IP Library Granted Patent US 10,747,404
Granted Patent B2
US 10,747,404 · App. 16/165,241 · Granted Aug 18, 2020

Touchscreen including tactile feedback structures and corresponding virtual user interface elements

Inventors: William J. Liddell (Petersfield, GB); Samuel Brunet (Fareham, GB)
Assignee: MICROCHIP TECHNOLOGY INCORPORATED
G06F3/0482G06F3/016G06F3/03547G06F3/048G06F3/0484G06F3/0488G06F3/04847G06F3/04883G06F3/04886G06F2203/04809
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Quick Facts
Patent No.
US 10,747,404
App. No.
16/165,241
Granted
Aug 18, 2020
Kind
B2
Abstract

A touch-sensitive touchscreen system may include a touchscreen cover layer, and a tactile structure formed in or coupled to the touchscreen cover layer and defining a non-planar surface texture (e.g., embodied as a ridge or other raised structure or a groove or other depression) that provides tactile feedback to a user's finger. In some embodiments, the tactile structure is formed from at least one material having a different dielectric constant than the touchscreen cover layer. A touchscreen display device arranged under the touchscreen cover may be configured to display a configurable graphical user interface (GUI) including a respective virtual user interface element at a location corresponding with the tactile structure. The system may include a processing unit configured to sense a touch at a location of a particular virtual user interface element, identify the particular virtual user interface element, and initiate an action associated with the virtual user interface element.

Claims (35)

1. A user interface system, comprising: a touchscreen cover layer having an upper surface;

a tactile structure formed in or coupled to the touchscreen cover layer, the tactile structure comprising a raised structure extending upwardly from the upper surface of the touchscreen cover layer or a depressed structure extending downwardly from the upper surface of the touchscreen cover layer, and having an upper surface non-planar with the upper surface of the touchscreen cover layer and defining a surface texture that provides tactile feedback to a user's finger;

wherein both the upper surface of the touchscreen cover layer and the upper surface of the tactile structure are outer surfaces touchable by the user's finger;

wherein the touchscreen cover layer is formed from a first material having a first dielectric constant and the tactile structure is formed from at least one second material having a different dielectric constant than the first dielectric constant of the first material of the touchscreen cover layer;

a touchscreen display device arranged under the touchscreen cover and configured to display a configurable graphical user interface (GUI) including a respective virtual user interface element at a location corresponding with the tactile structure; and

a processor configured to sense a touch at a location of a particular virtual user interface element, identify the particular virtual user interface element, and initiate an action associated with the virtual user interface element.

2. The user interface system of claim 1 , wherein the processor is embodied in a microcontroller.

3. The user interface system of claim 1 , wherein:

the touchscreen cover layer is formed from a first material having a first dielectric constant; and

the tactile structure is formed from at least one second material having a higher dielectric constant than the first dielectric constant of the first material of the touchscreen cover layer.

4. The user interface system of claim 1 , wherein:

the touchscreen cover layer is formed from a first material having a first dielectric constant; and

the tactile structure is formed from at least one second material having a lower dielectric constant than the first dielectric constant of the first material of the touchscreen cover layer.

5. The user interface system of claim 1 , wherein the tactile structure formed in or coupled to the touchscreen cover layer is formed from at least one two different materials having different dielectric constants.

6. The user interface system of claim 1 , wherein the tactile structure comprises a raised ridge or a depressed groove.

7. A touchscreen system, comprising:

a touchscreen cover layer having an upper surface, the touchscreen cover layer formed from a first material having a dielectric constant; and

a tactile structure coupled to the touchscreen cover layer, the tactile structure comprising a raised structure extending upwardly from the upper surface of the touchscreen cover layer

or a depressed structure extending downwardly from the upper surface of the touchscreen cover layer, and having an upper surface non-planar with the upper surface of the touchscreen cover layer to define a non-planar surface texture, wherein the tactile structure is formed from at least one second material having a different dielectric constant than the first material of the touchscreen cover layers

wherein both the upper surface of the touchscreen cover layer and the upper surface of the tactile structure are outer surfaces touchable by a user's finger.

8. The touchscreen system of claim 7 , further comprising a capacitivesensor arranged under the touchscreen cover layer and configured to detect touches on the tactile structure and touches on other areas of the touchscreen cover layer.

9. The touchscreen system of claim 7 , further comprising a touchscreen display element under the touchscreen cover layer and configured to display a graphical user interface including a virtual user interface element at a location corresponding with the tactile structure.

10. The touchscreen system of claim 7 , further comprising a touchscreen display element under the touchscreen cover layer and configured to display a graphical user interface including a virtual widget at a location corresponding with the tactile structure.

11. The touchscreen system of claim 7 , wherein the tactile structure is formed from at least one second material having a higher dielectric constant than the first material of the touchscreen cover layer.

12. The touchscreen system of claim 7 , wherein the tactile structure is formed from at least one two different materials having different dielectric constants.

13. The touchscreen system of claim 7 , wherein the tactile structure defines a ridge or bump.

14. The touchscreen system of claim 7 , wherein the tactile structure comprises a raised ridge or a depressed groove.

15. A user interface system, comprising:

a touchscreen cover layer having an upper surface, the touchscreen cover layer formed from a first material having a first dielectric constant;

a tactile structure coupled to the touchscreen cover layer, the tactile structure comprising a raised structure extending upwardly from the upper surface of the touchscreen cover layer

or a depressed structure extending downwardly from the upper surface of the touchscreen cover layer, and having an upper surface non-planar with the upper surface of the touchscreen cover layer to define a non-planar surface texture, wherein both the upper surface of the touchscreen cover layer and the upper surface of the tactile structure are outer surfaces touchable by a user's finger, and wherein the tactile structure is formed from at least one second material having a different dielectric constant than the first dielectric constant of the first material of the touchscreen cover layer;

touchscreen display element under the touchscreen cover layer and configured to display a graphical user interface (GUI) including a virtual user interface element at a location corresponding with the tactile structure; and

a processor configured to identify a touch at a location of the virtual user interface element, identify the virtual user interface element, and initiate an action associated with the virtual user interface element.

16. The user interface system of claim 15 , wherein the processor is embodied in a microcontroller.

17. The user interface system of claim 15 , wherein the tactile structure comprises a raised ridge or a depressed groove.

Assignments (16)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059357/0823 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059264/0384 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058214/0380 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0238 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2018
From: LIDDELL, WILLIAM J.; BRUNET, SAMUEL
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 047234/0836 →
Cited By (7)
US 1,103,209 US 1,108,494 US 1,109,772 US 1,113,977 US 1,118,688 US 1,118,689 US 12,472,814