IP Library Granted Patent US 10,705,651
Granted Patent B2
US 10,705,651 · App. 16/541,473 · Granted Jul 7, 2020

Touch sensor and associated control method for decreased capacitive loads

Inventors: Samuel Brunet (Hampshire, GB); Richard P. Collins (Hampshire, GB); Martin J. Simmons (Hampshire, GB); Justin A. Church (Hampshire, GB)
Assignee: Atmel Corporation
G06F3/0416G06F3/044G06F3/047G06F2203/04107G06F2203/04111G06F2203/04112
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Quick Facts
Patent No.
US 10,705,651
App. No.
16/541,473
Granted
Jul 7, 2020
Kind
B2
Abstract

A device includes a controller coupled to a touch sensor. The touch sensor includes a first array of capacitive nodes substantially aligned with a second array of capacitive nodes in a mechanical stack. The controller is configured, when in a self-capacitive mode of operation, to send a first drive signal to a plurality of the electrodes of the first array, send a shield signal to at least a portion of the electrodes of the second array at the same time as the first drive signal is sent to the plurality of electrodes of the first array, and sense touch inputs based on signals received from the plurality of electrodes of the first array while the first drive signal is being sent to the plurality of electrodes of the first array and the shield signal is being sent to the at least a portion of the electrodes of the second array.

Claims (53)

1. A device, comprising:

a touch sensor comprising:

a first array comprising a first plurality of electrodes;

a second array comprising a second plurality of electrodes;

wherein the first plurality of electrodes of the first array are substantially aligned with the second plurality of electrodes of the second array in a mechanical stack; and

a controller coupled to the touch sensor, the controller comprising logic configured, when executed, to cause the controller to:

send a first signal to at least a portion of the first plurality of electrodes of the first array;

send a second signal to at least a portion of the second plurality of electrodes of the second array; and

sense touch inputs based on signals received from one or more of the following:

one or more electrodes of the first plurality of electrodes of the first array; and

one or more electrodes of the second plurality of electrodes of the second array;

wherein the alignment of the first plurality of electrodes of the first array and the second plurality of electrodes of the second array forms a plurality of crossover regions, each crossover region comprising a first portion, a second portion, and a third portion of the first array, each respective portion of the first array in the crossover region electrically uncoupled from the other respective portion of the first array in the crossover region.

2. The device of claim 1 , wherein the controller is configured to operate in a mutual-capacitive sensing mode.

3. The device of claim 1 , wherein:

each crossover region further comprises a first portion, a second portion, and a third portion of the second array; and

each respective portion of the second array in the crossover region is electrically uncoupled from the other respective portions of the second array in the crossover region.

4. The device of claim 1 , wherein the first signal is a drive signal and the second signal is the same drive signal as the first signal.

5. The device of claim 1 , wherein the third portion of the first array is coupled to a portion of the second array.

6. The device of claim 1 , wherein the electrodes of the first array and the electrodes of the second array are composed of a conductive mesh.

7. The device of claim 1 , wherein the electrodes of the first array and the electrodes of the second array are composed of indium tin oxide (ITO).

8. A touch sensor controller comprising logic configured, when executed by the touch sensor controller, to:

send a first signal to at least a portion of a first plurality of electrodes of a first array of a touch sensor;

send a second signal to at least a portion of a second plurality of electrodes of a second array of the touch sensor; and

sense touch inputs based on signals received from one or more of the following:

one or more electrodes of the first plurality of electrodes of the first array; and

one or more electrodes of the second plurality of electrodes of the second array;

wherein:

the first plurality of electrodes of the first array are substantially aligned with the second plurality of electrodes of the second array in a mechanical stack; and

the alignment of the first plurality of electrodes of the first array and the second plurality of electrodes of the second array forms a plurality of crossover regions, each crossover region comprising a first portion, a second portion, and a third portion of the first array, each respective portion of the first array in the crossover region electrically uncoupled from the other respective portion of the first array in the crossover region.

9. The touch sensor controller of claim 8 , wherein the touch sensor controller is configured to operate in a mutual-capacitive sensing mode.

10. The touch sensor controller of claim 8 , wherein:

each crossover region further comprising a first portion, a second portion, and a third portion of the second array; and

each respective portion of the second array in the crossover region is electrically uncoupled from the other respective portions of the second array in the crossover region.

11. The touch sensor controller of claim 8 , wherein the first signal is a drive signal and the second signal is the same drive signal as the first signal.

12. The touch sensor controller of claim 8 , wherein the third portion of the first array is coupled to a portion of the second array.

13. The touch sensor controller of claim 8 , wherein the electrodes of the first array and the electrodes of the second array are composed of a conductive mesh.

14. The touch sensor controller of claim 8 , wherein the electrodes of the first array and the electrodes of the second array are composed of indium tin oxide (ITO).

15. A method, comprising:

sending a first signal to at least a portion of a first plurality of electrodes of a first array of a touch sensor;

sending a second signal to at least a portion of a second plurality of electrodes of a second array of the touch sensor; and

sensing touch inputs based on signals received from one or more of the following:

one or more electrodes of the first plurality of electrodes of the first array; and

one or more electrodes of the second plurality of electrodes of the second array;

wherein:

the first plurality of electrodes of the first array are substantially aligned with the second plurality of electrodes of the second array in a mechanical stack; and

the alignment of the first plurality of electrodes of the first array and the second plurality of electrodes of the second array forms a plurality of crossover regions, each crossover region comprising a first portion, a second portion, and a third portion of the first array, each respective portion of the first array in the crossover region electrically uncoupled from the other respective portion of the first array in the crossover region.

16. The method of claim 15 , wherein:

each crossover region further comprising a first portion, a second portion, and a third portion of the second array; and

each respective portion of the second array in the crossover region is electrically uncoupled from the other respective portions of the second array in the crossover region.

17. The method of claim 15 , wherein the first signal is a drive signal and the second signal is the same drive signal as the first signal.

18. The touch sensor controller of claim 15 , wherein the third portion of the first array is coupled to a portion of the second array.

19. The method of claim 15 , wherein the electrodes of the first array and the electrodes of the second array are composed of a conductive mesh.

20. The method of claim 15 , wherein the electrodes of the first array and the electrodes of the second array are composed of indium tin oxide (ITO).

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059357/0823 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059264/0384 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0238 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058214/0380 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2019
From: BRUNET, SAMUEL; COLLINS, RICHARD P.; SIMMONS, MARTIN J.; CHURCH, JUSTIN A.
To: ATMEL TECHNOLOGIES U.K. LIMITED
Reel/Frame 050062/0712 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2019
From: ATMEL TECHNOLOGIES U.K. LIMITED
To: ATMEL CORPORATION
Reel/Frame 050062/0672 →