IP Library Granted Patent US 10,650,893
Granted Patent B2
US 10,650,893 · App. 16/550,248 · Granted May 12, 2020

Adjustable current sink to draw compensation current from high voltage generation circuitry during programming operation of analog neural memory in deep learning artificial neural network

Inventors: Hieu Van Tran (San Jose, CA); Thuan Vu (San Jose, CA); Stanley Hong (San Jose, CA); Anh Ly (San Jose, CA); Vipin Tiwari (Dublin, CA); Nhan Do (Saratoga, CA)
Assignee: SILICON STORAGE TECHNOLOGY, INC.
G11C16/0425G06N3/08H01L27/11521H01L29/7883H01L29/7885
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,650,893
App. No.
16/550,248
Granted
May 12, 2020
Kind
B2
Abstract

Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. Different calibration algorithms and systems are also disclosed. Compensation measures are utilized to compensate for changes in voltage or current as the number of cells being programmed changes.

Claims (42)

1. A system for compensating for changes in current applied to a memory array during a programming operation, the system comprising:

an array of non-volatile memory cells;

a high voltage generator for generating a high voltage;

a high voltage buffer for receiving the high voltage from the high voltage generator and outputting the high voltage;

a high voltage decoder for receiving the high voltage from the high voltage buffer and applying the high voltage to a selected set of the non-volatile memory cells in the array during a programming operation; and

an adjustable current sink coupled to the high voltage buffer for drawing a compensation current, wherein the adjustable current sink is adjusted to alter the compensation current when the load on the high voltage buffer changes.

2. The system of claim 1 , wherein the compensation current is proportional to the number of cells to be programmed.

3. The system of claim 1 , wherein the memory array is a vector-by-matrix multiplication array.

4. The system of claim 2 , wherein the memory array is a vector-by-matrix multiplication array.

5. The system of claim 1 , wherein the non-volatile memory cells are split-gate flash memory cells.

6. A method for compensating for changes in current applied to an array of non-volatile memory cells during a programming operation, the method comprising:

generating, by a high voltage generator, a high voltage;

receiving, by a high voltage buffer, the high voltage from the high voltage generator;

receiving, by a high voltage decoder, the high voltage from the high voltage buffer;

applying, by the high voltage decoder, the high voltage to a selected set of non-volatile memory cells in the array during a programming operation;

configuring an adjustable current sink to draw a compensation current in proportion to a load on the high voltage buffer; and

drawing, by the adjustable current sink, the compensation current from the high voltage buffer.

7. The method of claim 6 , wherein the load is proportional to the number of cells to be programmed.

8. The method of claim 6 , wherein the array is a vector-by-matrix multiplication array.

9. The system of claim 7 , wherein the array is a vector-by-matrix multiplication array.

10. The system of claim 6 , wherein the non-volatile memory cells are split-gate flash memory cells.

11. A system for compensating for changes in current applied to a memory array during a programming operation, the system comprising:

an array of non-volatile memory cells;

a high voltage generator for generating a high voltage;

a high voltage buffer for receiving the high voltage from the high voltage generator and outputting the high voltage;

a high voltage decoder for receiving the high voltage from the high voltage buffer and applying the high voltage to a selected set of the non-volatile memory cells in the array during a programming operation; and

an adjustable current sink coupled to the high voltage decoder for drawing a compensation current, wherein the adjustable current sink is adjusted to alter the compensation current when the load on the high voltage decoder changes.

12. The system of claim 11 , wherein the compensation current is proportional to the number of cells to be programmed.

13. The system of claim 11 , wherein the memory array is a vector-by-matrix multiplication array.

14. The system of claim 12 , wherein the memory array is a vector-by-matrix multiplication array.

15. The system of claim 11 , wherein the non-volatile memory cells are split-gate flash memory cells.

16. A method for compensating for changes in current applied to an array of non-volatile memory cells during a programming operation, the method comprising:

generating, by a high voltage generator, a high voltage;

receiving, by a high voltage buffer, the high voltage from the high voltage generator;

receiving, by a high voltage decoder, the high voltage from the high voltage buffer;

applying, by the high voltage decoder, the high voltage to a selected set of non-volatile memory cells in the array during a programming operation;

configuring an adjustable current sink to draw a compensation current in proportion to a load on the high voltage decoder; and

drawing, by the adjustable current sink, the compensation current from the high voltage decoder.

17. The method of claim 16 , wherein the load is proportional to the number of cells to be programmed.

18. The method of claim 16 , wherein the array is a vector-by-matrix multiplication array.

19. The method of claim 17 , wherein the array is a vector-by-matrix multiplication array.

20. The method of claim 16 , wherein the non-volatile memory cells are split-gate flash memory cells.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059357/0823 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059264/0384 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0238 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058214/0380 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →