed evenly throughout at least the transistor section.

4. The integrated circuit device of claim 2 , wherein the sensing transistor devices are equally spaced throughout at least the transistor section.

5. The integrated circuit device of claim 1 , wherein the transistor section comprises a plurality of elementary transistors and wherein at least a first subset of the elementary transistors form the main transistor device and a plurality of second subsets of the elementary transistors form the plurality of sensing transistor devices.

6. The integrated circuit device of claim 1 , wherein a sense ratio of an on-state resistance of the main transistor device to an on-state resistance of the plurality of sensing transistor devices is between 1:1000 and 1:10000.

7. The integrated circuit device of claim 1 , comprising more than two sensing transistor devices.

8. The integrated circuit device of claim 1 , wherein the main transistor device and the plurality of sensing transistor devices are connected to one or more of a common drain, a common source, and a main power source.

9. The integrated circuit device of claim 1 , further comprising a voltage drive circuit configured to set a measurement voltage across the plurality of sensing transistor devices to a voltage across the main transistor device.

10. The integrated circuit device of claim 1 , wherein the main transistor device comprises a main source node, said main source node being configured as a second kelvin voltage sensing node and the voltage drive circuit being configured to set the measurement voltage to a voltage between the second kelvin sensing node and the main drain node.

11. The integrated circuit device of claim 1 , further comprising a measurement circuit, wherein the measurement circuit is configured for determining the combined sensing current.

12. The integrated circuit device of claim 11 , wherein the measurement circuit is further configured to determine the main current from the combined sensing current and a predefined sense ratio.

13. A method for current measurement in an integrated circuit device, the integrated circuit device comprising a main transistor device and a plurality of sensing transistor devices, the plurality of sensing transistor devices being distributed throughout at least a section of the integrated circuit, the main transistor device and the plurality of sensing transistor devices being connected to a common gate node; the plurality of sensing transistor devices are connected in parallel to each other, so that a common sensing drain node and a common sensing source node are provided, wherein the common sensing drain node is connected to a main drain node of the main transistor device; and the common sensing source node is configured as a first kelvin voltage sensing node; wherein

a main current is applied to the main transistor device;

a measurement voltage between the first kelvin voltage sensing node and the common sensing drain node is set to a voltage across the main transistor device;

a combined sensing current, flowing through the plurality of sensing transistor devices is determined; and

the main current is calculated from the combined sensing current and a predefined sense ratio.

14. The method of claim 13 , wherein before the combined sensing current is determined, a measurement voltage across the plurality of sensing transistor devices is set to a voltage across the main transistor device.

15. An integrated circuit device for controlling and sensing electrical current, the integrated circuit device comprising

a main transistor device, configured for controlling a main current; and

a plurality of sensing transistor devices, configured for controlling a combined sensing current; wherein

the main transistor device and the plurality of sensing transistor devices are connected to a common gate node;

the on-state resistance of the main transistor device being lower than a combined on-state resistance of the plurality of sensing transistor devices;

the sensing transistor devices are distributed throughout at least a section of the integrated circuit;

the plurality of sensing transistor devices are connected in parallel to each other, so that a common sensing drain node and a common sensing source node are provided, wherein the common sensing source node is connected to a main source node of the main transistor device; and wherein

the common sensing drain node is configured as a first kelvin voltage sensing node and the integrated circuit further comprising a voltage drive circuit configured to set a measurement voltage between the first kelvin voltage sensing node and the common sensing source node to a voltage across the main transistor device.

16. The integrated circuit device of claim 15 , wherein the main transistor device comprises a main drain node, said main drain node being configured as a second kelvin voltage sensing node and the voltage drive circuit being configured to set the measurement voltage to a voltage between the second kelvin sensing node and the main source node.

17. A method for current measurement in an integrated circuit device, the integrated circuit device comprising a main transistor device and a plurality of sensing transistor devices, the plurality of sensing transistor devices being distributed throughout at least a section of the integrated circuit, the main transistor device and the plurality of sensing transistor devices being connected to a common gate node; the plurality of sensing transistor devices are connected in parallel to each other, so that a common sensing drain node and a common sensing source node are provided, wherein the common sensing source node is connected to a main source node of the main transistor device; and the common sensing drain node is configured as a first kelvin voltage sensing node; wherein

a main current is applied to the main transistor device;

a measurement voltage between the first kelvin voltage sensing node and the common sensing source node is set to a voltage across the main transistor device;

a combined sensing current, flowing through the plurality of sensing transistor devices is determined; and

the main current is calculated from the combined sensing current and a predefined sense ratio.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059357/0823 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059264/0384 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058214/0380 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0238 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2018
From: DIX, GREG; DEVAL, PHILIPPE
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 046008/0648 →